[특허]Surface defect inspecting apparatus

[미국특허] Surface defect inspecting apparatus 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	G01N-021/89
출원번호	US-0675008 (1984-11-26)
우선권정보	JP-0221394 (1983-11-26); JP-0148614 (1984-07-19)
발명자 / 주소	Ogawa Shigeru (Yokohama JPX) Yamaji Hiroshi (Chigasaka JPX) Kano Masaaki (Kamakura JPX)
출원인 / 주소	Kabushiki Kaisha Toshiba (Kawasaki JPX 03)
인용정보	피인용 횟수 : 38 인용 특허 : 6

초록 ▼

The holding mechanism holds an object under inspection in a manner that the substantially entire surface of the object may relatively be scanned by a laser beam. A spherical integrating light collector has an opening disposed close to the inspected surface of the object held by the holding mechanism. A laser beam illuminating mechanism is coupled with the other end of the spherical integrating light collector, and illuminates the inspected surface of the object with the laser beam through the opening. A photo-electric converter receives the scattered light as is reflected by the inspected surface and collected by the spherical integrating light collector, and converts the scattered light into an electrical signal representing an amount of light. An analog to digital converter converts the electrical signal derived from the photo-electric converter into a digital signal. A peak detector receives the digital signal derived from the analog to digital converter to detect peak values at predetermined periods. A mean value calculator calculates a mean value using a digital signal output from the analog to digital converter. A reference value storing memory stores a reference value to determine defects present on the inspected surface of the object. A threshold level calculator calculates the threshold level using the reference value and the mean value. A defect detector compares peak values derived from the peak detector with the threshold level, and detects the surface defects on the basis of the result of the comparison.

대표청구항 ▼

An apparatus for inspecting an object under inspection for defects on the surface thereof, comprising: means for holding the object under inspection in a manner that the substantially entire surface of the object may relatively be scanned by laser beam; spherical integrating light collecting means provided at one end with an opening disposed close to the inspected surface of the object held by said holding means; laser beam illustrating means coupled with another end of said spherical integrating light collecting means and for illuminating said inspected surface of the object with the laser beam through said opening; photo-electric converting means for receiving the scattered light as is reflected by said inspected surface and collected by said spherical integrating light collecting means, and for converting the scattered light into an electrical signal representing an amount of light; analog to digital converting means for analog to digital converting the electrical signal derived from said photo-electric converting means into a digital signal; peak detecting means for receiving the digital signal derived from said analog to digital converting means to detect peak values at predetermined periods; means for calculating a mean value based on a digital signal output from said analog to digital converting means; means for storing at least one reference value which is for determining at least one threshold level to detect surface defect or defects present on said inspected surface; means for calculating said threshold level based on said reference value and said mean value; and surface defect detecting means for comparing peak values derived from said peak detecting means with said threshold level, and for detecting the surface defect or defects depending on the result of the comparison.

이 특허에 인용된 특허 (6) 인용/피인용 타임라인 분석

Louderback Anthony W. (Ojai CA), Device for measurement of optical scattering.
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Steigmeier Edgar F. (Hedingen CHX) Auderset Heinrich (Horgen CHX), Method for determining the quality of light scattering material.
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Galbraith, Lee K., Scanning contaminant and defect detector.
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Alford W. Jerry (Charlotte NC) Cushing Charles J. (Charlotte NC) Hunt James D. (Charlotte NC) Smith Michael L. (Matthews NC) Vander Neut Richard D. (Charlotte NC) Wilkes James L. (Matthews NC), Surface inspection scanning system.
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Heebner Richard W. (Solebury Township ; Bucks County PA) Schmitt Randal L. (Plainsboro Township ; Middlesex County NJ), Technique for inspecting semiconductor wafers for particulate contamination.
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Allard Martin E. (Brixham GB2) Wilcox Joseph A. (Havant GB2), Variable threshold workpiece examination.
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이 특허를 인용한 특허 (38) 인용/피인용 타임라인 분석

