[특허]Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby

[미국특허] Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-001/00 B32B-003/00 C23F-001/02 B29C-037/00
출원번호	US-0090043 (1987-08-31)
발명자 / 주소	Chant Peter R. (Burlington CAX)
출원인 / 주소	Firan Corporation (Oakville CAX 03)
인용정보	피인용 횟수 : 13 인용 특허 : 10

초록 ▼

A process for producing circuit boards involves the coating of a resinous substrate with a fluid mixture of an epoxy polymer component and a rubber polymer which is interactive therewith at temperatures of at least 180°F. Preferably the rubber is a low molecular weight polyfunctional reactive butadiene/acrylonitrile interpolymer which is terminated by vinyl or carboxyl functional groups. The rubber component comprises at least 70 percent by weight of the epoxy polymer component, and the coating has a thickness of 0.001-0.015 inch. The coating is partially cured to effect partial polymerization of the epoxy prepolymer, further polymerization of the rubber, if it is low molecular weight, and interaction of the rubber and epoxy polymer to form a matrix of the interacted rubber/epoxy. The exposed surface of this coating is then etched, and metal is deposited on the surface to form a conductive layer. A conductive pattern is formed therein, and heat and pressure are then applied to the conductive pattern and coating to fully cure the coating and bond the coating to the metal layer, and thus the conductive pattern to the resinous substrate. The metal layer may be deposited chemically or by vacuum metallizing and like techniques.

대표청구항 ▼

In a process for producing circuit boards having a metallized circuit pattern firmly bonded to a resinous substrate, the steps comprising: (a) coating a resinous substrate with a fluid mixture of a formualtion containing; (i) a low molecular weight polyfunctional reactive rubber component comprising an interpolymer of butadiene and acrylonitrile; and (ii) an epoxy polymer component, said components being interactive at temperatures of at least 180°F., said rubber component comprising 50-200 percent by weight of the epoxy polymer component, said coating having a thickness of 0.0005-0.015 inch; (b) partially curing the coating to produce partial cross-linking of said epoxy polymer component, further polymerization of the rubber, and interaction of said rubber and epoxy polymer components; (c) etching the exposed surface of the coating to produce a microporous surface; (d) depositing metal on the microporous surface of the coating to form a conductive layer with microformations extending into the recesses of said microporous surface; (e) applying heat and pressure to said conductive layer and coating to fully cure said coating, thereby firmly bonding said coating to said metal layer and thereby said conductive layer through said coating to said resinous substrate; and (f) electrodepositing metal on said conductive layer to form a conductive pattern therewith, said conductive pattern being bonded firmly to said substrate through said conductive layer and coating. In a circuit board, the combination comprising: (a) a resinous substrate; (b) an intermediate coating on one surface of said substrate of about 0.0005-0.015 inch and containing a rubber component and an epoxy polymer which have interacted to provide a matrix of the interacted rubber/epoxy polymer, said rubber component comprising at least 35 percent by weight of said coating; and (c) a metal conductive pattern on said coating providing a circuit, said conductive pattern having a base metal layer with microformations at the interface with said coating an extending thereinto, said conductive pattern being embedded in said coating to a depth substantially equal to the thickness of said base metal layer, said coating being firmly bonded to said base metal layer and said conductive pattern thereby being bonded through said coating and base metal layer to said substrate.

이 특허에 인용된 특허 (10) 인용/피인용 타임라인 분석

Ors Jose A. (Solebury Township ; Bucks County PA) Small ; Jr. Richard D. (West Windsor Township ; Mercer County NJ), Circuit board fabrication leading to increased capacity.
상세보기
Chant Peter R. (Burlington CAX), Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby.
상세보기
Stahl Fritz (Tonisvorst DEX) Steffen Horst (Geldern-Pont DEX), Method for producing printed circuit boards with punched holes having metallized walls.
상세보기
Kumagai Henry Y. (Lower Macungie Township ; Lehigh County PA) Shanefield Daniel J. (Princeton Township ; Mercer County NJ) Verdi Fred W. (Lawrence Township ; Mercer County NJ), Method for providing an adherent electroless metal coating on an epoxy surface.
상세보기
Johnson Daniel D. (Yorklyn DE) Fritz Herbert L. (Englishtown NJ), Process for forming conductive through-holes through a dielectric layer.
상세보기
Acitelli Mario A. (Endwell NY) Woods James T. (Binghamton NY), Process for preparing epoxy laminates for additive plating.
상세보기
Oshima Renzo (Hachioji JPX) Kyojima Yoshiyuki (Kawasaki JPX) Fujii Takara (Yokohama JPX) Kato Shoji (Yokohama JPX), Production of laminate for receiving chemical plating.
상세보기
Crabtree David J. (Solvang CA) Park Elizabeth Y. (Los Angeles CA), Rubber modified epoxy adhesive.
상세보기
O\Neil James W. (Howell NJ), Single exposure process for preparing printed circuits.
상세보기
Polichette Joseph (South Farmingdale NY) Leech Edward J. (Oyster Bay NY) Schneble ; Jr. Frederick W. (Oyster Bay NY), Transfer coating process for manufacture of printing circuits.
상세보기

