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Solder delivery systems 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/58
  • B23K-001/12
출원번호 US-0840624 (1986-03-17)
발명자 / 주소
  • Noel Raymond (Menlo Park CA) Robinson William M. (Palo Alto CA) Cherian Gabe (Fremont CA) Clifford Thomas H. (Half Moon Bay CA) Carlomagno William D. (Redwood City CA) Deasy William M. (Redwood City
출원인 / 주소
  • Raychem Corp. (Menlo Park CA 02)
인용정보 피인용 횟수 : 45  인용 특허 : 20

초록 ▼

Mechanical means and methods for delivery of solder preforms arranged in generally rectilinear patterns and oriented so that the ends of the solder preforms may join two planar surfaces upon the application of heat are disclosed. Several embodiments facilitate the delivery of solder preforms in the

대표청구항 ▼

A solder post delivery system comprising: a positioning means for positioning solder posts, said positioning means being elongated along a longitudinal axis, said positioning means having a plurality of longitudinally spaced openings therethrough, each of said openings having a top and a bottom gene

이 특허에 인용된 특허 (20)

  1. Abraham Bruce C. (Limekiln PA) Fegley Charles R. (Laureldale PA), Adapting contacts for connection thereto.
    상세보기
  2. Fisher ; Jr. John R. (Plainsboro NJ), Cast solder leads for leadless semiconductor circuits.
    상세보기
  3. Grovender Steven L. (Saint Paul MN), Connector.
    상세보기
  4. Scheingold William S. (Palmyra PA) Youngfleish Frank C. (Harrisburg PA), Connector for a leadless electronic package.
    상세보기
  5. Grabbe ; Dimitry G., Connector for connecting a circuit element to the surface of a substrate.
    상세보기
  6. Nemoto Hideo (Sakura JA) Koike Yuuji (Matsudo JA), Connector having electro-conductive rubber terminal.
    상세보기
  7. Anhalt John W. (Orange CA) Goodman David S. (Mission Viejo CA) Alonso Ocsar (Westminister CA), Electrical connector.
    상세보기
  8. Benasutti John E. (Lansdale PA), Electrical connector assembly for an integrated circuit package.
    상세보기
  9. Madden James J. (Naperville IL), Integrated circuit chip carrier mounting arrangement.
    상세보기
  10. Sado Ryoichi (Saitama JPX), Interconnectors.
    상세보기
  11. Grabbe Dimitry (Lisbon Falls ME) Patterson Ronald (Dauphin PA), Lead frame and chip carrier housing.
    상세보기
  12. Hopkins John R. (Cambridge MD), Method and apparatus for producing a premolded packaging.
    상세보기
  13. Tracy ; John M., Method of fabricating an array of flexible metallic interconnects for coupling microelectronics components.
    상세보기
  14. Squitieri Vincent (Billerica MA) Lynn William Joseph (Groveland MA), Method of forming an interconnector.
    상세보기
  15. Moore John R. (Santa Ana CA), Method of making conductive elastomer connectors.
    상세보기
  16. Buchoff Leonard S. (Bloomfield NJ) Kosiarski Joseph P. (Englishtown NJ) Dalamangas Chris A. (Union NJ), Method of making electrically conductive connector.
    상세보기
  17. Reid Gilbert R. (Norristown PA), Multiple solder pre-form with non-fusible web.
    상세보기
  18. Curtis, III, Hazen, Solder beams leads.
    상세보기
  19. Grassauer Willie K. (Menlo Park CA) Robinson William M. (Palo Alto CA), Solder delivery system.
    상세보기
  20. Dyce John W. (Sidney NY) Buczak Ronald F. (Poughkeepsie NY), Solder pack and method of manufacture thereof.
    상세보기

이 특허를 인용한 특허 (45)

