초록 ▼

A relatively thin broad-area dielectric interfacing composed of dual filled layers of compliant silicone rubber in sandwiching relation to a porous glass-cloth carrier, one of the layers being pre-vulcanized and the other being subsequently cured and bonded in place once the composite interfacing ha

A relatively thin broad-area dielectric interfacing composed of dual filled layers of compliant silicone rubber in sandwiching relation to a porous glass-cloth carrier, one of the layers being pre-vulcanized and the other being subsequently cured and bonded in place once the composite interfacing has been applied to heat-sink surfaces adapted for abutment with the device for the intended heat transfer. The soft rubber interfacing offers good dielectric and insulating and voltage-breakdown characteristics even when well loaded with thermally-conductive oxides, and intimate voidless surface contacts and high-quality thermal matching are fostered both along abutting compliant surfaces of the pre-cured portion of the interfacing and along fully bonded surfaces of the portion cured in situ. Processing which makes such interfacing eminently practical and particularly advantageous to the user includes initial application of filled uncured rubber to one side of a sheet of the porous carrier, followed by its vulcanization and then by application of a further uncured amount to the opposite side of the carrier. A protective peel-off plastic covering is used to facilitate handling and release-cutting of desired smaller wafer configurations from the large area composite. Uncured sides of the smaller peeled wafers are then mated with appropriate parts of heat sinks and cured.

대표청구항 ▼

The method of preparing an interfacing for conducting heat between an electronic device or the like and a heat sink having complementary surfaces disposed to confront and communicate heat therefrom, comprising the steps of: (a) producing a first thin and substantially amorphous layer of heat-conduct

The method of preparing an interfacing for conducting heat between an electronic device or the like and a heat sink having complementary surfaces disposed to confront and communicate heat therefrom, comprising the steps of: (a) producing a first thin and substantially amorphous layer of heat-conducting material having compliant properties of an elastomeric substance when cured; (b) curing said layer to a dry and relatively firm state, applying and sticking to one side of said first layer a second thin layer of uncured heat-conducting material in a substantially amorphous condition; (c) temporarily covering the exposed side of said second layer while it is in an uncured condition with a strippable liner removable to expose the material thereof for attachment to and subsequent curing and bonding with said complementary surfaces, said uncured material being one which tends to adhere to said first layer and said complementary surfaces and being controllably curable to form a permanent bond with both said one side of said first layer and said complementary surfaces of the heat sink; (d) said steps of producing a first and second layer are carried out using a material consisting essentially of silicone rubber having relatively minute particles of heat-conducting material distributed therethrough and by applying the material in the substantially amorphous state to one side of a relatively thin carrier consisting essentially of glass fibers before curing it to form the first layer; and (e) said method further comprising the steps of stripping the liner away to expose the uncured material of the second layer, pressing the exposed uncured material of the second layer into substantially voidless engagement with the said complementary surfaces of a heat sink, and, while so pressing the material of the said second layer, curing that material in place.