초록 ▼

A circuit board is manufactured by applying a film of heat actuable adhesive to a substrate and depositing on the film a layer of a conductive powder. The powder and film are then activated by laser radiation or by direct contact with a heated plate. The excess powder is then removed and the substra

A circuit board is manufactured by applying a film of heat actuable adhesive to a substrate and depositing on the film a layer of a conductive powder. The powder and film are then activated by laser radiation or by direct contact with a heated plate. The excess powder is then removed and the substrate fired to cure or bond the powder to the substrate while removing excess adhesive film.

대표청구항 ▼

A method of producing a circuit board comprising an electrically conductive pattern on an electrically non-conductive surface, the method comprising taking a circuit board substrate having an electrically non-conductive surface thereon, applying a layer of a heat actuable adhesive to said surface, l

A method of producing a circuit board comprising an electrically conductive pattern on an electrically non-conductive surface, the method comprising taking a circuit board substrate having an electrically non-conductive surface thereon, applying a layer of a heat actuable adhesive to said surface, loosely dispensing onto said layer an electrically conductive powder consisting of elemental metal in such a manner that the powder remains unbonded to the surface and can be readily removed therefrom, selectively heating said powder in said pattern to a temperature sufficient only to activate said adhesive without affecting the powder to adhesively bond said powder to said surface in said pattern, and removing from said surface powder which remains unbonded.