초록 ▼

A method for producing a film over a topologically non-planar surface of a material which has a sputter etch rate which is higher in a direction parallel to the plane of the wafer than in a direction perpendicular to the plane of the wafer. Key steps in the process include first, depositing the mate

A method for producing a film over a topologically non-planar surface of a material which has a sputter etch rate which is higher in a direction parallel to the plane of the wafer than in a direction perpendicular to the plane of the wafer. Key steps in the process include first, depositing the material by plasma enhanced chemical vapor deposition while simultaneously sputter etching it. Then second, sputter etching the material. Using this two step process, a substantially conformal or sloped film is produced by repeating the steps consecutively until the desired thickness is obtained. The film can then be substantially planarized if desired, by an extended sputter etch to selectively remove material having a sloped surface rather than a flat surface, since the etch rate is higher parallel to the plane of the wafer than perpendicular to the wafer. If a thicker planar surface is desired, additional material can then be deposited by steps of simultaneous plasma chemical vapor deposition and sputter etch, or by consecutive steps of simultaneous plasma deposition and sputter etch followed by sputter etching.

대표청구항 ▼

A method of producing a film over a wafer that has a topologically non-planar surface of a material having an RF sputter etch rate which is higher in a direction parallel to the plane of the wafer than perpendicular to the plane of the wafer, comprising the steps of: (1) depositing said material by

A method of producing a film over a wafer that has a topologically non-planar surface of a material having an RF sputter etch rate which is higher in a direction parallel to the plane of the wafer than perpendicular to the plane of the wafer, comprising the steps of: (1) depositing said material by plasma enhanced chemical vapor deposition while simultaneously sputter etching said material as it is deposited; (2) after step 1, sputter etching said material; and (3) repeating steps 1 and 2 as a pair N times, where N is an integer and N≥1.