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Chemical vapor deposition apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-016/46
  • C23C-016/50
출원번호 US-0805029 (1985-12-03)
발명자 / 주소
  • Van Mastrigt Max (San Jose CA)
출원인 / 주소
  • Varian Associates, Inc. (Palo Alto CA 02)
인용정보 피인용 횟수 : 66  인용 특허 : 30

초록

A chemical vapor deposition apparatus includes a gas mixing chamber and a water-cooled reaction chamber with adjustable water-cooled baffle between them. A wafer is clamped face down to a chuck and an inert gas such as helium is forced between the chuck and the wafer to insure proper heat conduction

대표청구항

An apparatus for chemical vapor deposition on a workpiece comprising: a deposition reaction chamber; a gas mixing chamber communicating with said deposition reaction chamber; connection means for connecting a vacuum pumping means to said deposition reaction chamber; gas distribution means for introd

이 특허에 인용된 특허 (30)

  1. Ogawa Kazuyuki (Yokohama JA) Hirose Masahiko (Yokohama JA) Shibagaki Masahiro (Hiratsuka JA) Murakami Yoshio (Yokohama JA) Horiike Yasuhiro (Naritanishi JA), Activated gas reaction apparatus & method.
  2. Crawley John A. (Royston GB2), Apparatus for vapor deposition of a film on a substrate.
  3. Politycki Alfred (Ottobrunn DEX) Hieber Konrad (Munich DEX) Stolz Manfred (Munich DEX), CVD Coating device for small parts.
  4. Stitz Robert W. (Mesa AZ), CVD heater control circuit.
  5. McNeilly Michael A. (Saratoga CA) Benzing Walter C. (Saratoga CA), Epitaxial radiation heated reactor.
  6. Schoolar Richard B. (Silver Spring MD), Equilibrium growth technique for preparing PbSxSe1-x epilayers.
  7. Tarng Ming L. (Mercerville NJ), Etching a semiconductor material and automatically stopping same.
  8. Maa Jer-shen (Manville NJ), Etching of tantalum silicide/doped polysilicon structures.
  9. Levinstein Hyman J. (Berkeley Heights NJ) Murarka Shyam P. (New Providence NJ) Sinha Ashok K. (New Providence NJ), Integrated semiconductor circuit structure and method for making it.
  10. Pappis ; James ; Hagen ; Lawrence M. ; Li ; Pei-Ching, Isotropic boron nitride and method of making same.
  11. Widmer Alois E. (Berikon CHX) Fehlmann Roland (Au CHX), LPCVD Deposition of tantalum silicide.
  12. Rosler, Richard S.; Engle, George M., Metal-silicide deposition using plasma-enhanced chemical vapor deposition.
  13. Brors Daniel L. (Los Altos Hills CA) Fair James A. (Mountain View CA) Monnig Kenneth A. (Palo Alto CA), Method and apparatus for deposition of tungsten silicides.
  14. Lehrer William I. (Los Altos CA), Method for LPCVD co-deposition of metal and silicon to form metal silicide.
  15. Doo ; Ven Y. ; Nichols ; Donald R. ; Silvey ; Gene A., Method for depositing continuous pinhole free silicon nitride films and products produced thereby.
  16. Balog ; Moshe ; Berkenblit ; Melvin ; Chan ; See-Ark ; Reisman ; Arnold, Method for forming smooth self limiting and pin hole free SiC films on Si.
  17. Levinstein Hyman J. (Berkeley Heights NJ) Murarka Shyam P. (New Providence NJ) Sinha Ashok K. (New Providence NJ), Method for making integrated semiconductor circuit structure with formation of Ti or Ta silicide.
  18. Tuft Bernard R. (Scipio Center NY), Method for metallizing a semiconductor element.
  19. Crowder Billy L. (Putnam Valley NY) Zirinsky Stanley (Bronx NY), Method for providing a metal silicide layer on a substrate.
  20. Hieber Konrad (Munich DEX) Wieczorek Claudia (Ottobrunn DEX), Method for selective deposition of layer structures consisting of silicides of HMP metals on silicon substrates and prod.
  21. Schwabe Ulrich (Munich DEX) Neppl Franz (Munich DEX) Hieber Konrad (Munich DEX), Method for the manufacture of integrated MOS-field effect transistor circuits silicon gate technology having diffusion z.
  22. Gigante Joseph R. (Beltsville MD) Ghoshtagore Rathindra N. (Columbia MD), Method of forming conductive interconnection between vertically spaced levels in VLSI devices.
  23. Sugaki Shojiro (Hachioji JPX) Ogirima Masahiko (Shinjuku JPX) Yamamoto Naoki (Kawaguchi JPX), Method of forming electrode of semiconductor device.
  24. Shaw Joseph M. (Cranbury NJ), Method of manufacturing low resistance gates and interconnections.
  25. Raymond Leonard S. (Tucson AZ), Method of preparing high-temperature-stable thin-film resistors.
  26. Hbner Horst (Aachen DEX) Magendans Frederik (Eindhoven NLX) Van Rheenen Bernhard J. P. (Eindhoven NLX), Method of producing an anode and anode thus obtained.
  27. Flamm Daniel L. (Chatham Township ; Morris County NJ) Maydan Dan (Short Hills NJ) Wang David N. (Warren Township ; Somerset County NJ), Plasma etching of silicon.
  28. Brors Daniel L. (Los Altos Hills CA), Process for depositing a low resistivity tungsten silicon composite film on a substrate.
  29. Roberts Stanley (South Burlington VT) White Francis R. (Essex Junction VT), Process for making polycide structures.
  30. Tsao, Kuey-Yeou, Selective LPCVD tungsten deposition by the silicon reduction method.

