초록 ▼

A method for patterning a photoresist or insulating layer on a printed wiring board utilizes two photoreactive coatings comprising a photoprocessable ultraviolet (UV) sensitive layer overlaid with a thin, unexposed, undeveloped strip base silver film. A white light x-y plotter, preferably employing

A method for patterning a photoresist or insulating layer on a printed wiring board utilizes two photoreactive coatings comprising a photoprocessable ultraviolet (UV) sensitive layer overlaid with a thin, unexposed, undeveloped strip base silver film. A white light x-y plotter, preferably employing an octagonal aperture, is driven directly from a CAD system to expose the film on the board in the desired pattern without affecting the underlying UV sensitive layer. The film is then developed on the board and employed as an in situ mask for the underlying UV layer during exposure of the board to a UV flood lamp. After UV exposure the film is peeled off to allow conventional processing of the selectively polymerized layer. This technique produces high resolution, inspectable onboard masks in full registration using reliable low energy plotters.

대표청구항 ▼

A process for patterning a photoprocessable layer on a substrate, comprising preparing a digital representation of a desired pattern, preparing a substrate with an upper layer of photoprocessable material sensitive to a first spectrum of directed energy, applying a layer of unexposed, undeveloped ph

A process for patterning a photoprocessable layer on a substrate, comprising preparing a digital representation of a desired pattern, preparing a substrate with an upper layer of photoprocessable material sensitive to a first spectrum of directed energy, applying a layer of unexposed, undeveloped photographic imaging film sensitive to a second spectrum of directed energy to the substrate over the photoprocessable layer, selectively exposing said film on the substrate with an automatic photoplotter controlled by said digital representation emitting a low energy beam of radiation of substantially longer wavelength than UV so that the film is activated without affecting the underlying layer of photoprocessable material, developing the film on the substrate, exposing the photoprocessable layer to energy in said first spectrum distributed substantially uniformly over the substrate through the image developed in said film layer as an in situ mask, peeling said film off of said substrate, and processing said photoprocessable layer, whereby low energy plotting can be used to create high resolution inspectable onboard masks.