초록 ▼

An identification card equipped with an integrated circuit, in which the circuit along with its connection leads is arranged on a carrier element which is embeddedly enclosed by the card on all sides by use of the hot lamination technique. In order to protect the sensitive arrangement, the carrier e

An identification card equipped with an integrated circuit, in which the circuit along with its connection leads is arranged on a carrier element which is embeddedly enclosed by the card on all sides by use of the hot lamination technique. In order to protect the sensitive arrangement, the carrier element is subjected to the full laminating pressure only when one or more layers in the card construction have softened. This is achieved, for example, by providing buffer zones in the card laminate at least in the area of the arrangement in the form of cavities or layers that are easy to deform elastically. The buffer zones protect the arrangement from local pressure peaks in the initial phase of the laminating process. It is also possible to control the laminating pressure as a function of the temperature or the degree of softening of the card layers.

대표청구항 ▼

A multi-layer data card containing accessible, electronically encoded data comprising: a card composite having an internal core layer (11, 23, 36) and at least one covering layer (12, 13, 20, 26, 32, 40) laminated by means of heat and pressure on said core layer along one entire side thereof, said c

A multi-layer data card containing accessible, electronically encoded data comprising: a card composite having an internal core layer (11, 23, 36) and at least one covering layer (12, 13, 20, 26, 32, 40) laminated by means of heat and pressure on said core layer along one entire side thereof, said core layer having a recess; a carrier element (6, 27) having a data containing IC-module member (5), said carrier element being small relative to the size of the card and further containing access means (7) confined to said carrier element by which the data in said module member can be accessed, said carrier element being received within said recess and laminated into the card composite such that said covering layer is generally planar in the region of said carrier element; and a material (17, 21/22, 24/25, 33/34, 38/39) completely surrounding said carrier element and completely occupying the portion of said recess not occupied by said carrier element, said surrounding material being different from the material of the core layer and having a softening point lower than that of said core layer, said surrounding material being soft and elastic under conditions of card manufacture and use for protecting said carrier element against mechanical stresses.