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Process and apparatus for dissipating the heat loss of at least one assembly of electrical elements 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/02
  • H01L-023/46
출원번호 US-0941150 (1986-12-12)
우선권정보 CH-0005329 (1985-12-13); CH-0002496 (1986-06-20)
발명자 / 주소
  • Diggelmann Hans (Neuenegg CHX) Ulrich Bohdan (Kehrsatz CHX)
출원인 / 주소
  • Hasler AG. (Bern CHX 03)
인용정보 피인용 횟수 : 44  인용 특허 : 0

초록

A condenser (28) is connected at the top (31) to a riser (22) and at the bottom (32) to a downpipe (23). Below the condenser (28), a vertically disposed, plate-shaped element (13) is arranged, there being formed along the two vertical edges of this element the conduits (22, 23) and, between these, s

대표청구항

Apparatus for dissipating the heat loss of a plurality of assemblies of electrical elements (10) arranged in tiers in superimposed relationship, comprising a plate-like element (13) consisting of two sheets (134, 137), said two sheets (134, 137) joined together in superimposed pressure-sealed relati

이 특허를 인용한 특허 (44)

  1. Datta, Madhav; McMaster, Mark, Bonded metal and ceramic plates for thermal management of optical and electronic devices.
  2. Amaike, Takeshi; Heo, Seon Meyong; Watanabe, Makoto; Yasaku, Takayuki; Izumi, Shinya; Shikamura, Naoya, Cartridge type server unit and a cabinet to accommodate multiple said server units.
  3. Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Cold plate for dual refrigeration systems.
  4. Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Combined air and refrigeration cooling for computer systems.
  5. Murakami, Vance B.; Willever, Tony; Grisham, John M., Controlling cooling fluid flow in a cooling system with a variable orifice.
  6. Kenny, Thomas W.; Munch, Mark; Zhou, Peng; Shook, James Gill; Goodson, Kenneth; Corbin, Dave; McMaster, Mark; Lovette, James, Cooling systems incorporating heat exchangers and thermoelectric layers.
  7. Patyk Guy J. ; Olsen Curtis O., DC motor drive with improved thermal characteristics.
  8. Niederer, Michael; Walz, Kurt; Bohlender, Franz, Electric heating device.
  9. Takahiro Katoh JP; Kiyoo Amako JP, Electronic components cooling apparatus.
  10. Wells, Robert G.; Gilley, Bernie J.; George, Donald S.; Johnson, William Joel Dietmar, Electronic device with heat sink flange and related methods.
  11. Bilski, W. John, Electronics cabinet and rack cooling system and method.
  12. Broome, John P., Equipment rack accessory for improving equipment mounting.
  13. Broome, John P., Equipment rack accessory for improving equipment mounting.
  14. Broome, John P., Equipment rack with integral HVAC and power distribution features.
  15. Chu Richard C. ; Chrysler Gregory M., Evaporator for use in an extended air cooling system for electronic components.
  16. Chu Richard C. ; Chrysler Gregory M., Extended air cooling with heat loop for dense or compact configurations of electronic components.
  17. Hartzell, Dennis E.; Oleksy, John; Ognibene, Edward J.; Breaux, Lyle, Finned-tube heat exchangers and cold plates, self-cooling electronic component systems using same, and methods for cooling electronic components using same.
  18. Wenger, Todd M., Fluid circuit heat transfer device for plural heat sources.
  19. Wenger,Todd M., Fluid circuit heat transfer device for plural heat sources.
  20. Munch, Mark; Werner, Douglas E., Gimballed attachment for multiple heat exchangers.
  21. Ekstedt, Ulf; Johansson, Mikael, Heat conducting mounting structure, method and radio base station housing arrangement for mounting electronic modules.
  22. Dussinger,Peter M.; Myers,Thomas L., Integrated circuit heat pipe heat spreader with through mounting holes.
  23. Hom, James; Upadhya, Girish; Werner, Douglas E.; Munch, Mark; Tsao, Paul; Conway, Bruce; Zhou, Peng; Brewer, Richard, Integrated liquid to air conduction module.
  24. L. Ronald Hoover ; Jon Zuo ; A. L. Phillips, Integrated thermal architecture for thermal management of high power electronics.
  25. Hom, James; Choi, Hae-won; Lin, Tien Chih (Eric); Werner, Douglas E.; Chow, Norman; Correa, Adrian; Leong, Brandon; Gopalakrishnan, Sudhakar; Brewer, Richard Grant; McMaster, Mark; Upadhya, Girish, Internal access mechanism for a server rack.
  26. Chow, Norman; Tsao, Paul; Werner, Douglas E.; McMaster, Mark; Upadhya, Girish; Landry, Frederic; Spearing, Ian; Schrader, Tim, Liquid cooling loops for server applications.
  27. Upadhya, Girish; Munch, Mark; Chow, Norman; Tsao, Paul; Werner, Douglas E.; McMaster, Mark; Landry, Frederic; Spearing, Ian; Schrader, Tim, Liquid cooling loops for server applications.
  28. Yazawa, Kazuaki; Bar-Cohen, Avram, Method and apparatus for converting dissipated heat to work energy.
  29. Datta, Madhav; McMaster, Mark; Brewer, Rick; Zhou, Peng; Tsao, Paul; Upadhaya, Girish; Munch, Mark, Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system.
  30. Datta, Madhav; Leong, Brandon; McMaster, Mark, Microheat exchanger for laser diode cooling.
  31. Memory, Stephen B.; Ganaway, Fredrick E.; Rogers, C. James; DeVuono, Anthony C.; Phillips, Alfred; Zuo, Zhijun, Modular cooling system and thermal bus for high power electronics cabinets.
  32. Hare Jeffrey J. ; Harris Willard S. ; Hickey Jody A. ; Schmidt Roger R. ; Seminaro Edward J. ; Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Modular refrigeration system.
  33. Hare Jeffrey J. ; Harris Willard S. ; Hickey Jody A. ; Schmidt Roger R. ; Seminaro Edward J. ; Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Modular refrigeration system.
  34. Upadhya, Girish; Herms, Richard; Zhou, Peng; Goodson, Kenneth; Hom, James, Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange.
  35. Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.
  36. Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.
  37. Mittermayr, Günter, Roll changing device with wedge adjusting device.
  38. Amaike, Takeshi; Heo, Seon Meyong; Watanabe, Makoto; Yasaku, Takayuki; Izumi, Shinya; Shikamura, Naoya, Server unit comprising stacked multiple server unit cabinets accommodating multiple cartridge type server units.
  39. Bear, Daniel B., Single or dual buss thermal transfer system.
  40. Semple J. Brooks (Warrenton VA), Temperature limiting apparatus for elevator controls.
  41. Khrustalev, Dmitry; Zuo, Jon, Thermal bus for cabinets housing high power electronics equipment.
  42. Garner, Scott D., Thermal management system and method for electronics system.
  43. Garner, Scott D., Thermal management system and method for electronics system.
  44. Garner,Scott D., Thermal management system and method for electronics system.
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