Curable mixtures containing an epoxide resin, an imide and a curing catalyst
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
C08G-059/44
C08G-059/46
출원번호
US-0669414
(1984-11-08)
우선권정보
CH-0006137 (1983-11-15)
발명자
/ 주소
Schmid Rolf (Schwarzenburg CHX) Renner Alfred (Muntelier CHX) Stauffer Werner (Fribourg CHX) Fischer Michael (Tafers CHX)
출원인 / 주소
Ciba-Geigy Corporation (Ardsley NY 02)
인용정보
피인용 횟수 :
8인용 특허 :
5
초록▼
Heat-curable mixtures, containing (a) an epoxide resin having on average more than one epoxide group in the molecule, (b) an allyl-substituted or methallyl-substituted imide of the formula I [Figure] (I) in which E is allyl or methallyl, G is hydrogen or methyl, n is 1 or 2, and R is hydrogen, alkyl
Heat-curable mixtures, containing (a) an epoxide resin having on average more than one epoxide group in the molecule, (b) an allyl-substituted or methallyl-substituted imide of the formula I [Figure] (I) in which E is allyl or methallyl, G is hydrogen or methyl, n is 1 or 2, and R is hydrogen, alkyl, alkenyl, cycloalkyl, aryl, benzyl or arylene, and (c) a curing catalyst, have good storage stability and processability and produce moulded materials having high mechanical strength values and good resistance to heat.
대표청구항▼
A heat-curable mixture which is stable on storage and contains (a) 5 to 95 parts by weight of an epoxide resin having on average more than one epoxide group in the molecule, (b) 95 to 5 parts by weight of an allyl-substituted or methallyl-substituted imide of the formula I [Figure] (I) in which E is
A heat-curable mixture which is stable on storage and contains (a) 5 to 95 parts by weight of an epoxide resin having on average more than one epoxide group in the molecule, (b) 95 to 5 parts by weight of an allyl-substituted or methallyl-substituted imide of the formula I [Figure] (I) in which E is allyl or methallyl, G is hydrogen or methyl and n is 1 or 2 and, if n is 1, R is hydrogen, alkyl having 1-12 C atoms, alkenyl having 3-6 C atoms, cycloalkyl having 5-8 C atoms, phenyl, tolyl, xylyl, hydroxyphenyl or naphthyl; or benzyl or, if n is 2, R is -CmH2m-in which m=2-20, m-phenylene, p-phenylene, 1,3-naphthylene, 1,4-naphthylene or 1,5-naphthylene or a group of the formula II [Figure] (II) in which T is methylene, isopropylidene, CO, O, S or SO2, and in which the total of (a) and (b) in the mixture is 100 parts by weight, and (c) 1 to 15 parts by weight, based on 100 parts by weight of the mixture of (a) and (b), of a curing catalyst. A mixture according to claim 1, wherein G in formula I is hydrogen. A mixture according to either of claims 1 or 2, which contains, as the epoxide resin (a), a polyglycidyl ether of a polynuclear phenol.
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이 특허에 인용된 특허 (5)
Renner Alfred (Muntelier CHX), Allyl or methallyl-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid imides and bisimides.
Banks Christopher P. (Saffron Walden GB2) Irving Edward (Burwell GB2) Renner Alfred (Muntelier CHX) Smith Terence J. (Royston GB2), Polymerizable compositions.
Cho, Chung-Kun; Jung, Myung-Sup; Kim, Kwang-Hee; Lee, Jae-Jun; Fedosya, Kalinina; Kim, Mahn Jong; Park, Chung Won, Thermosetting resin composition and board using the same.
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