초록 ▼

A method and apparatus for obtaining a profile read-out of an object in a field of view of a solid-state imager without destruction of the image data at the imager. In an application using a CID imager, X-axis and Y-axis projections of the array are obtained by sensing charge transfer from sequentia

A method and apparatus for obtaining a profile read-out of an object in a field of view of a solid-state imager without destruction of the image data at the imager. In an application using a CID imager, X-axis and Y-axis projections of the array are obtained by sensing charge transfer from sequentially addressed columns into all rows simultaneously followed by sensing charge transfer from sequentially addressed rows into all columns simultaneously. Calculation of centroid and area of an image can be obtained without the necessity of reading out each pixel.

대표청구항 ▼

In a solid state imager having a matrix of individual picture elements arranged in rows and columns, each of the picture elements including a first and a second conductive plate, each of the first conductive plates in each row being connected to a common row electrode and each of the second conducti

In a solid state imager having a matrix of individual picture elements arranged in rows and columns, each of the picture elements including a first and a second conductive plate, each of the first conductive plates in each row being connected to a common row electrode and each of the second conductive plates in each column being connected to a common column electrode, read out of the signal in any one picture element being effected by charge transfer between the first and the second conductive plates, a method for obtaining a profile of an object within a field of view of the imager comprising the steps of: A. Selecting a first row for data readout; B. setting a bias voltage on all rows other than the selected row to preclude charge transfer in such other rows; C. setting a voltage on all column electrodes to create a potential well at each second conductive plate; D. changing the bias voltage on the selected row such that charge under each first conductive plate in the selected row is transferred to the potential well created at the corresponding second conductive placte; E. summing the charges appearing on the column electrodes resulting from the charge transfer to thereby obtain a signal representative of the profile along the selected row; and F. repeating steps A through E for each of the row electrodes whereby a profile is obtained along the axis of the rows.