초록 ▼

The present invention relates to a printed circuit board and to a method of manufacturing the same. The printed circuit board has a reinforcing panel glued to the surface of a resin board. The resin board is provided with at least one circuit layer and through holes. The reinforcing panel contains a

The present invention relates to a printed circuit board and to a method of manufacturing the same. The printed circuit board has a reinforcing panel glued to the surface of a resin board. The resin board is provided with at least one circuit layer and through holes. The reinforcing panel contains a core in a plate form and is made of at least one curved board and a metal board glued at least to one side of the core. The reinforcing panel is provided with resin holes, the resin holes are filled with resin, and a lead wire hole is provided through the center of the filled-in resin. The center line of the through hole and that of the lead wire hole are almost identical. The manufacturing method provides a lead wire hole through the center of each resin filled hole in a reinforcing panel by a drilling device assisted by a hole position designating means. Thereafter, the reinforcing panel and a resin board having at least one circuit layer and through holes are glued together keeping the center line of each through hole and that of each corresponding lead wire hole almost identical.

대표청구항 ▼

A printed circuit board, comprising: a resin board having at least one circuit layer and a plurality of through holes formed therein; a reinforcing panel disposed on a surface of said resin board, said reinforcing panel comprising: a core in a plate form containing at least one curved board, a metal

A printed circuit board, comprising: a resin board having at least one circuit layer and a plurality of through holes formed therein; a reinforcing panel disposed on a surface of said resin board, said reinforcing panel comprising: a core in a plate form containing at least one curved board, a metal board disposed on at least one side of the core, a plurality of resin filled through holes provided in said reinforcing panel, and a lead wire hole disposed in the center of each of said resin filled holes; wherein the centers of each of said through holes and each of said lead wire holes are substantially on an identical line.