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Air cooling assembly in an electronic system enclosure 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0894189 (1986-08-07)
발명자 / 주소
  • Speraw Floyd G. (Lexington SC)
출원인 / 주소
  • NCR Corporation (Dayton OH 02)
인용정보 피인용 횟수 : 71  인용 특허 : 9

초록

An air cooling assembly in an electronic system enclosure having an upper wire rack and a lower wire rack. A plurality of logic module cassettes are located between the upper and lower wire racks and are provided with openings so that cooling air drawn through parallel rods in the wire racks pass th

대표청구항

In an electronic systems enclosure, an air cooling apparatus comprising: a cabinet having an upper wire rack and a lower wire rack, each of said upper and lower wire racks having spaced apart, parallel rods; a plurality of logic module cassettes, each logic module module cassette having a vertical m

이 특허에 인용된 특허 (9)

  1. Wright Kurt O. (Sun Valley CA) Brehm Timothy L. (Irvine CA) Berger Duaine E. (Los Angeles CA) Matsuoka Paul S. (Culver City CA), Air baffle assembly for electronic circuit mounting frame.
  2. Tajima Tsuneaki (Tokyo JPX) Matsuo Yohichi (Tokyo JPX), Air cooling equipment for electronic systems.
  3. Goldberg Norman (Dresher PA), Apparatus for cooling integrated circuit chips.
  4. Meggs Jean-Pierre (Bondy FRX), Card frame for circuit cards.
  5. Hwang Un-Pah (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY), Dual-pull air cooling for a computer frame.
  6. Matsui Kiyoshi (Kawasaki JPX) Arai Katsuyuki (Kawasaki JPX) Shinbashi Sueo (Kawasaki JPX), Natural air cooled rack for vertically disposed printed boards.
  7. Koppensteiner James V. (Chicago IL) Kaczkos John E. (Elk Grove Village IL), Printed wiring board assembly employing track engaging runners.
  8. Skroupa James D. (Ellicott City MD), Replaceable air seal for force cooled removable electronic units.
  9. Bartholomew Wesley E. (Palos Verdes CA), Thermally controlled electronic system package.

이 특허를 인용한 특허 (71)

