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Heat sink device using composite metal alloy 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0872058 (1986-06-06)
발명자 / 주소
  • Ehlert Michael R. (Beaverton OR) Helderman Earl R. (Hillsboro OR)
출원인 / 주소
  • Tektronix, Inc. (Beaverton OR 02)
인용정보 피인용 횟수 : 34  인용 특허 : 13

초록 ▼

The present invention involves a metal alloy heat sink containing tungsten, copper, and nickel. The heat sink is affixed to a ceramic substrate which supports one or more heat-generating electrical components. By adjusting the ratio of tungsten, copper, and nickel, substantial matching of the heat s

대표청구항

A heat sink consisting essentially of about 75-95% by weight tungsten, about 3-23% by weight copper, and about 2% by weight nickel.

이 특허에 인용된 특허 (13)

  1. Gernitis Jeffrey (Oak Ridge NJ) Butti Bruno (Englewood Cliffs NJ), Ceramic mounting and heat sink device.
    상세보기
  2. Fitzgerald William (Asbury NJ), Composite flanged ceramic package for electronic devices.
    상세보기
  3. Larker Hans (Robertsfors SEX), Composite material.
    상세보기
  4. Naya Eizo (Amagasaki JPX) Okumura Mitsuhiro (Amagasaki JPX), Contact material for vacuum circuit breaker.
    상세보기
  5. Drrschnabel Wolfgang (Bellenberg DEX) Ster Heinrich (Vhringen DEX) Steeb Jrg (Tiefenbach DEX) Puckert Franz J. (Illerrieden DEX), Copper-nickel-tin-titanium-alloy and a method for its manufacture.
    상세보기
  6. Mizuhara Howard (Hillsborough CA), Ductile brazing alloy containing reactive metals and precious metals.
    상세보기
  7. Davidson Lewis A. (Reston VA) Duffy Michael C. (Vienna VA) Erickson Alvard J. (Reston VA) Gunther-Mohr Gerard R. (Chappaqua NY) Williams Richard A. (Candor NY), Functional package for complex electronic systems with polymer-metal laminates and thermal transposer.
    상세보기
  8. Eales Brian A. (Stansted GB2) Bricheno Terry (Great Sampford GB2) Leggett Norman D. (Hoddesdon GB2) Ashton John E. U. (Galmpton GB2), Injection laser packages.
    상세보기
  9. Resneau Jean-Claude (Paris FRX) Doyen Jean (Paris FRX) Ribier Robert (Paris FRX), Low thermal resistance insulating support and base or box for power component incorporating such a support.
    상세보기
  10. Gehle Richard W. (Yorba Linda CA), Method for releasably mounting a substrate on a base providing heat transfer and electrical conduction.
    상세보기
  11. Allen Brian R. (Birmingham GB2), Method of producing an electrical component.
    상세보기
  12. Wada Tsuguyasu (Ann Arbor MI) Ohriner Evan K. (Ann Arbor MI), Production of (Mo,W) C hexagonal carbide.
    상세보기
  13. Lees John (Great Dunmow EN) Taylor Kenneth (Great Dunmow EN), Wire heat treating apparatus.
    상세보기

이 특허를 인용한 특허 (34)

