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Low cost integrated circuit bonding process 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/10
  • H01R-043/02
출원번호 US-0768262 (1985-08-22)
발명자 / 주소
  • McShane Michael B. (Austin TX)
출원인 / 주소
  • Motorola, Inc. (Schaumburg IL 02)
인용정보 피인용 횟수 : 124  인용 특허 : 3

초록 ▼

A low cost process for bonding a plurality of integrated circuit die to a variety of die support frames using existing, readily available equipment. Tape automatic bonding (TAB) processes offer a number of new possibilities in the assembly and packaging of integrated circuits. However, the investiga

대표청구항 ▼

A process for attaching an integrated circuit die to a die support frame having a conductive pattern thereon comprising: attaching a plurality of balls, one each to a plurality of bonding pads on the integrated circuit die by using a wire bonder to deposit a ball on each bonding pad and severing the

이 특허에 인용된 특허 (3)

  1. Honn ; James J. ; Stuby ; Kenneth P., Electrical package for LSI devices and assembly process therefor.
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  2. Campbell William (Oldham GB2), Integrated circuit package.
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  3. Needham Barbara (Bishop\s Stortford GB2), Permanently connecting a set of conductive tracks on a substrate with a co-operating set on a printed circuit.
    상세보기

이 특허를 인용한 특허 (124)

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  6. Tsuda Toshio (Habikino JPX) Horio Yasuhiko (Osaka JPX) Bessho Yoshihiro (Kadoma JPX) Ishida Toru (Hirakata JPX), Electrical contact bump and a package provided with the same.
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