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Stripping compositions containing an alkylamide and an alkanolamine and use thereof 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B08B-007/00
  • C09D-009/00
  • C11D-003/44
  • C23D-017/00
출원번호 US-0158316 (1988-02-22)
발명자 / 주소
  • Ward Irl E. (Hatfield PA)
출원인 / 주소
  • Advanced Chemical Technologies, Inc. (Bethlehem PA 02)
인용정보 피인용 횟수 : 56  인용 특허 : 0

초록 ▼

Stripping compositions for removing paints, varnishes, enamels, photoresists and the like, from substrates comprising compositions of (a) an amide compound of the formula: [Figure] and mixtures thereof wherein R is a member selected from the group consisting of methyl, ethyl and propyl; R1 is a memb

대표청구항 ▼

A stripping composition comprising a mixture of: (a) from about 85% to about 99% by weight of an amide compound of the formula: [Figure] and mixtures thereof, wherein R is a member selected from the group consisting of methyl, ethyl and propyl; R1 is selected from the group consisting of hydrogen, m

이 특허를 인용한 특허 (56)

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  9. Lee Wai Mun ; Pittman ; Jr. Charles U. ; Small Robert J., Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials.
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  10. Lee,Wai Mun; Pittman, Jr.,Charles U.; Small,Robert J., Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials.
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  11. Lee,Wai Mun; Pittman, Jr.,Charles U.; Small,Robert J., Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials.
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  12. Lee,Wai Mun; Pittman, Jr.,Charles U.; Small,Robert J., Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials.
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  16. Park,Dong Jin; Chon,Sang Mun; Doh,In Hoi; Jun,Pil Kwon, Composition for removing photoresist and method of forming a bump electrode in a semiconductor device using the composition.
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  17. Joseph E. Oberlander ; Mark S. Slezak ; Dinesh N. Khanna ; Dana L. Durham ; Lawrence F. Spinicelli, Composition for stripping photoresist and organic materials from substrate surfaces.
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  21. Lee, Wai Mun, Compositions and processes for photoresist stripping and residue removal in wafer level packaging.
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  22. Lee, Wai Mun, Compositions and processes for photoresist stripping and residue removal in wafer level packaging.
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  23. Small, Robert J.; Patel, Bakul P.; Lee, Wai Mun; Holmes, Douglas; Daviot, Jerome; Reid, Chris, Compositions for cleaning organic and plasma etched residues for semiconductor devices.
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  24. Small,Robert J.; Patel,Bakul P.; Lee,Wai Mun; Holmes,Douglas; Daviot,Jerome; Reid,Chris, Compositions for cleaning organic and plasma etched residues for semiconductor devices.
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  25. McKay, Jennifer; Cox, Charles K.; Wilson, Neil R., Flushing solutions for coatings removal.
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  26. McKay,Jennifer; Cox,Charles K.; Wilson,Neil R., Flushing solutions for coatings removal.
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  28. Patel,Bakul P.; Cernat,Mihaela; Small,Robert J., Methods for chemically treating a substrate using foam technology.
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  29. Honda Kenji ; Maw Taishih, Non-corrosive cleaning composition for removing plasma etching residues.
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  30. Honda Kenji ; Maw Taishih, Non-corrosive cleaning composition for removing plasma etching residues.
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  31. Honda Kenji ; Rothgery Eugene F., Non-corrosive cleaning composition for removing plasma etching residues.
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  32. Honda,Kenji; Elderkin,Michelle; Leon,Vincent, Non-corrosive cleaning composition for removing plasma etching residues.
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  33. Honda,Kenji; Elderkin,Michelle; Leon,Vincent, Non-corrosive cleaning composition for removing plasma etching residues.
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  34. Kenji Honda ; Michelle Elderkin ; Vincent Leon, Non-corrosive cleaning composition for removing plasma etching residues.
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  35. Honda Kenji (Barrington RI) Perry Donald F. (North Providence RI) Maw Taishih (Cumberland RI), Non-corrosive photoresist stripper composition.
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  36. Kenji Honda ; Richard Mark Molin ; Gale Lynne Hansen, Non-corrosive stripping and cleaning composition.
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  37. Bass, John D.; Miller, Robert D.; Feller, Bobby E., Oxidation of porous, carbon-containing materials using fuel and oxidizing agent.
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  44. Naghshineh, Shahriar; Barnes, Jeff; Oldak, Ewa B., Post chemical-mechanical planarization (CMP) cleaning composition.
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  45. Peters, Richard Dalton; Acra, Travis; Hochstetler, Spencer Erich; Pollard, Kimberly Dona, Process for etching metals.
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  46. Charm,Richard William; Zhou,De Ling; Small,Robert J.; Lee,Shihying, Process for the use of bis-choline and tris-choline in the cleaning of quartz-coated polysilicon and other materials.
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  48. Quillen, Michael Wayne; O'Dell, Dale Edward; Lee, Zachary Philip; Moore, John Cleaon; McEntire, Edward Enns; Hochstetler, Spencer Erich; Armentrout, Rodney Scott; Peters, Richard Dalton; Muck, Darryl W., Processess and compositions for removing substances from substrates.
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  49. Honda Kenji (Barrington RI) Hurditch Rodney (Providence RI), Redox reagent-containing post-etch residue cleaning composition.
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  50. Masahiro Nohara JP; Yukihiko Takeuchi JP; Taimi Oketani JP; Taketo Maruyama JP; Tetsuya Karita JP; Hisaki Abe JP; Tetsuo Aoyama JP, Resist film removing composition and method for manufacturing thin film circuit element using the composition.
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  51. Baik, Ji-Hum; Oh, Chang-Il; Yoo, Chong-Soon, Resist remover composition.
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  52. Baik,Ji Hum; Oh,Chang Il; Yoo,Chong Soon, Resist remover composition.
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  53. Ikemoto, Kazuto; Abe, Hisaki; Maruyama, Taketo; Aoyama, Tetsuo, Resist stripping agent and process of producing semiconductor devices using the same.
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  54. Wilson,Neil R.; Murphy, Jr.,Michael A., Water-based flushing solution for paints and other coatings.
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  55. Wilson, Neil R., Water-based paint-removing solution.
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  56. Wilson,Neil R., Water-based paint-removing solution.
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