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Aluminum nitride sintered body having conductive metallized layer 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-009/00
  • C04B-035/58
출원번호 US-0016557 (1987-02-19)
우선권정보 JP-0033824 (1986-02-20); JP-0033826 (1986-02-20); JP-0171914 (1986-07-23)
발명자 / 주소
  • Horiguchi Akihiro (Yokohama JPX) Kasori Mituo (Kawasaki JPX) Ueno Fumio (Kawasaki JPX) Sato Hideki (Yokohama JPX) Mizunoya Nobuyuki (Yokohama JPX) Endo Mitsuyoshi (Yamato JPX) Tanaka Shun-ichiro (Yok
출원인 / 주소
  • Kabushiki Kaisha Toshiba (Kawasaki JPX 03)
인용정보 피인용 횟수 : 43  인용 특허 : 0

초록 ▼

For higher thermal conductivity, stronger adhesion strength, excellent insulating characteristics, and multilayer interconnection, an aluminium sintered body for circuit substrates comprises a novel conductive metallized layer on the surface of the sintered body. The metallized layer comprises at le

대표청구항 ▼

An aluminum nitride sintered body, comprising: (a) an insulating layer including at least one element selected from the group consisting of alkaline earth and rare earth group elements as sintering aids and formed by sintering an aluminum nitride body; and (b) a metallized layer formed on said insul

이 특허를 인용한 특허 (43)

