A curable composition comprising (a) a curable polyimide soluble in organic solvents and (b) a polymerization initiator as essential components, said polyimide consisting of recurring units represented by the formula [Figure] [I] [Figure] wherein, each of X, X1, X2, X3 and X4 is a tetravalent carboc
A curable composition comprising (a) a curable polyimide soluble in organic solvents and (b) a polymerization initiator as essential components, said polyimide consisting of recurring units represented by the formula [Figure] [I] [Figure] wherein, each of X, X1, X2, X3 and X4 is a tetravalent carbocyclic or heterocyclic residue, each of Y1, Y2, and Y3 is a divalent carbocylic or heterocyclic residue, at least one of Z1 and Z2 is a residue having a reactive carbon-carbon double bond, and each of l, m, and n is an integer from 0 to 20, preferably from 0 to 10. The polyimide may include (a) polyacrylate compounds (b) bis-imide compounds (c) photosensitive polyimide precursors (d) oxime initiators (e) a 3 component sensitizer of a phenone compound, a mercapto compound, and an arylamine-alkanol, or mixtures of a,b,c,d, and e.
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A composition comprising (a) a curable polyimide soluble in organic solvents and (b) a photopolymerization initiator as essential components, said polyimide consisting of recurring units represented by the formula [Figure] [I] [Figure] wherein, each of X, X1, X2, X3, and X4 is a tetravalent carbocyc
A composition comprising (a) a curable polyimide soluble in organic solvents and (b) a photopolymerization initiator as essential components, said polyimide consisting of recurring units represented by the formula [Figure] [I] [Figure] wherein, each of X, X1, X2, X3, and X4 is a tetravalent carbocyclic or heterocyclic residue, each of Y1, Y2, and Y3 is a divalent carbocyclic or heterocyclic residue, each of Z1 and Z2 is an aromatic hydrocarbon residue of from 6 to 30 carbon atoms or a residue having a reactive carbon-carbon double bond, at least one of Z1 and Z2 is a residue having a reactive carbon-carbon double bond, and each of l, m, and n is an integer from 0 to 20.
Minnema Lourens (Groenewoudseweg 1 Eindhoven NLX) van der Zande Johan M. (Groenewoudseweg 1 Eindhoven NLX), Photosensitive polyamic acid derivative, compound used in manufacture of derivative, method of manufacturing substrate h.
Lubowitz Hyman R. (Rolling Hills Estates CA) Sheppard Clyde H. (Bellevue WA) Stephenson Ronald R. (Kirkland WA), Method of making multidimensional polyesters.
Sheppard Clyde H. (Boeing Aerospace Company ; P.O. Box 399 ; M/S 73-09 Seattle WA 98124-2499) Lubowitz Hyman R. (26 Coral Tree Ln. Rolling Hills Estates CA 90274), Methods for making liquid molding compounds using diamines and dicyanates.
Jo, Jung Ho; Kim, Kyung Jun; Seong, Hye Ran; Jeong, Hye Won; Park, Chan Hyo; Kim, Yu Na; Kim, Sang Woo; Shin, Se Jin; Ahn, Kyoung Ho, Photosensitive polyimide and photosensitive resin composition comprising the same.
Funaki, Katsuhiko; Ohkawado, Etsuo; Hirota, Kousuke; Tahara, Syuji, Photosensitive resin composition, dry film, and processed product made using the same.
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