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Stand-off device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-001/14
출원번호 US-0040047 (1987-04-16)
발명자 / 주소
  • Till David P. (Sturbridge MA)
출원인 / 주소
  • Prime Computer Inc. (Natick MA 02)
인용정보 피인용 횟수 : 61  인용 특허 : 0

초록

An improved stand-off device is disclosed which is used to control the spacing between adjacent planar elements in electronic instrumentation. The stand-off device includes a resilient, hollow shell member and a rigid, cylindrical inner element. The shell member has at least one slot extending from

대표청구항

In combination, a stand-off device and a pair of circuit boards, said stand-off device for removable attachment with said pair of cirucit boards, said stand-off device maintaining said pair of circuit boards in spaced parallel relationship, said circuit boards each having an aperture extending there

이 특허를 인용한 특허 (61)

  1. Speraw Floyd G. (DeBary FL) Meyer Jay A. (Oviedo FL), Adapter for stacking printed circuit boards.
  2. Zimmer, Günther; Zimmer, Martin, Anchor installation in a lightweight construction panel.
  3. Nadler,Donald S., Anchoring drill bit, system and method of anchoring.
  4. Mueller, Donald; Stambaugh, Deron; Russo, Anthony, Apparatus and methods for interconnecting electrical circuit substrates and components.
  5. Dibene, II, Joseph T.; Hartke, David H.; Derian, Edward J.; Hoge, Carl E.; Broder, James M.; San Andres, Jose B.; Riel, Joseph S., Apparatus for delivering power to high performance electronic assemblies.
  6. Joseph Ted Dibene, II ; David H. Hartke ; James Hjerpe Kaskade ; Carl E. Hoge, Apparatus for providing power to a microprocessor with integrated thermal and EMI management.
  7. Richard Baur DE; Guenter Fendt DE; Alfons Woehrl DE; Engelbert Woerle DE, Arrangement for securing a circuit board in a housing.
  8. Alden ; 3rd Wayne S. ; Petrocelli William, Board-to-board alignment and securement device.
  9. Chen, Pin-Cheng; Lee, Te-Cheng; Lin, Hung-Pin; Lai, Yao-Yu; Chen, Cheng-Hsin, Boss for securing pair of mainboards.
  10. Chen, Li Ping, Circuit board mounting device.
  11. Ireland, John A., Circuit board standoff.
  12. Yon, Fulvio, Clamp-type retention element for axisymmetrical components such as cables or tubes, in particular for application on vehicles.
  13. Chen, Xiaoyu; Gui, Hui; Zeng, Junhua; Zhang, HongWei, Connector, electronic device and illuminating device having the connector.
  14. Keidl Steven Dennis ; Thompson Gary Allen, Controlled low impedance high current circuit board interconnect.
  15. Maschat, Kevin; Binkert, Sven, Cramping fastener device.
  16. Lee, Kuoshao, Device for anchoring components on circuit board.
  17. Prabaonnaud Jean Fran.cedilla.ois,FRX ; Wegmann George,FRX ; Leroy Roger,FRX ; Vassal Jean Louis,FRX, Device for the spaced mounting of a printed circuit board on an electrically conducting carrier.
  18. Armiento, Alan J.; Bland, T. J., Drop-in anchor.
  19. Armiento, Alan J.; Bland, T.J., Drop-in anchor.
  20. Enomoto, Ryo; Tashima, Taku; Ozeki, Tadashi, Fastener.
  21. Hsieh, Ming-Chih; Li, Tsung-Hsi, Fastener and electronic device having the same.
  22. Whitney, Bradley R.; Cook, Randolph H., Fastener assembly and method for heat sink mounting.
  23. Treiber, Mark R.; Louth, Terry W., Fastener assembly for pivotal engagement of adjacent components.
  24. Sadri Shahriar M. (San Clemente CA), Fastener construction with internal support for spaced portions of structural member.
  25. Took Ian Frank,GBX, Fastening devices.
  26. Claus Fleischer DE, Fastening of a tube plate.
