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Process for preparing a non-conductive substrate for electroplating 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25D-005/02
  • C25D-005/54
출원번호 US-0802892 (1985-11-29)
발명자 / 주소
  • Minten Karl L. (Cannock NJ GBX) Pismennaya Galina (Palisades Park NJ)
출원인 / 주소
  • Olin Hunt Specialty Products Inc. (Palisades Park NJ 02)
인용정보 피인용 횟수 : 42  인용 특허 : 7

초록

A process for electroplating a conductive metal layer to the surface of a non-conductive material which comprises: (a) preparing a liquid dispersion of carbon black comprised of: (1) carbon black particles having an average particle diameter of less than about 3.0 microns in said dispersion; (2) an

대표청구항

A process for electroplating a conductive metal layer to the surface of a non-conductive material which comprises: (a) preparing a liquid dispersion of carbon black comprised of: (1) carbon black particles having an average particle diameter of less than about 3.0 microns in said dispersion; (2) an

이 특허에 인용된 특허 (7)

  1. Stoetzer Steven R. (St. Clair Shores MI) Wiley Robert E. (Port Huron MI), Copper coating composition for shielding electronic equipment and the like.
  2. Roberto Scorta (Milan ITX), Method for conductively interconnecting circuit components on opposite surfaces of a dielectric layer.
  3. Saunders John Allen (Teddington EN), Paint compositions.
  4. Allard Adrien W. (Colora MD), Process of dispersing electro-conductive carbon black and web product made thereby.
  5. Oshima Renzo (Hachioji JPX) Kyojima Yoshiyuki (Kawasaki JPX) Fujii Takara (Yokohama JPX) Kato Shoji (Yokohama JPX), Production of laminate for receiving chemical plating.
  6. Tundermann John Hayes (Goshen NY) Harrington John Herbert (Warwick NY), Production of reflective metal flake pigments.
  7. Lin ; Kingso C. ; Hammond ; Donald J., Semi-conductive coating for glass fibers.

이 특허를 인용한 특허 (42)

