초록 ▼

A semiconductor device comprises a substrate, a semiconductor element mounted on the substrate, a cap having an opening smaller than the external size of the semiconductor element for covering the semiconductor element to provide a hermetic seal, and a heatsink member mounted on the cap to cover the

A semiconductor device comprises a substrate, a semiconductor element mounted on the substrate, a cap having an opening smaller than the external size of the semiconductor element for covering the semiconductor element to provide a hermetic seal, and a heatsink member mounted on the cap to cover the opening and to make contact with the semiconductor element via the opening, so that heat generated by the semiconductor element is conducted directly to the heatsink member. A method of producing the semiconductor device comprises the steps of mounting the semiconductor element on the substrate, covering the semiconductor element by the cap which is fixed to the substrate, and mounting the heatsink member on the cap to cover the opening and to make contact with the semiconductor element via the opening.

대표청구항 ▼

A semiconductor device comprising: a substrate having at least one wiring layer formed on a top surface thereof; at least one semiconductor element mounted with a top face thereof downward on said substrate and electrically coupled to said wiring layer; a cap having at least one opening which is sma

A semiconductor device comprising: a substrate having at least one wiring layer formed on a top surface thereof; at least one semiconductor element mounted with a top face thereof downward on said substrate and electrically coupled to said wiring layer; a cap having at least one opening which is smaller than an external size of said semiconductor element, a peripheral portion of said cap being adhered on the top surface of said substrate and a portion of said cap around said opening being adhered on a bottom face of said semiconductor element to thereby hermetically seal said semiconductor element; and a heatsink member mounted on said cap, said heatsink member having a portion which fits into said opening and makes contact with the bottom face of said semiconductor element.