IPC분류정보
국가/구분 |
United States(US) Patent
등록
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국제특허분류(IPC7판) |
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출원번호 |
US-0247998
(1981-03-26)
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발명자
/ 주소 |
- Bunnelle William L. (Stillwater MN) Lindmark
- Jr. Richard C. (Coon Rapids MN)
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출원인 / 주소 |
- H. B. Fuller Company (St. Paul MN 02)
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인용정보 |
피인용 횟수 :
76 인용 특허 :
3 |
초록
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A purpose of the disclosed method is to impart gathers and elasticity to a relatively inelastic film, membrane, or web substrate, through elastic banding with a viscoelastic hot melt pressure-sensitive adhesive (PSA). Typically, the resulting elastic-banded substrate product (e.g. 40) will be cut in
A purpose of the disclosed method is to impart gathers and elasticity to a relatively inelastic film, membrane, or web substrate, through elastic banding with a viscoelastic hot melt pressure-sensitive adhesive (PSA). Typically, the resulting elastic-banded substrate product (e.g. 40) will be cut into discrete units and formed into garments or body-encircling members such as disposable diapers. One step of the preferred method involves extruding a ribbon or band (13 or 113) comprising a viscoelastic hot melt PSA, which PSA has unusually high cohesion, stretchiness, and elasticity without excessive loss of adhesive bonding strength. (The viscoelastic behavior of the PSA is believed to be determined, at least in part, by the relative size of its crystalline domains and its rubbery domains and the glass transition temperatures and softening points of its components.) A second step of the preferred method involves bringing the band of hot melt (13 or 113) into adherent contact with a surface of a moving continuous substrate (22 or 32 or 132). A typical substrate would be the polyolefin film used in the manufacture of disposable diapers. The band can be bonded to the substrate through a pressure activation technique, wherein the band itself has the necessary inherent adhesive properties.
대표청구항
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A viscoelastic hot melt pressure-sensitive adhesive-elastic composition consisting essentially of: a major amount by weight, not exceeding 70% by weight, of a rubbery block copolymer which copolymer includes a rubbery midblock portion and which is terminated with crystalline vinyl arene end blocks;
A viscoelastic hot melt pressure-sensitive adhesive-elastic composition consisting essentially of: a major amount by weight, not exceeding 70% by weight, of a rubbery block copolymer which copolymer includes a rubbery midblock portion and which is terminated with crystalline vinyl arene end blocks; about 70 to about 80% by weight of said rubbery block copolymer comprising said rubbery midblock portion and about 20 to about 30% by weight of said rubbery block copolymer comprising said vinyl arene end blocks; a minor amount by weight, not less than 30% by weight, of a tackifying resin generally compatible with and generally associated with said midblock portion; 2-9% by weight of an aromatic, essentially hydrocarbon resin having a glass transition temperature and a softening point above those of said vinyl arene end blocks and said tackifying resin; said aromatic, essentially hydrocarbon resin being generally compatible with and generally associated with said end blocks; and 0-5% by weight of essentially inert extenders, fillers, pigments, and antioxidants that do not substantially affect the adhesive or elastic properties of the composition; the foregoing proportions being selected to provide the following pressure-sensitive adhesive and rheological properties: (i) a tensile strength at 500% elongation, determined at 20°-25°C., of at least 50 pounds per square inch; (ii) a 180°peel resistance, according to PSTC-1, determined at 20°-25°C. 24 hours after formation of the pressure-sensitive adhesive bond, of at least about 450 grams per 25.4 mm-width; (iii) a dead load deformation, tested at room temperature, 37.8°C., 43.3°C., and 48.9°C. for 3 hours under 1500 g/cm2, of less than 50%, where dead load deformation=the increased length minus the original length divided by the original length of a sample at least 25 mm in length; (iv) the following loss modulus, storage modulus, and loss tangent values at 0.01-0.25 Hz throughout the temperature range of 25°-50°C.: loss modulus: 4×104 to 35×104 dynes/cm2 storage modulus: 75×104 to 200×104 dynes/cm2 loss tangent: 0.03 to 0.3
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