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Tape packages 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-009/00
  • H01L-023/40
  • H01L-023/48
출원번호 US-0587411 (1984-03-08)
발명자 / 주소
  • Butt Sheldon H. (Godfrey IL)
출원인 / 주소
  • Olin Corporation (New Haven CT 02)
인용정보 피인용 횟수 : 37  인용 특허 : 12

초록 ▼

The present invention is directed to Tape Packages adapted to house semiconductor devices. The packages comprise a base component having a cover component disposed thereon to form an enclosure to house the semiconductor. A tape lead frame is disposed between the base and the cover and has a pluralit

대표청구항 ▼

A tape package adapted to house an electronic component, comprising: a base component; a cover component disposed on said base component forming an enclosure to house said electronic component; a tape lead frame disposed between said base component and said cover component, said lead frame extending

이 특허에 인용된 특허 (12)

  1. Davis ; Jr. ; John M., Carrier for mounting a semiconductor chip.
    상세보기
  2. Ellis Stafford M. (West Sussex GB2) Keay James P. M. (Kent GB2), Clamp arrangements.
    상세보기
  3. Bonkohara Manabu (Tokyo JPX) Kasuga Hisao (Tokyo JPX), Framed lead assembly for a semiconductor device comprising insulator reinforcing strips supported by a frame and made in.
    상세보기
  4. Schermer Gijsbertus J. H. (Eindhoven NLX) Winters Hubertus H. A. (Eindhoven NLX) Hildering Willem C. (Eindhoven NLX) Nickl von Nikelsberg Karl F. (Eindhoven NLX), Hybrid circuit having a semiconductor circuit.
    상세보기
  5. Burns Carmen D. (San Jose CA), Integrated circuit packaging process.
    상세보기
  6. Koenig ; Paul W., Pressurizable semiconductor pellet assembly.
    상세보기
  7. Hutchison Robert V. (Valley Center CA) Nelson John A. (San Diego CA), Process of forming a plastic encapsulated molded film carrier CML package and the package formed thereby.
    상세보기
  8. Tsuzuki Naobumi (Tokyo JPX) Anazawa Shinzo (Tokyo JPX), Semiconductor device having a highly air-tight package.
    상세보기
  9. Sato Susumu (Tokyo JPX) Shiba Hiroshi (Tokyo JPX), Semiconductor device having bump terminal electrodes.
    상세보기
  10. Burns Carmen D. (San Jose CA), Tape operated semiconductor device packaging.
    상세보기
  11. Burns Carmen D. (San Jose CA), Tear strip planarization ring for gang bonded semiconductor device interconnect tape.
    상세보기
  12. Horvath Joseph L. (Poughkeepsie NY), Thermal conduction element for semiconductor devices.
    상세보기

이 특허를 인용한 특허 (37)

