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Electrolytic plating apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25D-017/00
  • C25D-017/28
출원번호 US-0757794 (1985-07-22)
발명자 / 주소
  • Palnik Karl (Huntingdon Valley PA)
출원인 / 주소
  • The Carolinch Company (Ivyland PA 02)
인용정보 피인용 횟수 : 32  인용 특허 : 2

초록

A rotary brush plating apparatus utilizing a porous brush member formed of a hydrophobic material is disclosed. Plating solution is pumped interiorly of rotating, cylindrical brush member and radially outwardly through interconnected pores to its periphery where plating takes place by the passage of

대표청구항

Apparatus for rotary brush plating of metal parts comprising: a rotatably mounted cylindrical body, said body being comprised of a hydrophobic material and having interconnected pores substantially uniformly dispersed throughout, extending radially outwardly to the periphery, said body further havin

이 특허에 인용된 특허 (2)

  1. Palnik Karl (Huntingdon Valley PA), Apparatus for selective electrolytic plating.
  2. Eidschun Charles D. (Seminole FL), Connector contact point.

이 특허를 인용한 특허 (32)

  1. Volodarsky, Rimma; Volodarsky, Konstantin; Uzoh, Cyprian; Talieh, Homayoun; Young, Douglas W., Anode assembly for plating and planarizing a conductive layer.
  2. Talieh,Homayoun, Apparatus for electroprocessing a workpiece surface.
  3. Talieh, Homayoun; Uzoh, Cyprian Emeka, Apparatus for plating and polishing a semiconductor workpiece.
  4. Cyprian Emeka Uzoh ; Homayoun Talieh ; Bulent Basol, Chip interconnect and packaging deposition methods and structures.
  5. Uzoh,Cyprian Emeka; Talieh,Homayoun; Basol,Bulent, Chip interconnect and packaging deposition methods and structures.
  6. Webb Joseph M. ; Faucher Jerome R., Conveyorized electroplating device.
  7. Spain Robert J. (Newton MA) Glassman Steven P. (Randolph MA), Conveyorized spray plating machine.
  8. Krakowski, Dariusz; Buchholz, Uwe; Centofante, Nico, Device for mixing fresh air and heating air and use of the device in a ventilation system of an aircraft.
  9. Basol,Bulent M.; Talieh,Homayoun, Electrochemical mechanical processing apparatus.
  10. Webb, Joseph M.; Faucher, Jerome R., Electroplating method.
  11. Zhang Ming Jason,CAX, Electroplating method and apparatus.
  12. Basol, Bulent M.; Talieh, Homayoun, Electropolishing system and process.
  13. Cyprian Emeka Uzoh ; Homayoun Talieh, Method and apparatus for depositing and controlling the texture of a thin film.
  14. Uzoh, Cyprian Emeka; Talieh, Homayoun, Method and apparatus for depositing and controlling the texture of a thin film.
  15. Talieh Homayoun, Method and apparatus for electro-chemical mechanical deposition.
  16. Talieh, Homayoun, Method and apparatus for electro-chemical mechanical deposition.
  17. Homayoun Talieh, Method and apparatus for electrochemical mechanical deposition.
  18. Talieh Homayoun ; Uzoh Cyprian Emeka, Method and apparatus for plating and polishing a semiconductor substrate.
  19. Talieh,Homayoun; Uzoh,Cyprian Emeka, Method and apparatus for plating and polishing semiconductor substrate.
  20. Basol,Bulent M.; Talieh,Homayoun, Method and apparatus to deposit layers with uniform properties.
  21. Basol, Bulent M., Method for controlling conductor deposition on predetermined portions of a wafer.
  22. Talieh, Homayoun, Method for electro chemical mechanical deposition.
  23. Uzoh, Cyprian, Methods for repairing defects on a semiconductor substrate.
  24. Uzoh, Cyprian Emeka; Talieh, Homayoun; Basol, Bulent, Packaging deposition methods.
  25. Uzoh,Cyprian; Basol,Bulent; Talieh,Homayoun, Pad designs and structures for a versatile materials processing apparatus.
  26. Mayer, Steven T.; Drewery, John Stephen; Webb, Eric G., Photoresist-free metal deposition.
  27. Basol, Bulent M., Plating methods for low aspect ratio cavities.
  28. Reinhard Schneider DE; Rolf Schroeder DE; Klaus Wolfer DE; Thomas Kosikowski DE, Process for the electrolytic processing especially of flat items and arrangement for implementing the process.
  29. Basol, Bulent M.; Talieh, Homayoun, System and method for electrochemical mechanical polishing.
  30. Basol,Bulent M.; Ashjaee,Jalal; Govzman,Boris; Talieh,Homayoun; Frey,Bernard M., System for electropolishing and electrochemical mechanical polishing.
  31. Uzoh, Cyprian E.; Basol, Bulent M., Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same.
  32. Uzoh,Cyprian E.; Basol,Bulent M., Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same.
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