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Optical figuring by plasma assisted chemical transport and etching apparatus therefor 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23F-001/00
  • C23C-014/00
출원번호 US-0790673 (1985-10-23)
발명자 / 주소
  • Zarowin Charles B. (Rowayton CT)
출원인 / 주소
  • The Perkin-Elmer Corporation (Norwalk CT 02)
인용정보 피인용 횟수 : 27  인용 특허 : 10

초록

The present invention is directed to method and apparatus for figuring a surface by plasma assisted chemical transport by means of mounting the surface to be processed on at least one electrode of an R.F. driven reactor having two parallel plate electrodes; passing reactive gas through the reactor t

대표청구항

A process for figuring a surface by plasma assisted chemical transport comprising the steps of: mounting the surface to be processed on at least one electrode of an R.F. driven reactor having two substantially parallel plate electrodes; passing reactive gas through said reactor to establish gas disc

이 특허에 인용된 특허 (10)

  1. Bessot Jean-Jacques (Arpajon FRX) Bourdon Bernard (Gometz le Chatel FRX), Apparatus for chemically activated deposition in a plasma.
  2. Cuomo Jerome J. (Lake Lincolndale NY) Leary Pamela A. (Wappingers Falls NY) Yee Dennis S. (Putnam Valley NY), Copper texturing process.
  3. Tsukada Tsutomu (Tokyo JPX) Wani Etsuo (Tokyo JPX) Ukai Katsumi (Tokyo JPX) Saitoh Teruo (Tokyo JPX), Dry etching apparatus comprising etching chambers of different etching rate distributions.
  4. Higashikawa Iwao (Tokyo JPX) Arikado Tsunetoshi (Tokyo JPX), Dry etching method for organic material layers.
  5. Abe, Naomichi, Method and apparatus for dry etching and electrostatic chucking device used therein.
  6. Shibayama Hikou (Machida JPX) Ogawa Tetsuya (Machida JPX) Kosugi Makoto (Yokohama JPX) Hisatsugu Tokushige (Chofu JPX) Kobayashi Koichi (Yokohama JPX), Method and apparatus for plasma etching.
  7. Yamazaki Takashi (Kawasaki JPX), Plasma etching apparatus.
  8. Shanefield Daniel J. (Princeton Township ; Mercer County NJ) Verdi Fred W. (Lawrence Township ; Mercer County NJ), Printed wiring boards.
  9. Bril Thijs W. (Sunnyvale CA) van den Hoek Willibrordus G. M. (Eindhoven NLX), Reactive ion etching of soft-magnetic substrates.
  10. Hope Lawrence L. (Stow MA) Davey Ernest A. (Peabody MA), Sputtering cathode apparatus.

이 특허를 인용한 특허 (27)

  1. Carr,Jeffrey W., Apparatus and method for atmospheric pressure reactive atom plasma processing for shaping of damage free surfaces.
  2. Wadsworth Larry C. ; Jirsak Oldrich,CZX ; Tsai Peter Ping-Yi, Composite of pleated and nonwoven webs.
  3. Spence Paul D., Discharge method and apparatus for generating plasmas.
  4. Spence Paul D., Discharge methods and electrodes for generating plasmas at one atmosphere of pressure, and materials treated therewith.
  5. Chen,Xing; Holber,William M.; Cowe,Andrew Barnett; Georgelis,Eric; Bystyak,Ilya M.; Bortkiewicz,Andrzej, Inductively-coupled torodial plasma source.
  6. Chen, Xing; Holber, William M.; Cowe, Andrew Barnett; Georgelis, Eric; Bystyak, Ilya M.; Bortkiewicz, Andrzej, Inductively-coupled toroidal plasma source.
  7. Smith, Donald K.; Chen, Xing; Holber, William M.; Georgelis, Eric, Inductively-coupled toroidal plasma source.
  8. Roth John Reece, Method and apparatus for cleaning surfaces with a glow discharge plasma at one atmosphere of pressure.
  9. Holber, William M.; Smith, John A.; Chen, Xing; Smith, Donald K., Method and apparatus for processing metal bearing gases.
  10. Holber, William M.; Smith, John A.; Chen, Xing; Smith, Donald K., Method and apparatus for processing metal bearing gases.
  11. Holber, William M.; Smith, John A.; Chen, Xing; Smith, Donald K., Method and apparatus for processing metal bearing gases.
  12. Wadsworth Larry C. (Knoxville TN) Tsai Peter Ping-yi (Knoxville TN), Method and apparatus for the electrostatic charging of a web or film.
  13. Carr, Jeffrey W., Method for atmospheric pressure reactive atom plasma processing for surface modification.
  14. Kamata Takeshi,JPX ; Arimoto Hiroshi,JPX, Method for plasma treatment and apparatus for plasma treatment.
  15. Zarowin Charles B. ; Baron Robert, Plasma assisted chemical transport method and apparatus.
  16. Vandamme Roland ; Desai Ankur ; Witte Dale ; Xin Yun-Biao, Process for reducing waviness in semiconductor wafers.
  17. Paul D. Spence, Resonant excitation method and apparatus for generating plasmas.
  18. Turner Terry R. ; Belcher James F. ; Andrews Gary W., Retractable probe system with in situ fabrication environment process parameter sensing.
  19. Turner Terry R. ; Belcher James F. ; Andrews Gary W., Retractable probe system with in situ fabrication environment process parameter sensing.
  20. Kulkarni Milind ; Desai AnKur, Silicon wafering process flow.
  21. Donald K. Smith ; Xing Chen ; William M. Holber ; Eric Georgelis, Toroidal low-field reactive gas source.
  22. Donald K. Smith ; Xing Chen ; William M. Holber ; Eric Georgelis, Toroidal low-field reactive gas source.
  23. Smith, Donald K.; Chen, Xing; Holber, William M.; Georgelis, Eric, Toroidal low-field reactive gas source.
  24. Smith, Donald K.; Chen, Xing; Holber, William M.; Georgelis, Eric, Toroidal low-field reactive gas source.
  25. Smith, Donald K.; Chen, Xing; Holber, William M.; Georgelis, Eric, Toroidal low-field reactive gas source.
  26. Smith,Donald K.; Chen,Xing; Holber,William M.; Georgelis,Eric, Toroidal low-field reactive gas source.
  27. Li, Chih-Yang, Wafering method comprising a plasma etch with a gas emitting wafer holder.
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