초록 ▼

A lead frame having opposite rows of leads to be connected to the edges of a semi-conductor device and heads on one end of the leads provided with similar angularly related legs between which the edges of the device are received for ultimate soldered connection thereto, the leads and corresponding h

A lead frame having opposite rows of leads to be connected to the edges of a semi-conductor device and heads on one end of the leads provided with similar angularly related legs between which the edges of the device are received for ultimate soldered connection thereto, the leads and corresponding heads respectively extending from opposite sides of an elongated supporting strip connected at the ends thereof to the lead frame adjacent recesses in the frame to permit bending of the rows of leads substantially along the axis of the supporting strip and thereby extend the heads of the leads upwardly to cause the uppermost legs of the heads of opposite rows thereof to be spaced apart a distance greater than the width of the device to be connected thereto while the ends of the rows of lowermost legs of the heads are spaced a distance less than the width of the device to be supported thereon prior to the rows of leads being reversely bent to restore the bent leads and heads thereon to the plane of the frame and thereby cause the opposite rows of uppermost legs to be extended toward each other adequately to overlie the edges of the device and in conjunction with the lowermost legs of the heads secure the device between the rows of heads. The invention also includes a process for accomplishing the foregoing results and a forming device to achieve the same.

대표청구항 ▼

A method of mounting geometric semiconductor devices respectively upon similar lead frame units connected to each other in strip form and each unit having at least an opposed pair of rows of similar leads on opposite sides of a central opening in each frame unit, said leads having on one end heads c

A method of mounting geometric semiconductor devices respectively upon similar lead frame units connected to each other in strip form and each unit having at least an opposed pair of rows of similar leads on opposite sides of a central opening in each frame unit, said leads having on one end heads comprising a pair of similar legs evenly bent into fork-like configurations and the distance between the ends of said legs on said opposite rows thereof being less than the transverse dimension of said semi-conductor devices to be supported between said rows of heads, said rows of leads being connected integrally intermediately of the ends thereof by an elongated connecting strip, the ends of said strip are connected to portions of said lead frame by bendable portions of said lead frame adjacent opposite ends of said connecting strip, said method comprising the steps of: a. positioning a unit of said lead frame upon a supporting plate of a forming mechanism which plate has flat clamping areas and an opening alignable with the central opening in said units, b. moving a pressure plate provided with a flat clamping surface and a similar central opening into firm clamping position against said unit disposed upon said supporting plate with the openings thereof in alignment to form bending axes along the aligned edges of said openings and the headed ends of said leads projecting beyond said aligned edges and into the aligned openings of said plates, c. moving a pair of parallel narrow bending members into said aligned openings respectively adjacent the rows of headed leads projecting beyond the portions of said lead frames which are clamped between said members and bending said bendable portions of said frame in common direction uniformly through an angle of sufficient degree to the plane of said lead frame to form angularly disposed bendable portions and thereby space apart the ends of the upper legs of the opposite rows of heads a distance greater than the transverse dimension of said semi-conductor device, d. depositing a semi-conductor device through said aligned openings in said plates and resting it upon the opposite legs of the opposed rows of heads, e. withdrawing said bending members from engagement with said bendable portions of said frame, f. moving additional narrow bending members into engagement with the surfaces of said angularly disposed bedable portions of said frame opposite those engaged by said first-mentioned bending members to reversely bend said portions and restore the leads and heads thereon to the plane of the lead frame and thereby cause the ends of said upper legs of said heads to overlie the edges of said device and thereby secure it to said lead frame unit while adjacent portions of said lead frame remain clamped, and g. releasing said frame units from said clamping means for further processing to complete said units.