초록 ▼

A semiconductor chip having improved heat dissipation capability. The back surface of a semiconductor chip is provided with microscopic channels defined by fins in intimate contact with the chip. A cover is affixed to the fins to enclose the channels for the laminar flow of coolant fluid. The chip c

A semiconductor chip having improved heat dissipation capability. The back surface of a semiconductor chip is provided with microscopic channels defined by fins in intimate contact with the chip. A cover is affixed to the fins to enclose the channels for the laminar flow of coolant fluid. The chip can be mounted in a recessed portion of a dual in-line package (DIP) with conductive tubes integral with the package providing the flow of coolant. Advantageously, the tubes can function as power busses to the integrated circuit.

대표청구항 ▼

A heat generating device having improved heat removal capability comprising a body portion having an external surface for cooling, a plurality of microscopic channels defined by fins in intimate contact with said external surface, each of said microscopic channels having a width selected to increase

A heat generating device having improved heat removal capability comprising a body portion having an external surface for cooling, a plurality of microscopic channels defined by fins in intimate contact with said external surface, each of said microscopic channels having a width selected to increase the heat transfer over that associated only with an increase in area thereby to substantially increase the heat transfer from the body per unit area of channel surface, and a cover attached to said fins to confine the flow of a coolant fluid through said channels.