초록 ▼

A flash free, compression molded object which includes an insert and is formed using only one mold plate is disclosed. Molding compound is trapped in a mold cavity between the insert and mold plate. An extrusion vent allows excess molding compound and curing gases to escape from the mold cavity. Sys

A flash free, compression molded object which includes an insert and is formed using only one mold plate is disclosed. Molding compound is trapped in a mold cavity between the insert and mold plate. An extrusion vent allows excess molding compound and curing gases to escape from the mold cavity. Systems for forming a pin hole within the molded object and removing the molded object from the mold plate are also disclosed.

대표청구항 ▼

1. A method of compression molding a molding compound to an insert having a first surface so that the resulting molded object contains a pin hole of a predetermined cross-sectional area extending through the insert and into the compound for a predetermined length, said method comprising the steps of

1. A method of compression molding a molding compound to an insert having a first surface so that the resulting molded object contains a pin hole of a predetermined cross-sectional area extending through the insert and into the compound for a predetermined length, said method comprising the steps of: obtaining a mold plate having a mold cavity, said cavity having a shape defined by an upper section having upper cavity walls and by lower cavity walls, said lower cavity walls being shaped to allow registration with the first surface of the insert; providing an aperture through the insert, said aperture having a cross-sectional area corresponding to the cross-sectional area of the pin hole; installing a pin through said aperture, said pin extending beyond the insert for a length equivalent to the length of the pin hole, and said pin having a cross-sectional area corresponding to the cross-sectional area of the pin hole; providing an extrusion vent between said upper section and the exterior of said mold plate; allowing curing gasses and excess molding compound to escape said mold cavity through said extrusion vent; loading the molding compound around said pin and between the insert and said mold cavity; pressing the insert and pin into said mold cavity until the first surface of the insert is abutting said lower cavity walls to close said mold cavity; and removing said pin from the resulting molded object. 2. The method of compression molding as defined in claim 1 additionally comprising the step of tapering said extrusion vent with a smaller end at said upper cavity walls and a larger end at the exterior of said mold plate to prevent excess molding compound from clogging said extrusion vent. 3. The method of compression molding defined in claim 1 wherein said pressing step further comprises: gripping the insert within a camming means for gripping the insert as the insert is pressed into said mold cavity; and pulling the insert out from said mold cavity by the use of said camming means. 4. The method as defined in claim 1 wherein said loading step additionally comprises the step of applying an adhesive between the insert and the molding compound to prevent the compound from spinning relative to the insert. 5. The method as defined in claim 1 wherein said loading step additionally comprises the steps of: providing a thermosetting resin; making a thermosetting compound by dispersing fibers throughout said thermosetting resin; placing said thermosetting compound on the insert so that said fibers are substantially randomly oriented relative to the insert; and heating said mold plate to cure said thermosetting resin.