  1. Hodgson Rodney T. (Ossining NY) Jones Harry J. (Austin TX) Ledermann Peter G. (Pleasantville NY) Reiley Timothy C. (Ridgefield CT) Moskowitz Paul A. (Yorktown Heights NY), Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam proc.
    상세보기
  2. Pryor Michael J. (Woodbridge CT) Shapiro Eugene (Hamden CT) Mahulikar Deepak (Meriden CT), Cermet substrate with spinel adhesion component.
    상세보기
  3. Brandenburg,Scott D.; Degenkolb,Thomas A.; Yeh,Shing, Compression connection for vertical IC packages.
    상세보기
  4. Matsumoto Kunio (Yokohama JPX) Oshima Muneo (Yokohama JPX) Sakaguchi Suguru (Chigasaki JPX), Connecting structure for electronic part and method of manufacturing the same.
    상세보기
  5. Isoda, Takeshi; Shinoda, Koji, Device module and method of manufacturing the same.
    상세보기
  6. Rooney James F. (Bethany CT) Cheskis Harvey P. (North Haven CT), Die set for the formation of cavities for metal packages to house electronic devices.
    상세보기
  7. Takahashi Yoshiharu,JPX ; Shinohara Toshiaki,JPX, Electronic component including conductor connected to electrode and anodically bonded to insulating coating.
    상세보기
  8. Takahashi Yoshiharu,JPX ; Shinohara Toshiaki,JPX, Electronic component with a lead frame and insulating coating.
    상세보기
  9. Takahashi Yoshiharu,JPX ; Shinohara Toshiaki,JPX, Electronic component with an insulating coating.
    상세보기
  10. Takahashi Yoshiharu,JPX ; Shinohara Toshiaki,JPX, Electronic component with anodically bonded contact.
    상세보기
  11. Frisch, Michael; Ehler, Ralf, Electronic module.
    상세보기
  12. Butt Sheldon H. (Godfrey IL) Voss Scott V. (Portola Valley CA), Heat dissipating interconnect tape for use in tape automated bonding.
    상세보기
  13. Voss Scott V. (Portola Valley CA), Heat dissipating interconnect tape for use in tape automated bonding.
    상세보기
  14. Butt Sheldon H. (Godfrey IL), Hermetic microminiature packages.
    상세보기
  15. Pryor Michael J. (Woodbridge CT) Eppler Richard A. (Cheshire CT) Smith ; III Edward F. (Madison CT) Butt Sheldon H. (Godfrey IL), Hermetically sealed semiconductor package.
    상세보기
  16. Bickford Harry R. (Ossining NY) Mok Lawrence S. (Yorktown Heights NY) Palmer Michael J. (Walden NY), High power, pluggable tape automated bonding package.
    상세보기
  17. Uemura, Toshiya, Light-emitting apparatus.
    상세보기
  18. Mahulikar Deepak (Meriden CT) Butt Sheldon H. (Godfrey IL) Crane Jacob (Woodbridge CT) Pasqualoni Anthony M. (New Haven CT) Smith Edward F. (Madison CT), Metal electronic package.
    상세보기
  19. Pryor Michael J. (Woodbridge CT), Method for making multi-layer and pin grid arrays.
    상세보기
  20. Fox Leslie R. (Boxborough MA) Wade Paul C. (Shirley MA) Schmidt William L. (Acton MA), Method of cooling and powering an integrated circuit chip using a compliant interposing pad.
    상세보기
  21. Isoda, Takeshi; Shinoda, Koji, Method of manufacturing a device module.
    상세보기
  22. Takahashi Yoshiharu,JPX ; Shinohara Toshiaki,JPX, Method of manufacturing ball grid array electronic component.
    상세보기
  23. Takahashi Yoshiharu,JPX ; Shinohara Toshiaki,JPX, Method of manufacturing the electronic using the anode junction method.
    상세보기
  24. Fox Leslie R. (Boxborough MA) Wade Paul C. (Shirley MA) Schmidt William L. (Acton MA), Method of packaging and powering integrated circuit chips and the chip assembly formed thereby.
    상세보기
  25. Braden Jeffrey S. (Milpitas CA), Multi-layer lead frames for integrated circuit packages.
    상세보기
  26. Parthasarathi Arvind (North Branford CT), Multi-metal layer interconnect tape for tape automated bonding.
    상세보기
  27. Mori Toshihiko (Sagamihara JPX) Kubosono Kenji (Sagamihara JPX), Nickel based material for a semiconductor apparatus.
    상세보기
  28. Bayerer, Reinhold; Hohlfeld, Olaf; Stolze, Thilo, Power semiconductor module, power semiconductor module assembly and method for fabricating a power semiconductor module assembly.
    상세보기
  29. Walter Jackie A. (Sunnyvale CA) Sharenow Brett (Mt. View CA) Walker Robert (Saratoga CA) Voss Scott V. (Portola Valley CA), Process for providing an improved electroplated tape automated bonding tape and the product produced thereby.
    상세보기
  30. Smith ; III Edward F. (Madison CT), Sealing glass composite.
    상세보기
  31. Legen,Anton; Thomas,Jochen; Wennemuth,Ingo, Self-supporting connecting element for a semiconductor chip.
    상세보기
  32. Cherukuri Satyam C. (West Haven CT) Butt Sheldon H. (Godfrey IL), Semiconductor casing.
    상세보기
  33. Tadaoka, Akihiko, Semiconductor device.
    상세보기
  34. Crane Jacob (Woodbridge CT) Johnson Barry C. (Tucson AZ) Mahulikar Deepak (Meriden CT) Butt Sheldon H. (Godfrey IL), Semiconductor package.
    상세보기
  35. Butt Sheldon H. (Godfrey IL), Semiconductor packaging.
    상세보기
  36. Sponaugle Roger (Logan UT) Rainey Robert R. (North Ogden UT), Surface mount device with compensation for thermal expansion effects.
    상세보기
  37. Wakana, Yoshinori; Kamoshida, Masaru; Igarashi, Takeshi; Kanno, Kiyotaka, Waterproof component-suppressing electronic control device.
    상세보기

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