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In a thick film electronic circuit, a plurality of thick film capacitors are deposited on the surface of an insulating substrate. Each capacitor comprises a lower electrode and an upper electrode, which are essentially discrete for each capacitor, while a dielectric layer is deposited unitarily over

In a thick film electronic circuit, a plurality of thick film capacitors are deposited on the surface of an insulating substrate. Each capacitor comprises a lower electrode and an upper electrode, which are essentially discrete for each capacitor, while a dielectric layer is deposited unitarily over each lower electrode and under each upper electrode of the capacitors.

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1. In a thick film printed circuit having a plurality of capacitors each having a dielectric layer lying between conductive layers with each of said layers being formed by thick film techniques, the method of noting the insulative characteristics of several of said capacitors at the same time by ini

1. In a thick film printed circuit having a plurality of capacitors each having a dielectric layer lying between conductive layers with each of said layers being formed by thick film techniques, the method of noting the insulative characteristics of several of said capacitors at the same time by initially forming the dielectric layers of each of the several capacitors in mutual contact and thereafter noting the insulative characteristics of the dielectric layer of one of said several capacitors. 2. The method of claim 1 wherein each of said dielectric layers and conductive layers are formed by printed circuit techniques. 3. The method of claim 1 including a protective glass layer being formed on each of said several capacitors. 4. The method of claim 1 wherein the dielectric layer of each of said several capacitors is formed unitarily from the same material. 5. The method of claim 1 wherein the dielectric layer of at least one of said several capacitors is formed of a material different from that of others of said several capacitors. 6. In a thick film printed circuit having a plurality of capacitors each having a dielectric layer lying between conductive layers with each of said layers being formed by thick film techniques, means for noting the insulative characteristics of several of said capacitors at the same time by initially forming the dielectric layers of each of the several capacitors in mutual contact and thereafter noting the insulative characteristics of the dielectric layer of one of said several capacitors. 7. The product of claim 6, wherein each of said dielectric layers and conductive layers are formed by printed circuit techniques. 8. The product of claim 6 including a protective glass layer being formed over each of said several capacitors. 9. The product of claim 6, wherein the dielectric layer of each of said several capacitors is formed unitarily from the same material. 10. The product of claim 6 wherein the dielectric layer of at least one of said several capacitors is formed of a material different from that of others of said several capactiros.