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Curable thermosetting resin compositions comprise a continuous phase of a curable thermosetting organic or a curable thermosetting silicone resin containing dispersed finely divided particles of a cured composition prepared by reacting 1) an organopolysiloxane, 2) a curing agent for the organopolysi

Curable thermosetting resin compositions comprise a continuous phase of a curable thermosetting organic or a curable thermosetting silicone resin containing dispersed finely divided particles of a cured composition prepared by reacting 1) an organopolysiloxane, 2) a curing agent for the organopolysiloxane, 3) an alkoxy group-containing organosilicon compound and 4) a compound of aluminum or zirconium where this compound is an alkoxide, phenoxide, carboxylate or a derivative of a beta- dicarbonyl compound or o-hydroxyketone. Ingredients 3) and 4) can be prereacted and the cured composition optionally contains a filler. The presence of ingredients 3) and 4) imparts improved adhesion between the continuous an dispersed phases of the composition.

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A curable thermosetting resin composition comprising (A) 100 parts by weight of a curable thermosetting resin; (B) from 0.1 to 100 parts by weight, based on the weight of said composition following curing, of a material obtained by curing a reaction mixture comprising (a) 100 parts by weight of an o

A curable thermosetting resin composition comprising (A) 100 parts by weight of a curable thermosetting resin; (B) from 0.1 to 100 parts by weight, based on the weight of said composition following curing, of a material obtained by curing a reaction mixture comprising (a) 100 parts by weight of an organopolysiloxane exhibiting a viscosity of at least 0.010 Pa.s at 25 degrees C., where the organic groups bonded to silicon are identical or different monovalent hydrocarbon radicals, (b) from 0 to 100 parts by weight of a filler, (c) from 0.3 to 40 parts by weight of a curing agent for said organopolysiloxane, and (d) from 0.1 to 20 parts by weight of an alkoxy group-containing organosilicon compound represented by the formula R1aSi(OR2)4-a where R1 is a monovalent hydrocarbon radical or a monovalent organofunctional group consisting essentially of an epoxy, amino, methacryloxy or mercapto group that is bonded to the silicon atom of said organosilicon compound through at least one carbon atom and a is 1, 2 or 3, and (e) from 0.001 to 5 parts by weight of a compound of either aluminum or zirconium, where said compound is an alkoxide, a phenoxide, a carboxylate, or a derivative of said compound wherein one or more of the alkoxide, phenoxide or carboxylate groups is replaced by an organic ligand which is of either a betadiketone or a o-hydroxyketone, with the proviso that when said curing agent is a hydrolyzable group-containing organosilane, ingredients (d) and (e) are added as a preformed heat reaction product, and where ingredient (B) is dispersed in the form of a fine powder in ingredient (A). A composition according to claim 1 wherein the thermosetting resin comprising ingredient (A) is an epoxy resin, phenolic resin, imide resin or silicone resin.