IPC분류정보
| 국가/구분 |
United States(US) Patent
등록
|
| 국제특허분류(IPC7판) |
|
| 출원번호 |
US-0757026
(1985-07-19)
|
|
발명자
/ 주소 |
- Schoenberg Andrew J. (Huntington NY) Friedrich Marju L. (Babylon NY)
|
| 출원인 / 주소 |
- Kollmorgen Technologies Corporation (Dallas TX 02)
|
| 인용정보 |
피인용 횟수 :
44 인용 특허 :
17 |
초록
▼
A non-blocking, solid, adhesive composition comprising, (a) a film forming polymeric resin of average molecular weight between 10,000 and about 100,000 and having an epoxide, hydroxyl or unsaturated functionality greater than about 2, the polymeric resin being selected from the group consisting of p
A non-blocking, solid, adhesive composition comprising, (a) a film forming polymeric resin of average molecular weight between 10,000 and about 100,000 and having an epoxide, hydroxyl or unsaturated functionality greater than about 2, the polymeric resin being selected from the group consisting of polyesters, polyurethanes and epoxies; (b) at least one filler, or at least one polyfunctional compound of average molecular weight below about 7,000 and containing a polyaromatic backbone, or mixtures thereof, the weight ratio of (a) to (b) being between about 1.5:1 and about 9:1; and (c) a curing agent which is capable of cross-linking and curing the polymeric resin to a C-stage, the curing agent being present in an amount sufficient to C-stage the polymeric resin. The adhesive composition can be activated without becoming C-staged upon application of sufficient heat or ultrasonic energy for a time period less than one second. The curing agent is non-reactive at the conditions which will activate the adhesive composition, but can be made reactive upon application of sufficient energy in the form of radiant energy or in the form of heat at or above the activation temperature, for a time period sufficient to cure the composition. The adhesive composition is flexible, and in the C-stage, is capable of forming an infusible composition which does not melt, flow or decompose when exposed for 10 seconds to molten solder at 260°C. and does not soften when exposed to dichloromethane at 25°C. for one minute. The adhesive composition is suitable for bonding a wire to a surface, to another wire or to itself.
대표청구항
▼
A non-blocking, solid adhesive composition activated upon application of sufficient heat or ultrasonic energy which comprises: (a) a first component comprising a polymeric resin having epoxide, hydroxyl or unsaturated functional groups which provide a functionality greater than 2, said polymeric res
A non-blocking, solid adhesive composition activated upon application of sufficient heat or ultrasonic energy which comprises: (a) a first component comprising a polymeric resin having epoxide, hydroxyl or unsaturated functional groups which provide a functionality greater than 2, said polymeric resin being selected from the group of resins consisting of a polyester resin, a polyurethane resin and an epoxy resin; (b) a second component comprised of at least one filler, or at least one polyfunctional compound containing a polyaromatic backbone and having an average molecular weight below about 7,000, or mixtures thereof the weight ratio of said first component to said second component being between about 1.5:1 and about 9:1; (c) a curing agent which is capable of reacting or initiating a reaction with the functional groups of the polymeric resin to form crosslinks and cure the polymeric resin to a C-stage upon application of sufficient energy in the form of heat or radiant energy, said curing agent being non-reactive blocked at the conditions which will activate the adhesive composition, said curing agent being present in an amount sufficient to C-stage the polymeric resin; said composition being flexible, and in the C-stage capable of forming an infusible composition which does not melt, flow or decompose when exposed for 10 seconds to molten solder at 260°C. and does not soften when exposed to dichloromethane at 25°C. for one minute.
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