Landers William Francis ; Singh Jyothi, Apparatus for mapping scratches in an oxide film.
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Hamamatsu, Akira; Maeda, Shunji; Shibuya, Hisae, Apparatus of inspecting defect in semiconductor and method of the same.
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Hamamatsu, Akira; Maeda, Shunji; Shibuya, Hisae, Apparatus of inspecting defect in semiconductor and method of the same.
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O'Dell, Jeffrey L.; Verburgt, Thomas; Harless, Mark; Watkins, Cory, Automated wafer defect inspection system and a process of performing such inspection.
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O'Dell, Jeffrey L.; Verburgt, Thomas; Harless, Mark; Watkins, Cory, Automated wafer defect inspection system and a process of performing such inspection.
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O'Dell, Jeffrey; Verburgt, Thomas; Harless, Mark; Watkins, Cory, Automated wafer defect inspection system and a process of performing such inspection.
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Sappey, Roman; Meeks, Steven W., Defect inspection and photoluminescence measurement system.
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Vurens Gerard H., Disk film optical measurement system.
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Leonard,Robert Tyler; Jenny,Jason Ronald, Double side polished wafer scratch inspection tool.
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Brederlow, Ralf; Thewes, Roland, Measuring arrangement, semiconductor arrangement and method for operating a semiconductor component as a reference source.
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Yamauchi Toshihiko (Yokohama JPX) Akiyama Nobuyuki (Yokohama JPX), Method and apparatus for detecting foreign particle.
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Hunter, Reginald, Method and apparatus for embedded substrate and system status monitoring.
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Hunter, Reginald, Method and apparatus for enhanced embedded substrate inspection through process data collection and substrate imaging techniques.
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MacGibbon,Bruce; Adamski,Donald F.; Stevens,Todd, Method and apparatus for locating/sizing contaminants on a polished planar surface of a dielectric or semiconductor material.
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Juliana Anthony (San Jose CA) Leung Wai C. (San Jose CA) Pan Victor T. (Fremont CA) Rosen Hal J. (Los Gatos CA) Strand Timothy C. (San Jose CA), Method and apparatus for optically measuring characteristics of a thin film by directing a P-polarized beam through an i.
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Hunter, Reginald, Method and apparatus for substrate surface inspection using spectral profiling techniques.
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Hunter, Reginald, Method and apparatus to provide embedded substrate process monitoring through consolidation of multiple process inspection techniques.
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Hunter,Reginald, Method and apparatus to provide for automated process verification and hierarchical substrate examination.
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Antonius Ludovicus Gerardus Van Valkenburg NL, Method and installation for inspecting an article for defects.
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Landers William Francis ; Singh Jyothi, Method for mapping scratches in an oxide film.
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Sanada, Kenichi, Method for preparing focus-adjustment data for focusing lens system of optical defect-inspection apparatus, and focus adjustment wafer used in such method.
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Bradburn Graham,GBX, Method of illuminating a digital representation of an image.
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Liang, Ted; Stivers, Alan R.; Tejnil, Edita, Method to inspect patterns with high resolution photoemission.
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Meeks, Steven W.; Kudinar, Rusmin; Nguyen, Hung P., Multi-surface optical inspector.
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Meeks, Steven W.; Kudinar, Rusmin; Nguyen, Hung P., Multi-surface scattered radiation differentiation.
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Sopori, Bhushan; Rupnowski, Przemyslaw; Ulsh, Michael, On-line, continuous monitoring in solar cell and fuel cell manufacturing using spectral reflectance imaging.
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Ravid Erez,ILX ; Holcman Ido,ILX ; Mikolinsky Vladimir,ILX, On-the-fly automatic defect classification for substrates using signal attributes.
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Sopori,Bhushan L.; Hambarian,Artak, Optic probe for semiconductor characterization.
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Meeks, Steven W.; Kudinar, Rusmin; Nguyen, Hung P., Optical inspector.
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Meeks, Steven W.; Kudinar, Rusmin; Nguyen, Hung P., Optical inspector.
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Meeks, Steven W.; Kudinar, Rusmin; Nguyen, Hung P., Optical inspector with selective scattered radiation blocker.
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Hunter, Reginald, Optical signal routing method and apparatus providing multiple inspection collection points on semiconductor manufacturing systems.
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Hunter, Reginald, Particle detection and embedded vision system to enhance substrate yield and throughput.
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Hunter, Reginald; Tsadka, Sagie, Particle detection and embedded vision system to enhance substrate yield and throughput.
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Smilansky, Zeev; Tsadka, Sagie; Lapidot, Zvi; Sherman, Rivi, Pixel based machine for patterned wafers.
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Guerra John M. (Concord MA), Roughness measuring apparatus.
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Hirata,Hiroyuki, Surface inspection apparatus.
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Vurens Gerard H., Thin film optical measurement system.
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A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
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[미국특허] Surface defect inspecting apparatus 원문보기

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연구과제 타임라인

이 특허에 인용된 특허 (6) 인용/피인용 타임라인 분석

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[미국특허] Surface defect inspecting apparatus 원문보기

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이 특허에 인용된 특허 (6) 인용/피인용 타임라인 분석

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