IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0888026
(1986-07-18)
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발명자
/ 주소 |
- Kaufman Lance R. (131 N. White Oak Way Mequon WI 53092)
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인용정보 |
피인용 횟수 :
27 인용 특허 :
0 |
초록
▼
An electrical circuit assembly (2) includes a heat sink (4), ceramic substrates (6, 6a) on top of the heat sink (4), heat generating electrical components (8a), including electronic circuit elements (10,10a) and a plurality of flat planar connecting lead frames (12,12a, (14,14a and 16,16a) on top of
An electrical circuit assembly (2) includes a heat sink (4), ceramic substrates (6, 6a) on top of the heat sink (4), heat generating electrical components (8a), including electronic circuit elements (10,10a) and a plurality of flat planar connecting lead frames (12,12a, (14,14a and 16,16a) on top of the substrates (6,6a) and a printed circuit board (26) on top of the flat lead frames (12,12a 14,14a and 16,16a). The printed circuit board (26) has a conductive pattern (28) on its underside electrically engaging and laying flat along the top planar surface of the flat lead frames (12,12a, 14,14a and 16,16a). A plurality of deformable rivets (52, 54, 56 and 58) extend downwardly through respective apertures (60, 62, 64 and 66) in the printed circuit board (26) and through respective apertures (68, 70, 72 and 74) in the heat sink. The rivets (52, 54, 56 and 58) have enlarged heads (76, 78, 80 and 82) engaging the top of the printed circuit board (26), and have bottom ends (84, 86, 88 and 90) deformed to engage the bottom of the heat sink (4) and compressively clamp the circuit arrangement in good heat transfer relation. The rivets (52, 54, 56 and 58) provide the sole clamping force, without nuts and bolts, etc.
대표청구항
▼
An electrical circuit assembly comprising: a heat sink; an electrically insulating and heat conducting substrate on top of said heat sink; electrical component means on top of said substrate and generating heat in response to conduction of current through said electrical component means, said electr
An electrical circuit assembly comprising: a heat sink; an electrically insulating and heat conducting substrate on top of said heat sink; electrical component means on top of said substrate and generating heat in response to conduction of current through said electrical component means, said electrical component means including an electronic circuit element and a plurality of flat planar lead frames electrically connected to said element; a printed circuit board on top of said flat lead frames, said printed circuit board having a conductive pattern on its underside electrically engaging and laying flat against the top planar surface of said flat lead frames; a plurality of deformable rivets each extending downwardly through respective apertures in said printed circuit board and said heat sink, each rivet having an enlarged head at its top end engaging the top of said printed circuit board and having its bottom end deformed to engage the bottom of said heat sink and compressively clamping said printed circuit board against said flat lead frames, and said flat lead frames against said substrate, and said substrate against said heat sink, to compressively force said substrate into intimate engagement with said heat sink to enhance heat transfer from said electrical component means to said heat sink.
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