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특허 상세정보

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내보내기 페이스북 공유 카카오톡 공유

Heat sink device using composite metal alloy

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H05K-007/20   
미국특허분류(USC) 361/386 ; 174/163 ; 357/81
출원번호 US-0872058 (1986-06-06)
발명자 / 주소
출원인 / 주소
인용정보 피인용 횟수 : 34  인용 특허 : 13
초록
▼

The present invention involves a metal alloy heat sink containing tungsten, copper, and nickel. The heat sink is affixed to a ceramic substrate which supports one or more heat-generating electrical components. By adjusting the ratio of tungsten, copper, and nickel, substantial matching of the heat sink CTE with the substrate CTE is possible. Because the CTE of the heat sink is matched with that of the substrate, problems associated with differential thermal expansion are minimized, including micro-cracking and delamination. In addition, the completed hea...

대표
청구항

A heat sink consisting essentially of about 75-95% by weight tungsten, about 3-23% by weight copper, and about 2% by weight nickel.

이 특허에 인용된 특허 (13)

  1. Gernitis Jeffrey (Oak Ridge NJ) Butti Bruno (Englewood Cliffs NJ). Ceramic mounting and heat sink device. USP1977054025997.
  2. Fitzgerald William (Asbury NJ). Composite flanged ceramic package for electronic devices. USP1980104227036.
  3. Larker Hans (Robertsfors SEX). Composite material. USP1983084401728.
  4. Naya Eizo (Amagasaki JPX) Okumura Mitsuhiro (Amagasaki JPX). Contact material for vacuum circuit breaker. USP1986124626282.
  5. Drrschnabel Wolfgang (Bellenberg DEX) Ster Heinrich (Vhringen DEX) Steeb Jrg (Tiefenbach DEX) Puckert Franz J. (Illerrieden DEX). Copper-nickel-tin-titanium-alloy and a method for its manufacture. USP1986074601879.
  6. Mizuhara Howard (Hillsborough CA). Ductile brazing alloy containing reactive metals and precious metals. USP1986084604328.
  7. Davidson Lewis A. (Reston VA) Duffy Michael C. (Vienna VA) Erickson Alvard J. (Reston VA) Gunther-Mohr Gerard R. (Chappaqua NY) Williams Richard A. (Candor NY). Functional package for complex electronic systems with polymer-metal laminates and thermal transposer. USP1976043952231.
  8. Eales Brian A. (Stansted GB2) Bricheno Terry (Great Sampford GB2) Leggett Norman D. (Hoddesdon GB2) Ashton John E. U. (Galmpton GB2). Injection laser packages. USP1986094615031.
  9. Resneau Jean-Claude (Paris FRX) Doyen Jean (Paris FRX) Ribier Robert (Paris FRX). Low thermal resistance insulating support and base or box for power component incorporating such a support. USP1982114361720.
  10. Gehle Richard W. (Yorba Linda CA). Method for releasably mounting a substrate on a base providing heat transfer and electrical conduction. USP1980124237086.
  11. Allen Brian R. (Birmingham GB2). Method of producing an electrical component. USP1982124366361.
  12. Wada Tsuguyasu (Ann Arbor MI) Ohriner Evan K. (Ann Arbor MI). Production of (Mo,W) C hexagonal carbide. USP1984064454105.
  13. Lees John (Great Dunmow EN) Taylor Kenneth (Great Dunmow EN). Wire heat treating apparatus. USP1976113989923.

