[특허]Edge finding in wafers

Edge finding in wafers 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	B65G-047/24
출원번호	US-0008389 (1987-01-28)
발명자 / 주소	Koenig Franklin R. (Palo Alto CA)
출원인 / 주소	Tencor Instruments (Mountain View CA 02)
인용정보	피인용 횟수 : 34 인용 특허 : 0

초록 ▼

A system for finding the orientation of a substantially circular disk shaped wafer with at least one flat region on an edge thereof, in which the wafer is spun one 360 degree turn on a chuck and the edge position is measured by a linear array to obtain a set of data points at various wafer orientations. The rotation axis may differ from the wafer center by an unknown eccentricity. The flat angle is found by fitting a cosine curve to the data, subtracting the expected data derived from the cosine curve from the actual data to obtain a deviation. The angle of maximum deviation of the data from the cosine curve is a first estimate of the flat angle. The estimate may be corrected for errors due to a finite number of data points and wafer eccentricity by calculating an adjustment angle from data points on the wafer flat. After determining the flat angle, the wafer is spun to the desired orientation. The wafer eccentricity may be calculated from four of the data points located away from the flat edge region, and the wafer is then centered.

대표청구항 ▼

A method of locating the peripheral flat edge of a wafer comprising, (a) placing a wafer onto a wafer chuck rotatable about an axis, (b) spinning said wafer about said axis for one 360 degree rotation, (c) determining the orientation of said chuck with respect to an initial orientation, (d) sampling the position of said edge of said wafer for a plurality of chuck orientations to obtain a set of data points, each data point consisting of an orientation angle and a corresponding edge position, (e) fitting a cosine curve to said set of data points, (f) subtracting said cosine curve at each of said orientation angles from said corresponding edge positions to obtain a second set of points representing the deviation of said data points from said cosine curve, and (g) finding the angle of maximum deviation of said data points from said cosine curve, said angle being an estimate of a flat edge angle indicating the location of said flat edge of said wafer with respect to said axis of rotation. The method of claim 1 further comprising after step (g), selecting first, second, third and fourth data points from said set of data points located away from any flat edge of said wafer, said first and third data points being 180 degrees apart from one another, said second and fourth data points being 180 degrees apart from one another and 90 degrees apart from said first and third data points respectively, a first line being defined through said axis of rotation between said first and third data points, a second line being defined through said axis of rotation between said second and fourth data points, calculating from the corresponding edge positions of said first and third data points a projection of the center of the wafer onto said first line, calculating from the corresponding edge positions of said second and fourth data points a projection of the center of the wafer onto said first line, moving said wafer on said chuck successively parallel to said first and second lines until the center of said wafer and said axis of rotation coincides.

이 특허를 인용한 특허 (34)

Mallory Chester L. (Campbell CA) Tong Edric H. (Santa Cruz CA) Borglum Wayne K. (San Jose CA), Apparatus for handling semiconductor wafers.
상세보기
Wolff, Robert, Control methods and apparatus for coupling multiple image acquisition devices to a digital data processor.
상세보기
Drisko Robert ; Bachelder Ivan A., Image processing system and method using subsampling with constraints such as time and uncertainty constraints.
상세보기
Drisko Robert ; Bachelder Ivan A., Image processing system and method using subsampling with constraints such as time and uncertainty constraints.
상세보기
Drisko Robert ; Bachelder Ivan A., Image processing system and method using subsampling with constraints such as time and uncertainty constraints.
상세보기
Wenzel, Lothar, Increasing accuracy of discrete curve transform estimates for curve matching in four or more dimensions.
상세보기
Wenzel,Lothar, Increasing accuracy of discrete curve transform estimates for curve matching in higher dimensions.
상세보기
Yamashita, Hiroyuki; Mohara, Yukihisa; Imai, Eiji, Inspection apparatus and inspection method.
상세보기
Lavagnino,Sherrill E.; Wolinsky,Jeffrey Michael, Machine vision method and apparatus for thresholding images of non-uniform materials.
상세보기
Leonid Taycher ; Arman Garakani, Machine vision methods and system for boundary point-based comparison of patterns and images.
상세보기
Taycher, Leonid; Garakani, Arman, Machine vision methods and systems for boundary feature comparison of patterns and images.
상세보기
Foster Nigel John ; Loizeaux Jane Alice, Machine vision methods for identifying collinear sets of points from an image.
상세보기
Sanjay Nichani, Machine vision methods for image segmentation using multiple images.
상세보기
Michael, David J.; Boatner, John B; Karnacewicz, Martin, Method and apparatus for backlighting a wafer during alignment.
상세보기
Kaveh Farrokh, Method and apparatus for positioning substrates.
상세보기
Michael, David J.; Clark, James; Liu, Gang, Method and apparatus for semiconductor wafer alignment.
상세보기
Gardopee George J. (Southbury CT) Clapis Paul J. (Sandy Hook CT) Prusak Joseph P. (Danbury CT) Poultney Sherman K. (Ridgefield CT), Method for co-registering semiconductor wafers undergoing work in one or more blind process modules.
상세보기
Sporon-Fiedler Frederik (San Mateo CA), Method for finding a reference point.
상세보기
Kanefumi Nakahara JP, Method of manufacturing exposure apparatus and method for exposing a pattern on a mask onto a substrate.
상세보기
King, David R., Methods and apparatus for charge coupled device image acquisition with independent integration and readout.
상세보기
Igor Reyzin, Methods and apparatus for generating a projection of an image.
상세보기
Bachelder, Ivan; Wallack, Aaron, Methods and apparatus for machine vision inspection using single and multiple templates or patterns.
상세보기
Wallack, Aaron S; Michael, David, Methods and apparatus for practical 3D vision system.
상세보기
Leslie, Brian C.; Nikoonahad, Mehrdad; Wells, Keith B., Optical scanning system for surface inspection.
상세보기
Leslie,Brian C.; Nikoonahad,Mehrdad; Wells,Keith B., Optical scanning system for surface inspection.
상세보기
Leslie,Brian C.; Nikoonahad,Mehrdad; Wells,Keith B., Optical scanning system for surface inspection.
상세보기
Saeki Hiroaki,JPX, Positioning apparatus and process system having the same.
상세보기
Nikoonahad, Mehrdad; Stokowski, Stanley E., Scanning system for inspecting anamolies on surfaces.
상세보기
Nikoonahad,Mehrdad; Stokowski,Stanley E., Scanning system for inspecting anomalies on surfaces.
상세보기
Balamurugan Subramanian, System and method for determining the center of a wafer on a wafer table.
상세보기
Borras,Rodrigo L.; Clifford,Michelle A.; Gomez,Leticia, System and method for predicting rotational imbalance.
상세보기
Sagues Paul ; Gaudio Stephen A. ; Wong Tim K., Wafer aligner system.
상세보기
Baker Gregory G. (Gig Harbor WA) Boyle Edward F. (Gig Harbor WA), Wafer centration device.
상세보기
Yuen, Jean-Hua; Chen, Po-Ming; Chiang, Ming-Ji; Yang, Ji-Shen, Wafer edge detector.
상세보기

IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
구성항목	기본정보 상세정보 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

연합인증

Edge finding in wafers 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

이 특허를 인용한 특허 (34)

관련 콘텐츠

특허 원문 보기

IPC 상위 출원인

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

선택된 텍스트

연합인증

Edge finding in wafers 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

전체(0) 논문(0) 특허(0) 보고서(0)

전체(0) 논문(0) 특허(0) 보고서(0)

이 특허를 인용한 특허 (34)

관련 콘텐츠

특허 원문 보기

IPC 상위 출원인

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

선택된 텍스트