초록 ▼

In an IC card, contact pads 7A and wiring patterns 7B are formed on a sheet-like structure and contact segments 7-1 to 7-8 are formed on the contact pads 7A. Main chip 5 and sub-chip 6 are mounted on the sheet-like structure. A sheet film is laminated on the sheet-like structure and the contact segm

In an IC card, contact pads 7A and wiring patterns 7B are formed on a sheet-like structure and contact segments 7-1 to 7-8 are formed on the contact pads 7A. Main chip 5 and sub-chip 6 are mounted on the sheet-like structure. A sheet film is laminated on the sheet-like structure and the contact segments are fitted in openings of the sheet film. The sheet film has a thickness substantially equal to that of the contact segments.

대표청구항 ▼

An IC card comprising: at least one IC chip having electrical terminals; a sheet-like structure having one surface and supporting said IC chip; internal connecting members formed on said one surface of said sheet-like structure and including a plurality of connection pads to be connected to the exte

An IC card comprising: at least one IC chip having electrical terminals; a sheet-like structure having one surface and supporting said IC chip; internal connecting members formed on said one surface of said sheet-like structure and including a plurality of connection pads to be connected to the external device and wiring patterns connecting said connection pads to said terminals of said IC chip; a sheet film having openings facing said connection pads and covering said one surface of said sheet-like structure; and contact segments formed on said connection pads, having a thickness substantially equal to the thickness of said sheet film and fitted in said first openings.