이 특허를 인용한 특허 (66)

  1. Lin, Mu-Tsang; Lin, Yu-Lun; Chuang, Yao-Fey, Apparatus and method for reducing contamination in a wafer transfer chamber.
  2. Tepman Avi (Cupertino CA), Apparatus and method to ensure heat transfer to and from an entire substrate during semiconductor processing.
  3. Bell James A. E. (Oakville CAX) Conard Bruce R. (Oakville CAX), Apparatus and process for coloring objects by plasma coating.
  4. Fernando Cesar R. ; Patel Narendra, Apparatus for particle reduction in semiconductor processing equipment.
  5. van de Ven Everhardus P. ; Broadbent Eliot K. ; Benzing Jeffrey C. ; Chin Barry L. ; Burkhart Christopher W. ; Lane Lawrence C. ; McInerney Edward John, Apparatus for preventing deposition on frontside peripheral region and edge of wafer in chemical vapor deposition appar.
  6. van de Ven Everhardus P. (Saratoga CA) Broadbent Eliot K. (San Jose CA) Benzing Jeffrey C. (Saratoga CA) Chin Barry L. (Saratoga CA) Burkhart Christopher W. (Los Gatos CA), Apparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrate.
  7. Kyung Hyun-Su,KRX ; Choi Won-Song,KRX ; Shin Jung-Ho,KRX, Apparatus for thermal treatment of thin film wafer.
  8. Beer, Emanuel; White, John M., Automated substrate processing system.
  9. Inushima Takashi,JPX ; Hayashi Shigenori,JPX ; Takayama Toru,JPX ; Odaka Masakazu,JPX ; Hirose Naoki,JPX, CVD apparatus.
  10. Hwang, Chul Ju; Lee, Sung Weon, Cluster tool for fabricating semiconductor device.
  11. Lee,Jae Chull; Berkstresser,David, Curved slit valve door with flexible coupling.
  12. Lee, Jae-Chull; Kurita, Shinichi; White, John M.; Anwar, Suhail, Decoupled chamber body.
  13. Park, Hyung Sang; Choi, Seung Woo; Kim, Jong Su; Jung, Dong Rak; Lee, Jeong Ho; Lee, Chun Soo, Deposition apparatus.
  14. Park, Hyung Sang; Choi, Seung Woo; Kim, Jong Su; Jung, Dong Rak; Lee, Jeong Ho; Lee, Chun Soo, Deposition apparatus.
  15. Kurita, Shinichi; Blonigan, Wendell T., Double dual slot load lock chamber.
  16. Avi Tepman ; Donald J. K. Olgado ; Allen L. D'Ambra, Dual buffer chamber cluster tool for semiconductor wafer processing.
  17. Kurita, Shinichi; Blonigan, Wendell T.; Hosokawa, Akihiro, Dual substrate loadlock process equipment.
  18. Kurita, Shinichi; Blonigan, Wendell T.; Hosokawa, Akihiro, Dual substrate loadlock process equipment.
  19. Kraus, Joseph Arthur; Strassner, James David, Dual wafer load lock.
  20. Ross Eric ; Park Jae ; de Chambrier Alexandre, Electrostatic support assembly having an integral ion focus ring.
  21. Eichman Eric C. (Phoenix AZ) Sommer Bruce A. (Phoenix AZ) Churley Michael J. (Tempe AZ) Ramsey W. Chuck (Tempe AZ), Elimination of low temperature ammonia salt in TiCl4NH3 CVD reaction.
  22. van de Ven Everhardus P. ; Broadbent Eliot K. ; Benzing Jeffrey C. ; Chin Barry L. ; Burkhart Christopher W. ; Lane Lawrence C., Exclusion guard and gas-based substrate protection for chemical vapor deposition apparatus.
  23. van de Ven Everhardus P. ; Broadbent Eliot K. ; Benzing Jeffrey C. ; Chin Barry L. ; Burkhart Christopher W., Gas-based substrate deposition protection.
  24. Wing James C. ; McInerney Edward J., In situ plasma clean gas injection.
