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Daughter board/backplane assembly 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-023/68
출원번호 US-0817013 (1986-01-08)
발명자 / 주소
  • Johnson Lennart B. (Milford NH)
출원인 / 주소
  • Teradyne, Inc. (Boston MA 02)
인용정보 피인용 횟수 : 91  인용 특허 : 4

초록

A daughter board/backplane assembly including a backplane having first and second surfaces and holes extending from the first surface to the second surface, pairs of separate first contacts having first ends mounted in the holes and second ends extending from both ends of the holes, the second ends

대표청구항

A daughter board/backplane assembly comprising a backplane having first and second surfaces and holes extending from said first surface to said second surface, pairs of separate first contacts having first ends mounted in said holes and second ends extending from opposite ends of said holes, each sa

이 특허에 인용된 특허 (4)

  1. Berg William C. (Stillwater MN), Board to board interconnect structure.
  2. Benasutti John E. (North Wales PA), Electrical connector for printed wiring board.
  3. Williams John T. (Chippewa Falls WI) August Melvin C. (Chippewa Falls WI), Interconnected multiple circuit module.
  4. Tamburro ; Peter James, Interconnection pin for multilayer printed circuit boards.

이 특허를 인용한 특허 (91)

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  4. Sasaki Takinori,JPX ; Tayama Yukiharu,JPX ; Matsuda Takahiro,JPX, Backplane connector and method of assembly thereof to a backplane.
  5. Mitra Niranjan Kumar,NLX, Bending mandrel for use in manufacturing an electrical connector.
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  11. Jia, Gongxian, Circuit board interconnection system, connector assembly, circuit board and method for manufacturing a circuit board.
  12. Porter Warren W. (Escondido CA), Computer backpanel inversion coupler.
  13. Scherer, Richard J.; Meredith, Kevin R.; Kusters, Johannes P. M., Connector apparatus.
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  23. Brodsky, William L.; Genest, Robert R.; Loparco, John J.; Peets, Michael T.; Torok, John G., Doubling available printed wiring card edge for high speed interconnect in electronic packaging applications.
  24. Anderson Russell Y. (Mesa AZ), Dual connector printed circuit board assembly and method.
  25. Barr, Alexander W.; Lee, William J.; Staley, Charles F., Electrical connector.
  26. Barr, Alexander W.; Lee, William J.; Staley, Charles F., Electrical connector.
  27. Cohen, Thomas S.; Kirk, Brian Peter; Dunham, John R., Electrical connector assembly with improved shield and shield coupling.
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  30. Fedder, James L.; Glover, Douglas W.; Helster, David W.; Morgan, Chad W.; Rothermel, Brent; Sharf, Alex M.; Taylor, Attalee S.; Trout, David A., Electrical connector having improved terminal configuration.
  31. Fedder, James L.; Glover, Douglas W.; Helster, David W.; Morgan, Chad W.; Rothermel, Brent; Sharf, Alex M.; Taylor, Attalee S.; Trout, David A., Electrical connector having improved terminal configuration.
  32. Chien, Chih-Ming; Pan, Feng, Electrical connector with improved impedance continuity.
  33. Cartier, Marc B.; Kirk, Brian, Electrical connector with signal conductor pairs having offset contact portions.
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  35. Lindeman Richard J. (Wood Dale IL), Electrical connectors.
  36. Lindeman Richard J. (Wood Dale IL), Electrical connectors.
  37. Harting Dietmar,DEX ; Pape Gunter,DEX ; Forster Karin,DEX, Electrical plug connector.
  38. Korsunsky, Iosif R.; Brown, Robert W.; Lee, Wei-Chen; Shipe, Joanne E.; Walker, Kevin E.; Harlan, Tod M., Electrical system having means for accommodating various distances between PC boards thereof mounting the means.
  39. Fedder, James L.; Taylor, Attalee S.; Trout, David A., Electrical terminal having improved insertion characteristics and electrical connector for use therewith.
  40. Fedder, James L.; Taylor, Attalee S.; Trout, David A., Electrical terminal having tactile feedback tip and electrical connector for use therewith.
  41. Barnett Roy (Nashua NH), Electrically connecting.
  42. Suzuki Takao (Ohme JPX) Uekido Kouzou (Tokyo JPX), Electronic device packaging structure.
  43. Beer, Robert C., Electronics module with a side entry connection.
  44. Werdin David A. (Eagan MN) Henke Reinhold (St. Paul MN), Front-rear modular unit.
  45. Ortega, Jose L.; Stoner, Stuart C.; Raistrick, Alan, Header assembly for mounting to a circuit substrate and having ground shields therewithin.
  46. Grabbe Dimitry G. (Middletown PA) Granitz Richard F. (Harrisburg PA) Bakker Roel J. (York PA) Milbrand ; Jr. Donald W. (Mechanicsburg PA) Masterson Earl E. (Minneapolis MN), High density coax connector.
  47. Joseph B. Shuey, High density electrical connector assembly.
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  77. Patriche, Dorinel, Midplane for data processing apparatus.
  78. Stokoe, Philip T.; Ekstrom, Edward C., Modular board to board connector.
  79. Crane, Jr., Stanford W.; Jeon, Myoung-soo; Nickel, Josh, Modular coaxial electrical interconnect system having a modular frame and electrically shielded signal paths and a method of making the same.
  80. Goers, Andreas; Michel, Helmut; Bleil, Reiner, Modular system.
  81. Jeon, Myoungsoo, PCB bridge connector for connecting PCB devices.
  82. Lappoehn,Juergen, Plug connection adapter.
  83. Ortega, Jose L.; Olson, Stanley W., Profiled header ground pin.
  84. Minich, Steven E., Shared hole orthogonal footprint with backdrilled vias.
  85. Ravid Gonen (29034 Acanthus Ct. Agoura Hills CA 91301), Specialized frame for retaining an edge connector on a printed circuit board.
  86. Belanger ; Jr. Thomas D. (Clarendon Hills IL), Substrate carrier device.
  87. Sample Stephen P. ; Goode Terry L., Switching midplane and interconnecting system for interconnecting large numbers of signals.
  88. Topolewski, John N.; Hampo, Richard J., System for electrically connecting a pair of circuit boards using a pair of board connectors and an interconnector received in apertures of the circuit boards.
  89. Wurster Woody, Tailess compliant contact.
  90. Hasircoglu Alexander W. (Lancaster PA), Terminal lead shielding for headers and connectors.
  91. Philip K. Edholm, Virtual midplane to enhance card interconnections using a matrix of interconnecting assemblies.
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