초록 ▼

An IC module including an integrated circuit chip and external connecting terminals connecting with the leads of the IC chip is accommodated in a cavity of a center sheet. First and second laminated structures, each of which is made of a plurality of sheets, are bonded to one and the other side surf

An IC module including an integrated circuit chip and external connecting terminals connecting with the leads of the IC chip is accommodated in a cavity of a center sheet. First and second laminated structures, each of which is made of a plurality of sheets, are bonded to one and the other side surfaces of the center sheet. Each one of the first and second laminated structures has the same number of sheets and the same number of adhesive layers. Therefore, contraction and drawing forces produced by a change of environment and applied to the center sheet is counterbalanced, and warpage of the memory card is prevented.

대표청구항 ▼

A memory card comprising: a center sheet having a cavity; an IC module located in said cavity of said center sheet and including a circuit board on which an IC chip and a plurality of external connecting terminals are mounted; a first laminated structure formed of a plurality of sheets, each of whic

A memory card comprising: a center sheet having a cavity; an IC module located in said cavity of said center sheet and including a circuit board on which an IC chip and a plurality of external connecting terminals are mounted; a first laminated structure formed of a plurality of sheets, each of which has substantially the same plane size as that of said center sheet and laminated to each other, and having a plurality of holes for exposing said external connecting terminals of said IC module to the outside, said first laminated structure being bonded to one side surface of said center sheet; a second laminated structure formed of a plurality of sheets, each of which has substantially the same plane size as that of said center sheet and laminated to each other, said second laminated structure being bonded to the other side surface of said center sheet, the sheets of said second laminated structure being the same in number as the sheets of said first laminated structure, at least one of said first and second laminated structures having an opening at a position corresponding to said IC chip of said IC module located in said cavity of said center sheet, the area of said opening being a little larger than that of asid IC chip; and a metal member located in said opening.