  1. Nagase, Toshiyuki; Nagatomo, Yoshiyuki; Kubo, Kazuaki; Negishi, Takeshi, Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material.
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  2. Casey Jon Alfred ; Cordero Carla Natalia ; Fasano Benjamin Vito ; Goland David Brian ; Hannon Robert ; Harris Jonathan H. ; Herron Lester Wynn ; Johnson Gregory Marvin ; Patel Niranjan Mohanlal ; Rei, Aluminum nitride body having graded metallurgy.
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  3. Sato Hideki (Yokohama JPX) Hatori Masakazu (Yokohama JPX) Mizunoya Nobuyuki (Yokohama JPX), Aluminum nitride circuit board.
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  4. Sato Hideki (Yokohama JPX) Mizunoya Nobuyuki (Yokohama JPX), Aluminum nitride circuit substrate.
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  5. Yasuhisa Yushio JP; Hirohiko Nakata JP; Kazutaka Sasaki JP; Masuhiro Natsuhara JP; Motoyuki Tanaka JP; Yasuhiro Murase JP, Aluminum nitride sintered body and method of preparing the same.
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  6. Yushio Yasuhisa,JPX ; Nakata Hirohiko,JPX ; Sasaki Kazutaka,JPX ; Natsuhara Masuhiro,JPX ; Tanaka Motoyuki,JPX ; Murase Yasuhiro,JPX, Aluminum nitride sintered body and method of preparing the same.
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  7. Ohkawa Yoshihiro,JPX ; Ikeda Makoto,JPX ; Miyahara Kenichiro,JPX ; Itoh Yoshiaki,JPX, Aluminum nitride substrate and process for preparation thereof.
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  8. Monma Jun,JPX ; Asai Hironori,JPX, Aluminum nitride wiring substrate and method for production thereof.
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  9. Cadden, Charles H.; Goods, Steven H.; Prantil, Vincent C., Braze system and method for reducing strain in a braze joint.
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  10. Nagase Toshiyuki,JPX ; Kuromitsu Yoshirou,JPX ; Sugamura Kunio,JPX ; Kanda Yoshio,JPX ; Hatsushika Masafumi,JPX ; Otsuki Masato,JPX, Ceramic circuit board with heat sink.
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  11. deRochemont L. Pierre ; Farmer Peter H., Ceramic composite wiring structures for semiconductor devices and method of manufacture.
    상세보기
  12. de Rochemont L. Pierre ; Farmer Peter H., Ceramic composites with improved interfacial properties and methods to make such composites.
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  13. Horiuchi Michio (Nagano JPX) Harayama Yoichi (Nagano JPX), Ceramic oxide circuit board.
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  14. Ogawa, Narutoshi; Ochiai, Kensou; Niino, Noritaka; Kooriyama, Shinichi; Konagai, Masashi, Circuit board and electronic device.
    상세보기
  15. Horiguchi Akihiro,JPX ; Sumino Hiroyasu,JPX ; Kasori Mitsuo,JPX ; Ueno Fumio,JPX, Circuit board with high strength and high reliability and process for preparing the same.
    상세보기
  16. Sato Hideki (Yokohama JPX) Mizunoya Nobuyuki (Yokohama JPX) Asai Hironori (Kawasaki JPX) Anzai Kazuo (Tokyo JPX) Hatano Tsuyoshi (Yokohama JPX), Circuit substrate comprising nitride type ceramics, method for preparing it, and metallizing composition for use in it.
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  17. Sato Hideki (Yokohama JPX) Mizunoya Nobuyuki (Yokohama JPX), Composite alumina-aluminum nitride circuit substrate.
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  18. Jimarez Lisa Jeanine ; Light David Noel ; Seman Andrew Michael ; Stone David Brian, Conductive bonding design and method for aluminum backed circuits.
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  19. Jimarez Lisa Jeanine ; Light David Noel ; Seman Andrew Michael ; Stone David Brian, Conductive bonding design for metal backed circuits.
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  20. Sato Hideki (Yokohama JPX) Mizunoya Nobuyuki (Yokohama JPX), Electronic apparatus having semiconductor device.
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  21. Enloe Jack H. (8535 Hayshed La. Columbia MD 21045) Lau John W. (14309 Night Hawk Way Gaithersburg MD 20878) Rice Roy W. (5411 Hopark Dr. Alexandria VA 22310), Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite.
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  22. Premkumar M. K. ; Sawtell Ralph R. ; Phelps Frankie E. ; DerKacy James A. ; Yun David I., Incorporating partially sintered preforms in metal matrix composites.
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  23. Schachner Herbert (Grand-Lancy CHX) Horlaville Grard (Reignier FRX), Laminate material and its use as heat-sink.
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  24. Araki,Kiyoshi; Kida,Masahiro; Ishikawa,Takahiro; Bessyo,Yuki; Makino,Takuma, Laminated radiation member, power semiconductor apparatus, and method for producing the same.
    상세보기
  25. Kiyoshi Araki ; Masahiro Kida JP; Takahiro Ishikawa JP; Yuki Bessyo JP; Takuma Makino JP, Laminated radiation member, power semiconductor apparatus, and method for producing the same.
    상세보기
  26. Katsuda, Yuji; Yoshikawa, Jun; Masuda, Masaaki; Ihara, Chikashi, Material of low volume resistivity, an aluminum nitride sintered body and a member used for the production of semiconductors.
    상세보기
  27. Sawtell Ralph R. (Monroeville PA) Premkumar Mosur K. (Monroeville PA) Yun David I. (Murrysville PA), Metal matrix composites containing electrical insulators.
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  28. Jin Sungho ; Johnson ; Jr. David Wilfred ; Law Henry Hon ; Thomson ; Jr. John ; Tiefel Thomas Henry, Metallization of ceramic through application of an adherent reducible layer.
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  29. Asai Hironori (Kanagawa-ken JPX) Sugiura Yasuyuki (Kanagawa-ken JPX), Metallized aluminum nitride substrate.
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  30. Bates Richard A. ; Cordero Carla N. ; Fasano Benjamin V. ; Goland David B.,PLX ; Hannon Robert ; Herron Lester W. ; Johnson Gregory M. ; Reitter Andrew ; Shinde Subhash L. ; Studzinski Lisa, Method for controlling of certain second phases in aluminum nitride.
    상세보기
  31. Tsukada Mineharu (Kawasaki JPX) Hida Masaharu (Kawasaki JPX) Omote Koji (Kawasaki JPX), Method for forming a ceramic circuit substrate.
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  32. Bates Richard A. ; Cordero Carla N. ; Fasano Benjamin V. ; Goland David B.,PLX ; Hannon Robert ; Herron Lester W. ; Johnson Gregory M. ; Reitter Andrew ; Shinde Subhash L. ; Studzinski Lisa, Method for the controlling of certain second phases in aluminum nitride.
    상세보기
  33. Bates Richard A. ; Cordero Carla N. ; Fasano Benjamin V. ; Goland David B.,PLX ; Hannon Robert ; Herron Lester W. ; Johnson Gregory M. ; Reitter Andrew ; Shinde Subhash L. ; Studzinski Lisa, Method for the controlling of certain second phases in aluminum nitride.
    상세보기
  34. deRochemont,L. Pierre; Farmer,Peter H., Method of manufacture of ceramic composite wiring structures for semiconductor devices.
    상세보기
  35. Ueno Fumio (Yokohama JPX) Kasori Mitsuo (Kawasaki JPX) Goto Yoshiko (Tokyo JPX) Horiguchi Akihiro (Kawasaki JPX), Method of manufacturing circuit board and circuit board itself manufactured by said method.
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  36. Lin, Hongy; Smith, Jason E.; Block, Daniel J., Methods of securing a thermocouple to a ceramic substrate.
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  37. Tanifuji Nozomi (Nagoya JPX) Naito Akihiko (Nagoya JPX) Sawada Koji (Konan JPX) Nomura Tohru (Kariya JPX) Miyase Yoshiyuki (Okazaki JPX) Nagasaka Takashi (Anjo JPX), Multilayer ceramic circuit substrate, process for producing the same, and electrically conductive material for use in mu.
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  38. Ikeda Tatsuya,JPX ; Kanda Atsushi,JPX, Multilayered wiring substrate of aluminum nitride having a high dielectric layer and method of manufacture thereof.
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  39. Sakuraba Masami,JPX ; Kimura Masami,JPX ; Nakamura Junji,JPX ; Takahara Masaya,JPX, Power module circuit board and a process for the manufacture thereof.
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  40. Ikeda Kazuo,JPX ; Komorita Hiroshi,JPX ; Sato Yoshitoshi,JPX ; Komatsu Michiyasu,JPX ; Mizunoya Nobuyuki,JPX, Silicon nitride circuit board.
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  41. Ikeda Kazuo,JPX ; Komorita Hiroshi,JPX ; Sato Yoshitoshi,JPX ; Komatsu Michiyasu,JPX ; Mizunoya Nobuyuki,JPX, Silicon nitride circuit board.
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  42. Allman Derryl D. J. ; Lee Steven S., Spin-on conductor process for integrated circuits.
    상세보기
  43. Tenhover Michael A. (East Amherst NY), Ultra-smooth ceramic substrates and magnetic data storage media prepared therefrom.
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