  1. Schwartz, Harold O.; Hill, Rick B.; Fink, Ronald G., Air treatment apparatus and methods.
  2. John R. Sterner, Apparatus to enhance cooling of electronic device.
  3. John R. Sterner, Apparatus to enhance cooling of electronic device.
  4. John R. Sterner, Apparatus to enhance cooling of electronic device.
  5. John R. Sterner, Apparatus to enhance cooling of electronic device.
  6. John R. Sterner, Apparatus to enhance cooling of electronic device.
  7. John R. Sterner, Apparatus to enhance cooling of electronic device.
  8. Sterner John R., Apparatus to enhance cooling of electronic device.
  9. Sterner,John R., Apparatus to enhance cooling of electronic device.
  10. Lin, Shih-Jen, CPU cooling structure.
  11. Pritchett,Robert L., Cage for printed circuit board.
  12. Miles Michael D., Card guide with airflow shutters.
  13. Banton, Randall G.; Blanchet, Don W.; Bardo, Jason E.; Gust, Mike W.; Zuidema, Paul N., Card-cage with integrated control and shaping of flow resistance curve for multiple plenum chambers.
  14. Banton, Randall G.; Blanchet, Don W.; Freeburn, Jr., John R.; Bardo, Jason E.; Gust, Mike W.; Zuidema, Paul N., Central inlet circuit board assembly.
  15. Banton, Randall G.; Blanchet, Don W.; Freeburn, Jr., John R.; Bardo, Jason E.; Gust, Mike W.; Zuidema, Paul N., Circuit board assembly for use in a central inlet chassis configuration.
  16. Banton, Randall G.; Blanchet, Don W.; Freeburn, Jr., John R.; Bardo, Jason E.; Rocco, Jr., A. Gregory; Gust, Mike W.; Zuidema, Paul N., Circuit board assembly with a combination thermal, shock, vibration, and/or electromagnetic compatibility cover.
  17. Banton, Randall G.; Blanchet, Don W.; Bardo, Jason E.; Gust, Mike W.; Zuidema, Paul N., Circuit board assembly with integrated shaping and control of flow resistance curve.
  18. Sisler, John Robert, Circuit card and cage arrangement with improved cooling.
  19. Sarath Alan (Teaneck NJ), Communication equipment cabinet cooling arrangement.
  20. Wintersteen, Douglas Charles; Chatt, David M.; Pinger, Chad S.; O'Dwyer, Luke E., Computer enclosure air distribution system.
  21. Coglitore,Giovanni, Computer rack cooling system with variable airflow impedance.
  22. Klein, David, Computer server heat regulation utilizing integrated precision air flow.
  23. Klein, David, Computer server heat regulation utilizing integrated precision air flow.
  24. Sharp, Anthony C.; Hudz, Andrew; Jeffery, Peter, Cooling airflow distribution device.
  25. Sharp, Anthony C.; Hudz, Andrew; Jeffery, Peter, Cooling airflow distribution device.
  26. Sharp, Anthony C.; Hudz, Andrew; Jeffery, Peter, Cooling airflow distribution device.
  27. Sharp,Anthony C.; Hudz,Andrew; Jeffery,Peter, Cooling airflow distribution device.
  28. Sharp,Anthony C.; Hudz,Andrew; Jeffery,Peter, Cooling airflow distribution device.
  29. Day, Tony, Data center cooling.
  30. Day, Tony, Data center cooling.
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  34. Scofield William Harold, Device and method for dissipating thermal energy of electronic circuit components.
  35. Banton, Randall G.; Blanchet, Don W.; Freeburn, Jr., John R.; Bardo, Jason E.; Rocco, Jr., A. Gregory; Gust, Mike W.; Zuidema, Paul N., Digital data processor chassis with flow balanced air intake into multiple circuit board assemblies.
  36. Kiyoshi Omori JP; Ryuzo Tamayama JP, Disk device.
  37. Omori, Kiyoshi; Tamayama, Ryuzo, Disk device.
  38. Bachman Wesley H. ; Baska Douglas A. ; Butterbaugh Matthew Allen ; Kang Sukhvinder Singh ; Lubahn Kenneth Edward ; Mullenbach Brian Scott ; Qualters Kevin Robert, Enhanced circuit board arrangement for a computer.
  39. Broome, John P., Equipment rack with integral HVAC and power distribution features.
  40. Foley John M. (Grafton MA) Piuze Ronald L. (Shrewsbury MA) Larson ; Jr. Ralph I. (Bolton MA) Doumani George (North Andover MA), Heat exchange element and enclosure incorporating same.
  41. Sygulla, John Michael; Ramakrishnan, Arun; Slowiak, Greg, Hierarchical system manager rollback.
  42. Barringer, Dennis R.; Corcoran, Philip M.; Kostenko, William P.; Seminaro, Edward J., High density modular input/output package in a data processing system.
  43. Shabany, Younes; Yum, Hans; Collis, Todd; Bisbikis, Steve; Koo, Steve; Miller, Kieran, Increasing air inlet/outlet size for electronics chassis.
  44. McEwan John A. ; McEwan James Stewart, Low profile computer case and computer.
  45. McEwan,John A.; McEwan,James Stewart, Low profile computer case and computer.
  46. Satou Jun-ichi,JPX ; Yamazaki Akihiro,JPX, Magnetic tape drive unit having reduced power consumption.
  47. Smith, John V.; Hester, Victor P.; Wylie, William A., Method and apparatus for rack mounting computer components.
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  49. Earl W. Boone, Method and system for cooling a card shelf.
  50. Brehin, Françoise; Dupeux, Patrick; Bernadac, Serge, Modular electronic assembly rack and modular electronic assembly comprising such a rack.
  51. Smith, John V.; Hester, Victor P., Portable diagnostic apparatus for computer components and systems and method of using same.
  52. Hileman Vince ; Furuta Steven J. ; Kitlas Kenneth ; Gross Kenneth ; Vu Quyen ; Winick Lee ; Mitty Nagaraj P. ; Willis Clifford B., Pulsar desk top system that will produce 500 watts of heat.
  53. Smith, John V.; Hester, Victor P.; Wylie, William A., Rack mountable computer component and method of making same.
  54. Smith, John V.; Hester, Victor P.; Wylie, William A., Rack mountable computer component fan cooling arrangement and method.
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  56. Smith, John V.; Hester, Victor P.; Wylie, William A., Rack mountable computer component power distribution unit and method.
  57. David Dickey ; Richard B. Nelson ; Seiya Ohta, Removable component filter.
  58. Biemer, Michael G.; Konsowski, Stephen C.; Haas, Tiffani; Krywicki, Jason, Ruggedized, self aligning, sliding air seal for removable electronic units.
  59. Kinstle, Robert Michael; Schlichter, Kevin; Barron, Seitu, Server with heat pipe cooling.
  60. Kinstle, Robert Michael; Schlichter, Kevin; Barron, Seitu, Server with heat pipe cooling.
  61. Ecker, Richard M.; Peets, Michael T.; Genest, Robert R., Structural support module to prevent common interface deflection.
  62. Aigo Seiichiro (3-15-13 Negishi ; Daito-ku ; Tokyo JPX), Support frame for supporting a semiconductor wafer carrier.
  63. O'Dell Michael P. ; Fahey Phillip J., Switchgear with improved ventilation.
  64. Medin David T. ; Bodensteiner John, System and method for cooling compact PCI circuit cards in a computer.
  65. Claassen, Alan; Hamann, Hendrik F.; Iyengar, Madhusudan K.; Lacey, James A.; Martin, Yves C.; Schmidt, Roger R.; van Kessel, Theodore G., Techniques for data center cooling.
  66. Claassen, Alan; Hamann, Hendrik F.; Iyengar, Madhusudan K.; Lacey, James Andrew; Martin, Yves C.; Schmidt, Roger R.; van Kessel, Theodore Gerard, Techniques for data center cooling.
  67. Sakamoto,Shigeo; Nagase,Kenji; Taya,Kazuaki, Vent grid and electronic apparatus employing the same.
  68. Robbins, Shane R.; Turner, David, Ventilated housing for electronic components.
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  70. Ater Dan,ILX ; Avitan Eli,ILX, Ventilation and cooling control system for modular platforms.
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