  27. Duval Michael S. ; Mariani Craig A., Firearm with releasably retained sight assembly.
  28. Eifert, Daniel J., Gripping PWB hex standoff.
  29. Lambert, Donald L., Heat sink connector pin and assembly.
  30. Zhong,Yong; Yang,Bo Yong; Xia,Wan Lin, Heat sink fastening assembly.
  31. Benthien, Hermann; Güngör, Ali, Holding device for interior lining parts of a fuselage.
  32. Rahn Erwin P.G., Identification tag and anchor for use in displaying indicia including graphics and text.
  33. Hartke, David H.; DiBene, II, Joseph Ted, Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems.
  34. Dibene ; II Joseph Ted ; Hartke David, Inter-circuit encapsulated packaging.
  35. Joseph Ted DiBene, II ; David Hartke, Inter-circuit encapsulated packaging for power delivery.
  36. Wang, Jessica, Light shades and lighting systems.
  37. Cermak, III, Stephen; Conger, Jeffrey S.; Gruber, David Paul; Crapisi, Thomas Alex; Bowen, Stephen A.; Shafer, Steven; Sikkink, Mark Ronald, Memory daughter card apparatus, configurations, and methods.
  38. Frodis, Uri; Cohen, Adam L.; Lockard, Michael S., Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures.
  39. Frodis, Uri; Cohen, Adam L.; Lockard, Michael S., Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures.
  40. DiBene, II, Joseph Ted; Hartke, David H., Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management.
  41. DiBene, II,Joseph T.; Hartke,David H.; Kaskade,James J. Hjerpe; Hoge,Carl E., Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management.
  42. DiBene, II,Joseph T.; Derian,Edward J., Micro-spring interconnect systems for low impedance high power applications.
  43. David R. Davis ; David D. Williams ; Daniel C. Castillo ; Salah Din ; Paul O. Amdahl ; Dirk O. Cosner, Motherboard mounting assembly.
  44. Doyle Vincent L. (West Chester OH), Multi-piece tube clamp.
  45. Kim,Myoung Kon, Plasma display apparatus.
  46. Kim, Myoung-Kon, Plasma display device and its method of manufacture.
  47. Lawrence J. Brekosky ; Douglas M. Eakin ; William G. Lenker, Printed circuit board connector.
  48. Wade White, Printed circuit board top side mounting standoff.
  49. Cipolla Thomas M. (Katonah NY) Coteus Paul W. (Yorktown Heights NY), Removable heat sink assembly for a chip package.
  50. Cipolla Thomas Mario ; Coteus Paul William, Removable heat sink assembly process for a chip package.
  51. Hartke, David H.; DiBene, II, J. Ted, Right-angle power interconnect electronic packaging assembly.
  52. Fries Bror (Linghult 2 S-310 21 Hishult SEX) Fries Berit (Linghult 2 S-310 21 Hishult SEX), Screw lock.
  53. Derian, Edward J.; DiBene, II, Joseph Ted; Hartke, David H., Separable power delivery connector.
  54. Goran James L. (Orchard Lake MI), Standoff retainer.
  55. Crowley Christopher Thomas, Standoff with keyhole mount for stacking printed circuit boards.
  56. Stuhr Leslie P. (Corcoran MN), Stop pin apparatus.
  57. Ma, Hai-Fang, Supporting structure and display device using the same.
  58. Bell,Michael Ray; Stevens,David; Schneeman,Anthony; Woods, Jr.,William Lonzo; Shih,Yi Teh, System and apparatus for fixing a substrate with a heat transferring device.
  59. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., System and method for processor power delivery and thermal management.
  60. Aksu Allen, Test fixtures for testing of printed circuit boards.
  61. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., Ultra-low impedance power interconnection system for electronic packages.
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