An apparatus and system for wet processing a substrate, which can be used for chemical processing such as etching or washing a semiconductor substrate are disclosed. The apparatus has a processing chamber in which the substrate is wet processed. Processing liquid is injected into the processing cham
An apparatus and system for wet processing a substrate, which can be used for chemical processing such as etching or washing a semiconductor substrate are disclosed. The apparatus has a processing chamber in which the substrate is wet processed. Processing liquid is injected into the processing chamber through an opening and nozzles, and the substrate is floated in the injected liquid and rotated about its center axis by streams of the injected liquid. The wet processing system is composed from a processing apparatus as mentioned above, a water bearing system which transfers the substrate by means of a water stream, and a spin dryer. The water bearing system also serves as a washing apparatus. Shutters are provided between the water bearing and the processing chamber or the spin dryer, the shutters controlling the water levels between these elements.
대표청구항▼
1. A wet processing apparatus for a planar substrate, said apparatus comprising a processing chamber, wherein said substrate is processed in said processing chamber, said processing chamber comprising a pedestal and a lid which covers said pedestal, said pedestal and lid defining said processing cha
1. A wet processing apparatus for a planar substrate, said apparatus comprising a processing chamber, wherein said substrate is processed in said processing chamber, said processing chamber comprising a pedestal and a lid which covers said pedestal, said pedestal and lid defining said processing chamber therebetween, and a plurality of opening means through which streams of a processing liquid are injected, said substrate being floated and rotated by said streams of processing liquid wherein said opening means comprises: a first opening provided at the center of said pedestal, wherein the processing liquid is injected into said processing chamber through said first opening; a plurality of nozzles positioned around said first opening, wherein said nozzles are inclined with respect to said substrate such that the processing liquid flowing therethrough rotates said substrate; and a trench, through which the processing liquid is supplied to each of said nozzles, said trench having a second opening through which the processing liquid is supplied, and wherein said lid comprises: a third opening through which the processing liquid is injected into said processing chamber; and exhaust openings arranged on the periphery of said lid through which the processing liquid overflows. 2. A wet processing apparatus for a planar substrate according to claim 1, further comprising an O-ring provided at a periphery of said pedestal for sealing said processing chamber when said lid is pressed towards said pedestal. 3. A wet processing apparatus for a planar substrate according to claim 1, further comprising: a tank for storing processing liquid; a pump for pumping said processing liquid from said tank to said first, second and third openings; and a plurality of control valves each controlling respectively the stream of processing liquid supplied to each of said first, second and third opening. 4. A wet processing apparatus for a planar substrate according to claim 3, further including a plurality of flow meters, each flow meter connected to a respective one of said control valves, said flow meters indicating the flow of liquid through the respective said control valves. 5. A wet processing apparatus for a planar substrate according to claim 3, further comprising: a plurality of tanks each storing a different processing liquid, wherein the processing liquid necessary for a particular processing step is switched to said pump; and a switching means for switching said different processing liquids to said pump. 6. A wet processing system for a planar substrate comprising: a processing chamber in which said substrate is wet processed, said processing chamber including openings through which processing liquid is injected, wherein said substrate is floated in the injected liquid and rotated around its center axis by a stream of the injected liquid; a washing means including a water bearing through which said substrate is transferred by a water jet and at the same time is washed; a spin dryer for drying the substrate; a first shutter for separaing the liquid in said washing means from the liquid in said processing chamber; and a second shutter for separating the liquid in said washing means from the liquid in said spin dryer. 7. A wet processing system for a planar substrate according to claim 6, wherein said washing means comprises: at least one water shower for injecting pure water on the surface of said substrate moving along the water bearing. 8. A wet processing system for a planar substrate according to claim 6, wherein said washing means comprises: at least one water inlet arranged at the bottom of said washing means, wherein pure water is supplied into the washing means through said water inlet. 9. A wet processing system for a planar substrate according to claim 6, wherein said washing means comprises: a plurality of nozzles arranged on the bottom of said washing means and inclined toward the direction of movement of the substrate, wherein pure water is injected through said nozzles. 10. A wet processing system for a planar substrate according to claim 6, further comprising: a tank for storing processing liquid; a pump for pumping said processing liquid from said tank; and a plurality of control valves each controlling respectively a stream of processing liquid to the processing chamber. 11. A wet processing system for a planar substrate according to claim 6, further comprising a plurality of tanks each storing a different processing liquid, wherein said pump pumps the processing liquid necessary for a particular processing step.
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이 특허를 인용한 특허 (40)
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