이 특허를 인용한 특허 피인용횟수: 34

  1. Osanai, Hideyo. Aluminum bonding member and method for producing same. USP2014068745841.
  2. Yu Chunzhe C. ; Kumar Reshma. Chemical synthesis of refractory metal based composite powders. USP1999065912399.
  3. Wroe Thomas (Dennis MA) Breit Henry F. (Attleboro MA). Circuit substrate and circuit using the substrate. USP1991024994903.
  4. Qin,Shu; Kellerman,Peter L.. Clamping and de-clamping semiconductor wafers on a J-R electrostatic chuck having a micromachined surface by using force delay in applying a single-phase square wave AC clamping voltage. USP2006077072166.
  5. Osanai, Hideyo; Namioka, Makoto; Iyoda, Ken. Combined member of aluminum-ceramics. USP2005066912130.
  6. Iacovangelo Charles D. (Niskayuna NY) DiConza Paul J. (Clifton Park NY). Electronic apparatus with compliant metal chip-substrate bonding layer(s). USP1996105567985.
  7. Baker Don L. (Johnson City NY) Funari Joseph (Vestal NY) Otto William F. (Rochester MN) Sammakia Bahgat G. (Johnson City NY) Stutzman Randall J. (Vestal NY). Electronic assembly with enhanced heat sinking. USP1991035003429.
  8. Naoki Kimura JP; Jun Niekawa JP. Electronic equipment housing. USP2002066400571.
  9. Utter, II, Max Everett. General health and wellness management method and apparatus for a wellness application using data from a data-capable band. USP2013058446275.
  10. Mennucci Joseph P. ; Mead Charles R.. Heat exchanger assembly and method for making the same. USP1998075777259.
  11. Polese Frank J. ; Ocheretyansky Vladimir. Heat-dissipating package for microcircuit devices. USP1999035886407.
  12. Polese Frank J. ; Ocheretyansky Vladimir. Heat-dissipating package for microcircuit devices and process for manufacture. USP1999105972737.
  13. Lai Jeng Yuan,TWX ; Huang Chien Ping,TWX. Heat-dissipating structure for integrated circuit package. USP2001056236568.
  14. Lee Soong H. (Potomac MD) Lau Chun L. (Colorado Springs CO) Buck Daniel C. (Hanover MD) Dawson Dale E. (Glen Burnie MD). Integrated circuit chip assembly utilizing selective backside deposition. USP1990084951123.
  15. Kellerman,Peter L.; Qin,Shu; Brown,Douglas A.. MEMS based multi-polar electrostatic chuck. USP2006077072165.
  16. Schneider Mark R. ; Joroski Joseph. Method of assembling a heat sink assembly. USP1999105963795.
  17. Siuzdak Allan J. (Cumberland RI). Method of forming dielectric layer on a metal substrate having improved adhesion. USP1990064936010.
  18. Siuzdak Allan J. (Cumberland RI). Method of forming dielectric layer on a metal substrate having improved adhesion. USP1991085040292.
  19. Lin, Cheng-Yu; Darga, Daniel; Groesch, Michael; Herchen, Harald; Srivatsan, Vijay. Method of measurement and estimation of the coefficient of thermal expansion in components. USP2018059958406.
  20. Natsuhara Masuhiro (Hyogo JPX) Ukegawa Harutoshi (Hyogo JPX). Mounting structure for semiconductor device having low thermal resistance. USP1997025602720.
  21. Yoshiyuki Yamamoto JP; Hirohisa Saito JP; Takahiro Imai JP. Package for semiconductors, and semiconductor module that employs the package. USP2002016335863.
  22. Bonutti, Peter M.; Beyers, Justin. Patient monitoring apparatus and method for orthosis and other devices. USP2017099763581.
  23. Schneider Mark R.. Powder metal heat sink for integrated circuit devices. USP1999025869778.
  24. Rostoker Michael D. ; Schneider Mark. Powdered metal heat sink with increased surface area. USP1999025869891.
  25. Jech David E. (Tucson AZ) Sepulveda Juan L. (Tucson AZ) Traversone Anthony B. (Tucson AZ). Process for making improved copper/tungsten composites. USP1997115686676.
  26. Ishijima, Zenzo; Okahara, Masahiro; Murasugi, Narutoshi. Production method of electrode for cold cathode fluorescent lamp. USP2010027666348.
  27. Butera Gasper. RF transistor package with nickel oxide barrier. USP200103RE37082.
  28. Schneider Mark ; Joroski Joseph. Stackable heatsink structures for semiconductor devices. USP1999055900670.
  29. Kai Yasunao,JPX ; Mishima Akira,JPX ; Gotoh Shinji,JPX ; Yamasaki Chiaki,JPX. Substrate and heat sink for a semiconductor and method of manufacturing the same. USP1999035886269.
  30. Harris Ellis D.. Thin film electronics on insulator on metal. USP2000106127725.
  31. Yoo Myoung Ki,KRX ; Park Jong Ku,KRX ; Hong Kyung Tae,KRX ; Choi Ju,KRX. Tungsten skeleton structure fabrication method employed in application of copper infiltration and tungsten-copper compo. USP1999105963773.
  32. Nagano, Yoshihiro; Ohfuji, Masaki; Kozaki, Junichiro. Turbomolecular pump device. USP2016059353755.
  33. Brewer Joe E. (Severna Park MD) Buckley ; Jr. John J. (Hanover MD). Wafer scale integrated circuit apparatus. USP1991085038201.
  34. Goyal, Dileep; Subramanian, Shanky; Chakravarthula, Hari N.. Wireless enabled cap for a data-capable device. USP2016029258670.

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