  1. Boon, Suan Jeung, Adhesive layer for an electronic apparatus having multiple semiconductor devices.
    상세보기
  2. Werther William E., Assembly including fine-pitch solder bumping and method of forming.
    상세보기
  3. Hwang, Chi-won, Carbon nanotube-reinforced solder caps, and chip packages and systems containing same.
    상세보기
  4. Svendsen ; Leo G. (Redwood City CA) Leary Rebecca A. (Milpitas CA) Geschwind Gary I. (Palo Alto CA), Connection to a component for use in an electronics assembly.
    상세보기
  5. Kent Geroge M. (Sierra Madre CA), Desoldering aid.
    상세보기
  6. Hart, Martin B.; Young, Roger C., Disposable apparatus for aligning and dispensing solder columns in an array.
    상세보기
  7. Hart, Martin B., Fixture for delivering interconnect members onto a substrate.
    상세보기
  8. Nakamura Keiichi (Tokyo JPX) Oshima Tsutomu (Tokyo JPX) Kurokawa Noriharu (Surashi JPX) Kitai Toshihiko (Isehara JPX), I/O pin and method for making same.
    상세보기
  9. Syslak, Morten; Folkedal, Leiv Adne; Baldantoni, Antonio, Manifold for heat exchanger and process therefor.
    상세보기
  10. Yoshino, Toyokazu; Okamoto, Katsuya; Ogata, Shigeki; Morimoto, Shinji; Nakashima, Kouji, Manufacturing method of flexible printed wiring board.
    상세보기
  11. Hertz Eric, Method and apparatus for placing conductive preforms.
    상세보기
  12. Freeman, Gary; Nowak, Jr., Thomas; Purcell, Thomas; Mirabito, A. Jason; Sullivan, Thomas M.; Foulke, Richard F.; Foulke, Jr., Richard F.; Ohlenbusch, Cord W., Method and apparatus for placing solder balls on a substrate.
    상세보기
  13. Teo, Keng Lee; Chin, Wey Ngee Desmond, Method and apparatus for soldering modules to substrates.
    상세보기
  14. Hertz Eric L., Method and apparatus using colored foils for placing conductive preforms.
    상세보기
  15. Hwang, Chi won, Method of assembling carbon nanotube reinforced solder caps.
    상세보기
  16. Peloza, Kirk B.; Faje, Richard A.; Hodge, Ronald C.; Gould, Jon S., Method of attaching a solder element to contact and the contact assembly formed thereby.
    상세보기
  17. Nishikawa Toru,JPX ; Satoh Ryohei,JPX ; Harada Masahide,JPX ; Hayashida Tetsuya,JPX ; Shirai Mitugu,JPX, Method of fabricating electronic circuit device and apparatus for performing the same method.
    상세보기
  18. Le Coz Christian Robert ; Mead Donald Ivan ; Stockholm Roger James, Method of making an electronic package having spacer elements.
    상세보기
  19. Seidler,Jack; Zhitomirsky,Aleksandr, Method of retaining a solder mass on an article.
    상세보기
  20. Hayasaka, Nobuo; Okumura, Katsuya; Sasaki, Keiichi; Matsuo, Mie, Multichip semiconductor device, chip therefor and method of formation thereof.
    상세보기
  21. Hayasaka, Nobuo; Okumura, Katsuya; Sasaki, Keiichi; Matsuo, Mie, Multichip semiconductor device, chip therefor and method of formation thereof.
    상세보기
  22. Hayasaka, Nobuo; Okumura, Katsuya; Sasaki, Keiichi; Matsuo, Mie, Multichip semiconductor device, chip therefor and method of formation thereof.
    상세보기
  23. Hayasaka,Nobuo; Okumura,Katsuya; Sasaki,Keiichi; Matsuo,Mie, Multichip semiconductor device, chip therefor and method of formation thereof.
    상세보기
  24. Honda,Hirokazu, Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semiconductor chip on the interconnection board.
    상세보기
  25. Honda, Hirokazu, Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board.
    상세보기
  26. Dautartas Mindaugas Fernand, Passive alignment of components with micromachined tool.
    상세보기
  27. Ball, Michael, Recessed tape and method for forming a BGA assembly.
    상세보기
  28. Michael Ball, Recessed tape and method for forming a BGA assembly.
    상세보기
  29. Hart, Martin B.; Young, Roger C.; Butcher, Jeffrey Ryan, Refillable apparatus for aligning and depositing solder columns in a column grid array.
    상세보기
  30. Gruber Peter Alfred, Solder anchor decal.
    상세보기
  31. Gruber Peter Alfred (Mohegan Lake NY), Solder anchor decal and method.
    상세보기
  32. Foulke Richard F. ; Foulke ; Jr. Richard F. ; Ohlenbusch Cord W., Solder ball placement apparatus.
    상세보기
  33. Foulke Richard F. ; Foulke ; Jr. Richard F. ; Ohlenbusch Cord W., Solder ball placement method.
    상세보기
  34. Clark Thomas C. (301 N. 17th St. Camp Hill PA 17011), Solder containing electrical connector and method for making same.
    상세보기
  35. Tang Ching C. (2066 Verbena Ct. Fremont CA 94539), Solder delivery and array apparatus.
    상세보기
  36. McGaffigan Thomas H. (Half Moon Bay CA), Solder delivery system.
    상세보기
  37. Abe, Masahiko; Watanabe, Koji; Takahashi, Hideaki; Kanno, Masahiko; Ito, Masaya, Solder piece, chip solder and method of fabricating solder piece.
    상세보기
  38. Zanolli, James; Cachina, Joseph, Solder-bearing articles and method of retaining a solder mass along a side edge thereof.
    상세보기
  39. McMahon John Francis (Phoenix AZ) Chiu George (Palo Alto CA), Tape withh solder forms and methods for transferring solder forms to chip assemblies.
    상세보기
  40. Boon, Suan Jeung, Wafer level pre-packaged flip chip.
    상세보기
  41. Boon, Suan Jeung, Wafer level pre-packaged flip chip system.
    상세보기
  42. Boon, Suan Jeung, Wafer level pre-packaged flip chip systems.
    상세보기
  43. Seo, Won Cheol; Cho, Dae Sung, Wafer-level light emitting diode and wafer-level light emitting diode package.
    상세보기
  44. Seo, Won Cheol; Cho, Dae Sung, Wafer-level light emitting diode package and method of fabricating the same.
    상세보기
  45. Seo, Won Cheol; Cho, Dae Sung, Wafer-level light emitting diode package and method of fabricating the same.
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