이 특허를 인용한 특허 (13) 인용/피인용 타임라인 분석

Maue H. Winston ; Eakins Bert W., Electric junction box for an automotive vehicle.
상세보기
Ushio Jiro (Yokohama JPX) Miyazawa Osamu (Yokosuka JPX) Tomizawa Akira (Yokohama JPX) Yokono Hitoshi (Ibaraki JPX) Kanda Naoya (Yokohama JPX) Matsuura Naoko (Yokohama JPX) Ando Setsuo (Kawasaki JPX) , Electronic device plated with gold by means of an electroless gold plating solution.
상세보기
Maue H. Winston ; Wooldridge George A., Integrated interior trim and electrical assembly for an automotive vehicle.
상세보기
Maue H. Winston ; Reich Ronald K. ; Morgan Robert G. ; Roddy Timothy S., Interior trim panel and electrical harness apparatus for an automotive vehicle.
상세보기
Chant Peter R. (Burlington CAX), Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby.
상세보기
Hakey Mark C. ; Ma William Hsioh-Lien, Method of fabricating structure for chip micro-joining.
상세보기
Schreiber Christopher M. (Rancho Santa Margarita CA), Method of forming an interconnection by an excimer laser.
상세보기
Bowles, Philip Harbaugh; Mobley, Washington Morris; Parker, Richard Dixon; Ellis, Marion Edmond, Method of forming integral passive electrical components on organic circuit board substrates.
상세보기
Joseph Charles A. (Candor NY) Petrozello James R. (Endicott NY), Method of using electrically conductive composition.
상세보기
Bradshaw, Richard Lionel; Pyun, Dong-Chul, Protective coating of magnetic nanoparticles.
상세보기
Sugaya, Yasuhiro; Komatsu, Shingo; Hirano, Koichi; Nakatani, Seiichi; Matsuoka, Yasuyuki; Asahi, Toshiyuki; Yamashita, Yoshihisa, Transfer material for wiring substrate.
상세보기
Sugaya, Yasuhiro; Komatsu, Shingo; Hirano, Koichi; Nakatani, Seiichi; Matsuoka, Yasuyuki; Asahi, Toshiyuki; Yamashita, Yoshihisa, Transfer material used for producing a wiring substrate.
상세보기
Sugaya, Yasuhiro; Komatsu, Shingo; Hirano, Koichi; Nakatani, Seiichi; Matsuoka, Yasuyuki; Asahi, Toshiyuki; Yamashita, Yoshihisa, Wiring substrate produced by transfer material method.
상세보기

활용도 분석정보

상세보기

다운로드

내보내기

활용도 Top5 특허

해당 특허가 속한 카테고리에서 활용도가 높은 상위 5개 콘텐츠를 보여줍니다.
더보기 버튼을 클릭하시면 더 많은 관련자료를 살펴볼 수 있습니다.

내보내기 메뉴

내보내기 구분

파일저장
인쇄
메일전송

구성항목

기본정보
상세정보

관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC

저장형식

Text(ASCII format)
Excel format
PIAS분석(.xls)

메일정보

받는사람 (필수): @
보내는사람 (선택): @
제목
내용: KISTI 검색결과 이메일 서비스

안내

총 건의 자료가 검색되었습니다.

다운받으실 자료의 인덱스를 입력하세요. (1-10,000)

검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다.

데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요)

다운로드 파일은 UTF-8 형태로 저장됩니다.
파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오.

Text(ASCII format)
Excel format

AI-Helper ※ AI-Helper는 을 사용합니다.

AI-Helper

안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

연합인증

[미국특허] Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby 원문보기