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Dial deposition and processing apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-013/08
출원번호 US-0038540 (1987-04-15)
발명자 / 주소
  • Boys Donald R. (Cupertino CA) Graves Walter E. (San Jose CA)
출원인 / 주소
  • Genus, Inc. (Mountain View CA 02)
인용정보 피인용 횟수 : 43  인용 특허 : 6

초록

A system for moving and processing workpieces includes individual stations isolated from one another and from a main chamber by seals formed by a transport mechanism. Workpieces are moved in a queue in a circular pattern, by a dial turret operated by a bell-crank and a Geneva mechanism. Stations sea

대표청구항

A system for moving and processing workpieces comprising: a main baseplate forming a fixed horizontal framing element of said system, having a central hole therethrough and two or more vertical passages therethrough, said vertical passages arranged at repeating angular intervals on the circumference

이 특허에 인용된 특허 (6)

  1. Mink George (37900 Mound Rd. Sterling Heights MI 48077), Amplified motion transmitting device.
  2. Boys Donald R. (Cupertino CA) Graves Walter E. (San Jose CA), Disk or wafer handling and coating system.
  3. Noda Minoru (31-1 Kameido 6-chrome Koto-ku ; Tokyo JPX) Miyata Tsutomu (31-1 Kameido 6-chrome Koto-ku ; Tokyo JPX) Yamashita Yoshihiro (31-1 Kameido 6-chrome Koto-ku ; Tokyo JPX) Ohmura Kenji (31-1 K, Linear transfer device for wafery works.
  4. Graves ; Jr. Walter E. (San Jose CA) Boys Donald (Cupertino CA) Turner Frederick T. (Sunnyvale CA), Sputter-coating system, and vaccuum valve, transport, and sputter source array arrangements therefor.
  5. Coad George L. (Lafayette CA) Hutchinson Martin A. (Santa Clara CA) Shaw R. Howard (Palo Alto CA), Wafer coating system.
  6. Coad George L. (Lafayette CA) Shaw R. Howard (Palo Alto CA) Hutchinson Martin A. (Santa Clara CA), Wafer transfer system.

이 특허를 인용한 특허 (43)

  1. Lee Jong-Hyun,KRX ; Yoo Hyung-Joun,KRX ; Choi Boo-Yeon,KRX ; Jang Won-Ick,KRX ; Jang Ki-Ho,KRX, Apparatus for transferring a wafer.
  2. Voutsas, Apostolos; Nakata, Yukihiko, Apparatus to sputter silicon films.
  3. Stevens, Craig L.; Levy, Karl B., Architecture for high throughput semiconductor processing applications.
  4. Kroeker Tony R. ; Cook Larry, Atmospheric wafer transfer module with nest for wafer transport robot.
  5. Boyd Trace L. ; Beer Richard D. ; Terbeek Eric A. ; Wong Vernon W. H., Chamber interfacing O-rings and method for implementing same.
  6. Boyd Trace L. ; Beer Richard D. ; Terbeek Eric A. ; Wong Vernon W. H., Chamber interfacing O-rings and method for implementing same.
  7. Schertler Roman (Wolfurt ATX), Chamber, at least for the transport of workpieces, a chamber combination, a vacuum treatment facility as well as a trans.
  8. Schertler Roman,ATX, Chamber, at least for the transport of workpieces, a chamber combination, a vacuum treatment facility as well as a trans.
  9. Roman Schertler AT, Chamber, at least for the transport of workpieces, a chamber combination, a vacuum treatment facility as well as a transport method.
  10. Schertler Roman,ATX, Chamber, at least for the transport of workpieces, a chamber combination, a vacuum treatment facility as well as a transport method.
  11. Aruga Yoshiki,JPX ; Kamikura Yo,JPX, Compact in-line film deposition system.
  12. Tepman Avi ; Yin Gerald Zheyao ; Olgado Donald, Compartmentalized substrate processing chamber.
  13. Tepman Avi ; Yin Gerald Zheyao ; Olgado Donald, Compartnetalized substrate processing chamber.
  14. Sauer, Andreas, Continuous coating system.
  15. Kroeker Tony R. ; Mooring Benjamin W. ; Bright Nicolas J., Dual sided slot valve and method for implementing the same.
  16. Morikawa, Yasuhiro; Hayashi, Toshio; Suu, Koukou, Etching method and system.
  17. Morikawa, Yasuhiro; Hayashi, Toshio; Suu, Koukou, Etching method and system.
  18. Liskow, Karl J.; Mueller, Paul A.; Hayes, David; Darrow, Robert E.; Jenkins, Jack, Gripper gage assembly.
  19. Stevens, Craig Lyle, High throughput architecture for semiconductor processing.
  20. Aruga Yoshiki,JPX ; Maeda Koji,JPX, Method of removing accumulated films from the surface of substrate holders in film deposition apparatus, and film deposition apparatus.
  21. Kroeker, Tony R.; Tomasch, Gregory A., Methods of implementing a single shaft, dual cradle vacuum slot valve.
  22. Emmi Peter A. ; Park Byeongju, Pass-through semiconductor wafer processing tool and process for gas treating a moving semiconductor wafer.
  23. Matsuse Kimihiro,JPX, Processing apparatus and processing system.
  24. Mooring Benjamin W. ; Bright Nicolas J., Semiconductor processing platform architecture having processing module isolation capabilities.
  25. Kroeker, Tony R.; Tomasch, Gregory A., Single shaft, dual cradle vacuum slot valve.
  26. Coad George L. ; Lawson Eric C. ; Hughes John Lester, Substrate handling and processing system for flat panel displays.
  27. Hessburg Merilly Ann ; Lindsley Timothy John ; Darrow David Craig ; Sheffield John Edgar, System and method for hydrodynamic loading and unloading of objects into and out of substantially touchless hydrodynamic transport systems.
  28. Stevens, Craig L.; Jakubiec, Antoni F., System and method for processing semiconductor wafers including single-wafer load lock.
  29. Hessburg Merilly Ann ; Lindsley Timothy John ; Darrow David Craig ; Sheffield John Edgar, System and method for substantially touchless hydrodynamic transport of objects.
  30. Larson Dean Jay ; Sutton Thomas R., Tolerance resistant and vacuum compliant door hinge with open-assist feature.
  31. Boyd Trace L. ; Terbeek Eric A., Transport chamber and method for making same.
  32. Tomasch,Gregory A., Unitary slot valve actuator with dual valves.
  33. Tomasch,Gregory A., Unitary slot valve actuator with dual valves.
  34. Tamura Naoyuki (Kudamatsu JPX) Kanai Norio (Kudamatsu JPX), Vacuum apparatus.
  35. Boyd Trace L. (San Jose CA) Yeoman Martin F. (San Ramon CA), Vacuum chamber gate valve and method for making same.
  36. Schertler,Roman, Vacuum process apparatus.
  37. Schertler,Roman, Vacuum process apparatus.
  38. Weinberg Richard S. (Palo Alto CA), Vacuum vessel.
  39. Zeakes, Jason S.; Haris, Clinton; Mautz, Karl E.; Hiatt, William Mark, Wafer carrier transport system for tool bays.
  40. Craig Stevens ; Tony Jakubiec, Wafer processing architecture including single-wafer load lock with cooling unit.
  41. Toshima Masato, Wafer transfer system.
  42. Toshima Masato, Wafer transfer system and method of using the same.
  43. Toshima Masato, Wafer transfer system and method of using the same.
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