  25. Walde Michael (Rodenbach DEX) Zeidler Peter (Hanau DEX) Domroese Dirk (Bispingen-Behringen DEX), Installation for charging and discharging substrates out of a vacuum tank.
  26. Kurita, Shinichi; Blonigan, Wendell T.; Tanase, Yoshiaki, Large area substrate transferring method for aligning with horizontal actuation of lever arm.
  27. Kurita,Shinichi; Blonigan,Wendell T.; Tanase,Yoshiaki, Load lock chamber for large area substrate processing system.
  28. Kurita,Shinichi; Blonigan,Wendell T., Load lock chamber having two dual slot regions.
  29. Lee, Jae-Chull; Anwar, Suhail; Kurita, Shinichi, Load lock chamber with decoupled slit valve door seal compartment.
  30. Ding, Peijun; Xu, Zheng; Zhang, Hong; Tang, Xianmin; Gopalraja, Praburam; Rengarajan, Suraj; Forster, John C.; Fu, Jianming; Chiang, Tony; Yao, Gongda; Chen, Fusen E.; Chin, Barry L.; Kohara, Gene Y., Metal / metal nitride barrier layer for semiconductor device applications.
  31. Fernando Cesar R. ; Patel Narendra, Method for cleaning semiconductor processing equipment by reducing particles.
  32. Chiang, Tony; Yao, Gongda; Ding, Peijun; Chen, Fusen E.; Chin, Barry L.; Kohara, Gene Y.; Xu, Zheng; Zhang, Hong, Method for depositing a diffusion barrier layer and a metal conductive layer.
  33. Wang David Nin-Kou ; White John M. ; Law Kam S. ; Leung Cissy ; Umotoy Salvador P. ; Collins Kenneth S. ; Adamik John A. ; Perlov Ilya ; Maydan Dan, Method for protecting against deposition on a selected region of a substrate.
  34. Kurita,Shinichi; Blonigan,Wendell T., Method for transferring substrates in a load lock chamber.
  35. Ding,Peijun; Xu,Zheng; Zhang,Hong; Tang,Xianmin; Gopalraja,Praburam; Rengarajan,Suraj; Forster,John C.; Fu,Jianming; Chiang,Tony; Yao,Gongda; Chen,Fusen E.; Chin,Barry L.; Kohara,Gene Y., Method of depositing a tantalum nitride/tantalum diffusion barrier layer system.
  36. Inuzima Takashi (Atsugi JPX) Hayashi Shigenori (Atsugi JPX) Takayama Toru (Atsugi JPX) Odaka Seiichi (Akita JPX) Hirose Naoki (Atsugi JPX), Method of depositing films using photo-CVD with chamber plasma cleaning.
  37. Inushima Takashi,JPX ; Hayashi Shigenori,JPX ; Takayama Toru,JPX ; Odaka Masakazu,JPX ; Hirose Naoki,JPX, Method of forming a film on a substrate.
  38. Foree, Michael Todd, Method of supporting a substrate in a gas cushion susceptor system.
  39. Bright Nick ; Mooring Ben, Modular architecture for semiconductor wafer fabrication equipment.
  40. Tepman Avi, Monolith processing system platform.
  41. John M. White ; Wendell T. Blonigan ; Michael W. Richter, Multi-function chamber for a substrate processing system.
  42. White John M. ; Blonigan Wendell T. ; Richter Michael W., Multi-function chamber for a substrate processing system.
  43. White John M. ; Blonigan Wendell T. ; Richter Michael W., Multi-function chamber for a substrate processing system.
  44. Kurita, Shinichi; Anwar, Suhail; Lee, Jae-Chull, Multiple slot load lock chamber and method of operation.
  45. Cain John L. (Schertz TX), Optimization of dry etching through the control of helium backside pressure.
  46. Todd Craig B. ; Yu James E., Process chamber lid.
  47. Kim Daehwan D., Process chamber tray.
