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Leak tolerant liquid cooling system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0918057 (1986-10-14)
발명자 / 주소
  • Tustaniwskyj Jerry I. (Mission Viejo CA) Halkola Kyle G. (San Diego CA)
출원인 / 주소
  • Unisys Corporation (Detroit MI 02)
인용정보 피인용 횟수 : 34  인용 특허 : 5

초록

A leak tolerant cooling system, for cooling electrical components with a liquid comprises: a frame holding a plurality of printed circuit boards, each of which have electrical components attached thereto; a top reservoir, mounted on the frame above the boards, for holding the liquid at atmospheric p

대표청구항

A leak tolerant cooling system, which cools electrical components with a liquid, comprising: a frame holding a plurality of said electrical components; a top reservoir, mounted on said frame above said components, holding said liquid; a conduit means, coupled to said top reservoir and said component

이 특허에 인용된 특허 (5)

  1. Allen Paul E. (Newtown CT), Cooling system for plastic molds.
  2. Morrison Robert A. (Granada Hills CA) Frink Attila (Northridge CA), Electronic packaging module utilizing phase-change conductive cooling.
  3. Lewis Terrence E. (San Diego CA) Smiley Stephen A. (San Diego CA) Rice Rex (Menlo Park CA) Lipkes Zeev (Poway CA) Nelson John A. (San Diego CA), Integrated circuit package incorporating low-stress omnidirectional heat sink.
  4. Scholl Gunter (Via Orselina Locarno-Muralto CHX CH-660), Method of and system for storing heat.
  5. Allen Paul E. (Newtown CT), Plastic mold negative pressure cooling system.

이 특허를 인용한 특허 (34)

  1. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for facilitating dissipation of heat from a liquid-cooled electronics rack.
  2. Harrington, Steve, Computer cooling system and method of use.
  3. Fonfara,Harald; G��stl,Herbert; Miltkau,Thorsten; Eberl,Markus; Mollik,Ralf, Cooling device for an electronic component, especially for a microprocessor.
  4. Chen, Chien-An; Fan, Mu-Shu; Chen, Chien-Yu, Cooling liquid distribution device.
  5. Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Electronic apparatus.
  6. Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Electronic apparatus.
  7. Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Electronic apparatus including liquid cooling unit.
  8. Aoki, Hitoshi; Kubota, Junichi; Komatsubara, Takeo; Motegi, Junichi; Kakinuma, Hirotaka; Otsuka, Naoki; Matsuoka, Masaya, Electronic device.
  9. Davis, Simon Peter, Electronic system.
  10. Attlesey, Chad Daniel; Williamson, Scott; Fjerstad, Wayne, Gravity assisted directed liquid cooling.
  11. Ishikawa, Hiroshi; Amada, Tadao; Shinohara, Satoshi; Takada, Kyoichi; Ishizaka, Ken'ichi, Heat exchange device, electronic system, and cooling method of electronic system.
  12. Payne, Dave A., High efficiency pump for liquid-cooling of electronics.
  13. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Immersion-cooling of selected electronic component(s) mounted to printed circuit board.
  14. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Immersion-cooling of selected electronic component(s) mounted to printed circuit board.
  15. Smith, Stephen W.; Creek, William R., Integrated micromachine relay for automated test equipment applications.
  16. Smith, Stephen W.; Creek, William R., Integrated micromachine relay for automated test equipment applications.
  17. Jaskari, Jukka; Miettinen, Osmo; Strandberg, Stefan, Liquid cooling arrangement.
  18. Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Liquid cooling unit and heat exchanger therefor.
  19. Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Liquid cooling unit and heat receiver therefor.
  20. Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Liquid cooling unit and heat receiver therefor.
  21. Ostwald, Timothy C.; Plutt, Daniel J.; Manes, Joseph P., Method and apparatus for liquid cooling computer equipment.
  22. Tustaniwskyi,Jerry Ihor; Babcock,James Wittman, Method of maintaining an IC-module near a set-point.
  23. Madison, Jr., Carl T.; Kostraba, Jr., John R., Molded heat sink and method of making same.
  24. Krug, Jr., Francis R.; Zoodsma, Randy J., Multifunction coolant manifold structures.
  25. Krug, Jr., Francis R.; Zoodsma, Randy J., Multifunction coolant manifold structures.
  26. Krug, Jr., Francis R.; Zoodsma, Randy J., Multifunction coolant manifold structures.
  27. Harrington, Steve; Deangelis, Peter C.; Campbell, William C, No drip hot swap connector and method of use.
  28. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Redundant assembly for a liquid and air cooled module.
  29. Kobayashi Shiro (Hitachi JPX) Itoh Masahiko (Hitachiota JPX) Izumiya Masakiyo (Mito JPX), Semiconductor module and an electronic computer using the semiconductor module.
  30. Palmer,Randall T., Server farm liquid thermal management system.
  31. St.ang.hl Lennart ; Wallace ; Jr. John Francis ; Parraz John Cardenas ; Clark Montford Henry ; Winn David, Spray hood protector in a fluid-based cooling system.
  32. Tustaniwskyi,Jerry Ihor; Babcock,James Wittman, Temperature control system which sprays liquid coolant droplets against an IC-module at a sub-atmospheric pressure.
  33. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Thermoelectric-enhanced, liquid-cooling apparatus and method for facilitating dissipation of heat.
  34. Harrington, Steve, Vacuum pumped liquid cooling system for computers.
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