초록 ▼

Flexible printed circuits and methods of fabricating and forming plated thru-holes therein are disclosed. The flexible printed circuits have one or more substantially rigid regions where plated thru-holes are to be formed, the regions being made rigid by the substitution of epoxy glass or other conv

Flexible printed circuits and methods of fabricating and forming plated thru-holes therein are disclosed. The flexible printed circuits have one or more substantially rigid regions where plated thru-holes are to be formed, the regions being made rigid by the substitution of epoxy glass or other conventional rigid printed circuit board materials in place of the flexible material used for the flexible portions of the circuit. In this manner the thru-holes are formed through conventional printed circuit board layers, allowing plating of the thru-holes using conventional well developed techniques. This process avoids the necessity of plating thru-holes in flexible printed circuit materials currently requiring special equipment and techniques, and further avoids stress concentration at the junction between the rigid plated thru-holes and the adjacent flexible printed circuit. Various methods for forming such circuits and circuits so formed are disclosed.

대표청구항 ▼

A method of making flexible printed circuits comprising the steps of (a) providing a sheet of metal, (b) covering at least a first area of the metal sheet with a sheet of flexible material, (c) covering a second area of the metal sheet at least in part coterminous with the first area with a rigid pr

A method of making flexible printed circuits comprising the steps of (a) providing a sheet of metal, (b) covering at least a first area of the metal sheet with a sheet of flexible material, (c) covering a second area of the metal sheet at least in part coterminous with the first area with a rigid printed circuit board material, (d) bonding the flexible material and the rigid material to the metal sheet, (e) etching the metal sheet to form a circuit pattern and (f) bonding additional flexible material and rigid printed circuit board to the flexible material and rigid printed circuit board material, respectfully, of steps (b) and (c) to sandwich the circuit pattern formed in step (e) therebetween.