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특허 상세정보

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Aluminum nitride sintered body having conductive metallized layer

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) B32B-009/00    C04B-035/58   
미국특허분류(USC) 428/698 ; 428/209 ; 428/210 ; 428/699
출원번호 US-0016557 (1987-02-19)
우선권정보 JP-0033824 (1986-02-20); JP-0033826 (1986-02-20); JP-0171914 (1986-07-23)
발명자 / 주소
출원인 / 주소
인용정보 피인용 횟수 : 43  인용 특허 : 0
초록
▼

For higher thermal conductivity, stronger adhesion strength, excellent insulating characteristics, and multilayer interconnection, an aluminium sintered body for circuit substrates comprises a novel conductive metallized layer on the surface of the sintered body. The metallized layer comprises at least one element selected from the first group of Mo, W and Ta and at least one element selected from the second group of IIa, III, IVa group elements, lanthanide elements, and actinide elements in the periodic table, as the conductive phase element. The first ...

대표
청구항

An aluminum nitride sintered body, comprising: (a) an insulating layer including at least one element selected from the group consisting of alkaline earth and rare earth group elements as sintering aids and formed by sintering an aluminum nitride body; and (b) a metallized layer formed on said insulating layer, said metallized layer including: (1) a conductive element; and (2) at least one component element selected from the group consisting of IIa, IIIa, IVa, IIIb, lanthanide actinide group elements in periodic law table.

이 특허를 인용한 특허 피인용횟수: 43

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