  48. Choo, Yen Fui; Palsulich, David, Scanner for wafers, method for using the scanner, and components of the scanner.
  49. James C. Wing ; Edward J. McInerney, Situ plasma clean gas injection.
  50. Drummond Timothy J. (Tijeras NM) Ginley David S. (Albuquerque NM) Zipperian Thomas E. (Albuquerque NM), Substrate solder barriers for semiconductor epilayer growth.
  51. Tepman Avi, Transfer chamber.
  52. Kurita, Shinichi; Beer, Emanuel; Nguyen, Hung T.; Blonigan, Wendell T., Transfer chamber for vacuum processing system.
  53. Wagner Rudolf (Fontnas CHX) Martin Bader (Balzers LIX) Eberhard Moll (Schellenberg LIX) Zanardo Renzo (Balzers LIX) Van Agtmaal J. G. (Hilversum NLX), Vacuum apparatus.
  54. Weinberg Richard S. (Palo Alto CA), Vacuum vessel.
  55. Kim, Sam Hyungsam; Lee, Jae-Chull; Sterling, William N.; Brown, Paul, Valve door with ball coupling.
  56. Ohashi Tadashi,JPX ; Chaki Katuhiro,JPX ; Xin Ping,JPX ; Fujii Tatsuo,JPX ; Iwata Katsuyuki,JPX ; Mitani Shinichi,JPX ; Honda Takaaki,JPX, Vapor deposition apparatus and vapor deposition method.
  57. Halpin Michael W. ; Hawkins Mark R. ; Foster Derrick W. ; Vyne Robert M. ; Wengert John F. ; van der Jeugd Cornelius A. ; Jacobs Loren R., Wafer support system.
  58. Halpin Michael W. ; Hawkins Mark R. ; Foster Derrick W. ; Vyne Robert M. ; Wengert John F. ; van der Jeugd Cornelius A. ; Jacobs Loren R., Wafer support system.
  59. Halpin Michael W. ; Hawkins Mark R. ; Foster Derrick W. ; Vyne Robert M. ; Wengert John F. ; van der Jeugd Cornelius A. ; Jacobs Loren R. ; Van Bilsen Frank B. M. ; Goodman Matthew ; Glenn Hartmann ;, Wafer support system.
  60. Halpin, Michael W.; Hawkins, Mark R.; Foster, Derrick W.; Vyne, Robert M.; Wengert, John F.; van der Jeugd, Cornelius A.; Jacobs, Loren R., Wafer support system.
  61. Halpin, Michael W.; Hawkins, Mark R.; Foster, Derrick W.; Vyne, Robert M.; Wengert, John F.; van der Jeugd, Cornelius A.; Jacobs, Loren R.; Van Bilsen, Frank B. M.; Goodman, Matthew; Glenn, Hartmann; Layton, Jason M., Wafer support system.
  62. Halpin,Michael W.; Hawkins,Mark R.; Foster,Derrick W.; Vyne,Robert M.; Wengert,John F.; van der Jeugd,Cornelius A.; Jacobs,Loren R., Wafer support system.
  63. Michael W. Halpin ; Mark R. Hawkins ; Derrick W. Foster ; Robert M. Vyne ; John F. Wengert ; Cornelius A. van der Jeugd ; Loren R. Jacobs ; Frank B. M. Van Bilsen ; Matthew Goodman ; Hartman, Wafer support system.
  64. Michael W. Halpin ; Mark R. Hawkins ; Derrick W. Foster ; Robert M. Vyne ; John F. Wengert ; Cornelius A. van der Jeugd ; Loren R. Jacobs ; Frank B. M. Van Bilsen ; Matthew Goodman ; Hartman, Wafer support system.
  65. Michael W. Halpin ; Mark R. Hawkins ; Derrick W. Foster ; Robert M. Vyne ; John F. Wengert ; Cornelius A. van der Jeugd ; Loren R. Jacobs ; Frank B. M. Van Bilsen ; Matthew Goodman ; Hartman, Wafer support system.
  66. van de Ven Everhardus P. (Cupertino CA) Broadbent Eliot K. (San Jose CA) Benzing Jeffrey C. (San Jose CA) Chin Barry L. (Sunnyvale CA) Burkhart Christopher W. (San Jose CA), Wafer surface protection in a gas deposition process.

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