초록 ▼

The method and arrangement according to the invention utilize an adhesive tape (1) covered with a protective layer (2) provided with openings (4). This tape is glued on a film (5) carrying contact metallizations (8) and integrated circuit chips (6) electrically connected to the said metallizations.

The method and arrangement according to the invention utilize an adhesive tape (1) covered with a protective layer (2) provided with openings (4). This tape is glued on a film (5) carrying contact metallizations (8) and integrated circuit chips (6) electrically connected to the said metallizations. The tape is glued on the film in such a manner that its openings (4) correspond to the positions of the integrated circuit chips (6). Subsequently, a coating varnish is applied by pulverization to the film and then the protective layer is removed with the varnish covering it. Vignettes slightly larger than the said openings are then cut in the film in such a manner that an adhesive ring is left around the integrated circuit chips. Each vignette is finally arranged in a recess ad hoc (12) of a card (10).

대표청구항 ▼

A method of manufacturing an electronic identification card with at least one integrated circuit chip wherein the chip is mounted in a cavity in a carrier film having conductor tracks, said carrier film being cut to form a section which supports said chip, said section to be disposed in a recess pro

A method of manufacturing an electronic identification card with at least one integrated circuit chip wherein the chip is mounted in a cavity in a carrier film having conductor tracks, said carrier film being cut to form a section which supports said chip, said section to be disposed in a recess provided in the card, the dimension of said recess corresponding to that of said section, said method including sticking a first side of an adhesive tape with adhesive on both sides to said section of said carrier film, said tape having a removable protective layer stuck to its second side, having formed therein an aperture in said tape and its protective layer which aperture is larger than said cavity but smaller than said recess, said aperture being disposed over said cavity to render said chip accessible through said aperture, applying varnish to said tape and said chip and removing said protective layer and the varnish covering it to expose the adhesive on the second side of said adhesive tape whereby said section can be pressed into and held in said recess by said second side of said adhesive tape.