  1. Osanai, Hideyo, Aluminum bonding member and method for producing same.
    상세보기
  2. Yu Chunzhe C. ; Kumar Reshma, Chemical synthesis of refractory metal based composite powders.
    상세보기
  3. Wroe Thomas (Dennis MA) Breit Henry F. (Attleboro MA), Circuit substrate and circuit using the substrate.
    상세보기
  4. Qin,Shu; Kellerman,Peter L., Clamping and de-clamping semiconductor wafers on a J-R electrostatic chuck having a micromachined surface by using force delay in applying a single-phase square wave AC clamping voltage.
    상세보기
  5. Osanai, Hideyo; Namioka, Makoto; Iyoda, Ken, Combined member of aluminum-ceramics.
    상세보기
  6. Iacovangelo Charles D. (Niskayuna NY) DiConza Paul J. (Clifton Park NY), Electronic apparatus with compliant metal chip-substrate bonding layer(s).
    상세보기
  7. Baker Don L. (Johnson City NY) Funari Joseph (Vestal NY) Otto William F. (Rochester MN) Sammakia Bahgat G. (Johnson City NY) Stutzman Randall J. (Vestal NY), Electronic assembly with enhanced heat sinking.
    상세보기
  8. Naoki Kimura JP; Jun Niekawa JP, Electronic equipment housing.
    상세보기
  9. Utter, II, Max Everett, General health and wellness management method and apparatus for a wellness application using data from a data-capable band.
    상세보기
  10. Mennucci Joseph P. ; Mead Charles R., Heat exchanger assembly and method for making the same.
    상세보기
  11. Polese Frank J. ; Ocheretyansky Vladimir, Heat-dissipating package for microcircuit devices.
    상세보기
  12. Polese Frank J. ; Ocheretyansky Vladimir, Heat-dissipating package for microcircuit devices and process for manufacture.
    상세보기
  13. Lai Jeng Yuan,TWX ; Huang Chien Ping,TWX, Heat-dissipating structure for integrated circuit package.
    상세보기
  14. Lee Soong H. (Potomac MD) Lau Chun L. (Colorado Springs CO) Buck Daniel C. (Hanover MD) Dawson Dale E. (Glen Burnie MD), Integrated circuit chip assembly utilizing selective backside deposition.
    상세보기
  15. Kellerman,Peter L.; Qin,Shu; Brown,Douglas A., MEMS based multi-polar electrostatic chuck.
    상세보기
  16. Schneider Mark R. ; Joroski Joseph, Method of assembling a heat sink assembly.
    상세보기
  17. Siuzdak Allan J. (Cumberland RI), Method of forming dielectric layer on a metal substrate having improved adhesion.
    상세보기
  18. Siuzdak Allan J. (Cumberland RI), Method of forming dielectric layer on a metal substrate having improved adhesion.
    상세보기
  19. Lin, Cheng-Yu; Darga, Daniel; Groesch, Michael; Herchen, Harald; Srivatsan, Vijay, Method of measurement and estimation of the coefficient of thermal expansion in components.
    상세보기
  20. Natsuhara Masuhiro (Hyogo JPX) Ukegawa Harutoshi (Hyogo JPX), Mounting structure for semiconductor device having low thermal resistance.
    상세보기
  21. Yoshiyuki Yamamoto JP; Hirohisa Saito JP; Takahiro Imai JP, Package for semiconductors, and semiconductor module that employs the package.
    상세보기
  22. Bonutti, Peter M.; Beyers, Justin, Patient monitoring apparatus and method for orthosis and other devices.
    상세보기
  23. Schneider Mark R., Powder metal heat sink for integrated circuit devices.
    상세보기
  24. Rostoker Michael D. ; Schneider Mark, Powdered metal heat sink with increased surface area.
    상세보기
  25. Jech David E. (Tucson AZ) Sepulveda Juan L. (Tucson AZ) Traversone Anthony B. (Tucson AZ), Process for making improved copper/tungsten composites.
    상세보기
  26. Ishijima, Zenzo; Okahara, Masahiro; Murasugi, Narutoshi, Production method of electrode for cold cathode fluorescent lamp.
    상세보기
  27. Butera Gasper, RF transistor package with nickel oxide barrier.
    상세보기
  28. Schneider Mark ; Joroski Joseph, Stackable heatsink structures for semiconductor devices.
    상세보기
  29. Kai Yasunao,JPX ; Mishima Akira,JPX ; Gotoh Shinji,JPX ; Yamasaki Chiaki,JPX, Substrate and heat sink for a semiconductor and method of manufacturing the same.
    상세보기
  30. Harris Ellis D., Thin film electronics on insulator on metal.
    상세보기
  31. Yoo Myoung Ki,KRX ; Park Jong Ku,KRX ; Hong Kyung Tae,KRX ; Choi Ju,KRX, Tungsten skeleton structure fabrication method employed in application of copper infiltration and tungsten-copper compo.
    상세보기
  32. Nagano, Yoshihiro; Ohfuji, Masaki; Kozaki, Junichiro, Turbomolecular pump device.
    상세보기
  33. Brewer Joe E. (Severna Park MD) Buckley ; Jr. John J. (Hanover MD), Wafer scale integrated circuit apparatus.
    상세보기
  34. Goyal, Dileep; Subramanian, Shanky; Chakravarthula, Hari N., Wireless enabled cap for a data-capable device.
    상세보기

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