  1. Michael V. Carano ; Frank Polakovic, Aqueous carbon composition and method for coating a non conductive substrate.
  2. Thorn Charles Edwin ; Polakovic Frank ; Mosolf Charles A., Carbon containing composition for electroplating.
  3. Sirtori Vittorio,ITX ; Cattaneo Giovanni,ITX ; Mauri Fabio,ITX, Decontamination of electronic cards from copper salts.
  4. Thorn Charles Edwin (Newport KY) Polakovic Frank (Ringwood NJ) Mosolf Charles A. (Juno Beach FL), Direct metallization process.
  5. Thorn Charles Edwin ; Polakovic Frank ; Mosolf Charles A., Direct metallization process.
  6. Thorn Charles Edwin ; Polakovic Frank ; Mosolf Charles A., Direct metallization process employing a cationic conditioner and a binder.
  7. Hoffman Paul R. ; Popplewell James M. ; Braden Jeffrey S., Edge connectable metal package.
  8. Moireau, Patrick; Ceugniet, Claire, Electrically conducting glass strands and structures comprising such strands.
  9. Waheguru Pal Singh ; Dalibor Hodko ; Suchitra Chepin ; Oliver J. Murphy, Electronically conductive polymers.
  10. Couble, Edward C.; Kapeckas, Mark J.; Florio, Steven M.; Jacques, David L., Electroplating process.
  11. Florio Steven M. (Hopkinton MA) Burress Jeffrey P. (Milford MA) Colangelo Carl J. (New Bedford MA) Couble Edward C. (Brockton MA) Kapeckas Mark J. (Worcester MA), Electroplating process.
  12. Florio Steven M. (Hopkinton MA) Burress Jeffrey P. (Milford MA) Colangelo Carl J. (New Bedford MA) Couble Edward C. (Brockton MA) Kapeckas Mark J. (Worcester MA), Electroplating process.
  13. Florio Steven M. (Hopkinton MA) Burress Jeffrey P. (Milford MA) Colangelo Carl J. (New Bedford MA) Couble Edward C. (Brockton MA) Kapeckas Mark J. (Worcester MA), Electroplating process.
  14. Florio Steven M. ; Burress Jeffrey P. ; Colangelo Carl J. ; Couble Edward C. ; Kapeckas Mark J., Electroplating process.
  15. Florio Steven M. ; Burress Jeffrey P. ; Colangelo Carl J. ; Couble Edward C. ; Kapeckas Mark J., Electroplating process.
  16. Florio Steven M. ; Burress Jeffrey P. ; Colangelo Carl J. ; Couble Edward C. ; Kapeckas Mark J., Electroplating process.
  17. Cheskis Harvey (North Haven CT) Mahulikar Deepak (Madison CT), Graphite composites for electronic packaging.
  18. Law,Kam S.; Bachrach,Robert Z.; White,John M.; Shang,Quanyuan, Method and apparatus for metallization of large area substrates.
  19. Downing Ross O. (Renton WA) Banis David S. (Seattle WA), Method and apparatus for plating through holes in graphite composites.
  20. Downing Ross O. (Renton WA) Banis David S. (Seattle WA), Method and apparatus for plating through holes in graphite composites.
  21. Sonnenberg Wade ; Houle Patrick J. ; Luong Thong B. ; Shelnut James G. ; Fisher Gordon, Method for electroplating using stabilized dispersions of conductive particles.
  22. Miyazawa,Hiroshi; Yonezawa,Reki, Method for producing a composite plated product.
  23. Murphy Oliver J. ; Hitchens G. Duncan ; Hodko Dalibor ; Clarke Eric T. ; Miller David L. ; Parker Donald L., Method of forming electronically conducting polymers on conducting and nonconducting substrates.
  24. Murphy Oliver J. ; Hitchens G. Duncan ; Hodko Dalibor ; Clarke Eric T. ; Miller David L. ; Parker Donald L., Method of manufacturing passive elements using conductive polypyrrole formulations.
  25. Ding,Ying; Redline,Ronald N.; Retallick,Richard C.; Wojtaszek,Mark, Methods of cleaning copper surfaces in the manufacture of printed circuit boards.
  26. Braden Jeffrey S. (Milpitas CA), Multi-layer lead frames for integrated circuit packages.
  27. Parthasarathi Arvind (North Branford CT), Multi-metal layer interconnect tape for tape automated bonding.
  28. Minten Karl L. (Cannock NJ GBX) Pismennaya Galina (Palisades Park NJ), Printed wiring board having carbon black-coated through holes.
  29. Thorn, Charles Edwin; Polakovic, Frank; Mosolf, Charles A., Printed wiring boards and methods for making them.
  30. Thorn,Charles Edwin; Polakovic,Frank; Mosolf,Charles A., Printed wiring boards and methods for making them.
  31. Lee,Hyunjung, Process for preparing a non-conductive substrate for electroplating.
  32. Catherine M. Randolph ; Barry F. Nelsen, Process for preparing a nonconductive substrate for electroplating.
  33. Nelsen Barry F. (Mountain Lakes NJ) Shyu Jieh-Hwa (Windham NH), Process for preparing a nonconductive substrate for electroplating.
  34. Pendleton Phillip (Cheshire CT), Process for preparing nonconductive substrates.
  35. Piano Anthony M. (New Haven CT) Galvez Randolfo (North Bergen NJ), Process for preparing nonconductive substrates.
  36. Cupta Glenn W. (Clifton NJ) Piano Anthony M. (Lodi NJ), Process for preparing the through hole walls of a printed wiring board for electroplating.
  37. Pendleton Phillip (Kinnelon NJ), Process for preparing the through hole walls of a printed wiring board for electroplating.
  38. Piano Anthony M. (Lodi NJ) Galvez Randolfo (North Bergen NJ), Process for preparing the through hole walls of a printed wiring board for electroplating.
  39. Daniel Witold Krassowski ; Jing-Wen Tzeng ; Brian McNeil Ford, Process for providing increased conductivity to a material.
  40. Sirtori Vittorio,ITX ; Cattaneo Giovanni,ITX ; Mauri Fabio,ITX, Solution for removing copper salts from a copper surface comprising an alcohol and an ammonium salt.
  41. Sonnenberg Wade ; Houle Patrick J. ; Luong Thong B. ; Shelnut James G. ; Fisher Gordon, Stabilized dispersions of graphite particles.
  42. Garlough Gregory Dean ; Carroll Benjamin Todd ; Carano Michael Val ; Polakovic Frank, Ultrasonic mixing of through hole treating compositions.
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