초록 ▼

The present disclosure describes an air cooling system which has the ability to maintain acceptable temperature levels in present day high density electronic equipment. More specifically, the system provides an arrangement whereby each printed circuit card has its own ducting structure affixed there

The present disclosure describes an air cooling system which has the ability to maintain acceptable temperature levels in present day high density electronic equipment. More specifically, the system provides an arrangement whereby each printed circuit card has its own ducting structure affixed thereto to form an integral unit. Cooling air streams are directed simultaneously from individual apertures in the ducting structure upon a respective plurality of integrated circuit package assemblies mounted on the card.

대표청구항 ▼

A parallel-flow air system disposed in a cabinet, having a source of cooling air comprising: at least one integral card-duct assembly, including a printed circuit card and an associated ducting structure, means for retaining said card and said ducting structure in fixed, parallel spaced-apart relati

A parallel-flow air system disposed in a cabinet, having a source of cooling air comprising: at least one integral card-duct assembly, including a printed circuit card and an associated ducting structure, means for retaining said card and said ducting structure in fixed, parallel spaced-apart relationship, said card having a plurality of integrated circuit package assemblies mounted thereon in a predetermined spaced-apart columnar relationship, said ducting structure including a plurality of finger-like ducts disposed in spatial correspondence with the columnar arrangement of said package assemblies, each of said ducts having a plurality of apertures homologously positioned with respect to said package assemblies, means including said source of cooling air for causing air flow into said ducts and out of said apertures, thereby directing individual streams of cooling air simultaneously upon the respective package assemblies, and wherein each of said integrated circuit package assemblies includes a heat sink member affixed to an integrated circuit package, said heat sink member comprised of a frame, a pair of metallic corrugated sections mounted in said frame in spaced-apart fashion such that an opening is formed therebetween, each of said streams of cooling air emanating from said apertures being directed substantially toward the last mentioned opening in said heat sink member.