초록 ▼

In the production of resist images by application of a radiation-sensitive positive-working resist layer based on degradable polymers onto a substrate, imagewise exposure of the resist layer to actinic radiation and removal of the irradiated parts of the layer with development of the resist image, t

In the production of resist images by application of a radiation-sensitive positive-working resist layer based on degradable polymers onto a substrate, imagewise exposure of the resist layer to actinic radiation and removal of the irradiated parts of the layer with development of the resist image, the radiation-sensitive resist layer used is composed of poly(diacetylenes), in particular soluble ones. Preferably, the radiation-sensitive resist layer based on the poly(diacetylenes) contains sensitizers which can be activated by actinic radiation and which, after being activated, induce or accelerate molecular degradation of the poly(diacetylenes). Dry film resists comprise a temporary dimensionally stable base and a radiation-sensitive resist layer which is applied on the base, can be degraded by exposure to actinic radiation and is based on poly(diacetylenes), in particular soluble ones, with or without a cover sheet on top of the said resist layer.

대표청구항 ▼

A process for the porduction of a resist image on a substrate, comprising application of a solid radiation-sensitive resist layer onto the substrate, the said resist layer being mainly or completely composed of at least one poly(diacetylene), imagewise exposure of the resist layer to actinic radiati

A process for the porduction of a resist image on a substrate, comprising application of a solid radiation-sensitive resist layer onto the substrate, the said resist layer being mainly or completely composed of at least one poly(diacetylene), imagewise exposure of the resist layer to actinic radiation, resulting in molecular degradation of the poly(diacetylene), and selective removal of the irradiated parts of the resist layer with development ofthe resist image. The process of claim 1, wherein the resist image is after-treated by drying and/or heating the developed image.