초록 ▼

A clad brazing filler for use in bonding a ceramic to a metal, glass or another ceramic having a substantially different thermal expansion coefficient, and composites using such a filler. According to one aspect of the invention, a brazing filler of a clad type is provided which is composed of a tit

A clad brazing filler for use in bonding a ceramic to a metal, glass or another ceramic having a substantially different thermal expansion coefficient, and composites using such a filler. According to one aspect of the invention, a brazing filler of a clad type is provided which is composed of a titanium layer adjacent a silver, copper or silver-copper alloy layer, or a combination of silver and copper layers, with the titanium content being in a range of 3 to 80% of the total weight of the layers of the assembly. In accordance with another aspect of the invention, a brazing filler of the clad type is provided which combines the layer arrangement of the first aspect with either a layer of a metal having a low thermal expansion coefficient, a layer of a metal having a low Young\s modulus, for a combination layer of both, arranged in any order.

대표청구항 ▼

A brazing filler for use in bonding a ceramic to one of a metal, glass or ceramic, said brazing filler comprising one of a low thermal expansion metal layer, a low Young\s modulus metal layer and a combination low thermal expansion metal layer and a low Young\s modulus metal layer, in combination wi

A brazing filler for use in bonding a ceramic to one of a metal, glass or ceramic, said brazing filler comprising one of a low thermal expansion metal layer, a low Young\s modulus metal layer and a combination low thermal expansion metal layer and a low Young\s modulus metal layer, in combination with a filler consisting of one of an Ag layer, Cu layer, Ag-Cu alloy layer, and a combination of Ag and Cu layers, and an adjacent Ti layer, the Ti content being in the range of 3 to 80% of the total weight of said brazing filler, one of said low thermal expansion metal layer and said low Young\s modulus metal layer being adjacent to and integral with any one of said Ag layer, Cu layer, Ag-Cu alloy layer and Ti layer.