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Pressure-sensitive adhesives 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B05D-005/10
  • C08F-002/54
  • C08F-020/18
출원번호 US-0941350 (1986-12-15)
발명자 / 주소
  • Williams Jeffrey D. (Washington DC) Young Marvin L. (Rockville MD) Ahmad Syed S. (Lanham MD) Ransohoff Jackson A. (Bethesda MD)
출원인 / 주소
  • Neutron Products, Inc. (Dickerson MD 02)
인용정보 피인용 횟수 : 32  인용 특허 : 7

초록

Acrylate-based pressure-sensitive adhesives are produced by a process in which a liquid, polymerizable monomer composition containing at least one acrylate monomer is placed in a closed reaction vessel, deaerated and the monomer(s) are polymerized by exposure to ionizing radiation such as gamma irra

대표청구항

A process for preparing a substrate for bonding which comprises applying to the substrate by hot-melt application a pressure-sensitive adhesive which is produced by the process which comprises: (a) introducing, to a sealable reaction vessel, a liquid, polymerizable monomer composition, comprising: (

이 특허에 인용된 특허 (7)

  1. Martens John A. (White Bear Lake MN) Clemens Lawrence M. (Minneapolis MN) Zigman Alvin R. (Woodbury MN), Acrylic-type pressure sensitive adhesives by means of ultraviolet radiation curing.
  2. Potter William D. (Bishop\s Stortford Herts GBX) Kiamil Sinan B. (Harlow GBX), Cured pressure sensitive adhesives.
  3. Pastor Stephen D. (Spring Valley NY) Ganslaw Stuart H. (Morristown NJ), Pressure sensitive hot melt adhesive curable by exposure to electron beam radiation.
  4. Stueben Kenneth C. (Bridgewater NJ) Azrak Raymond G. (Whitehouse Station NJ) Patrylow Michael F. (Kenilworth NJ), Radiation curable adhesive compositions.
  5. Brenner Walter (Teaneck NJ), Radiation curable adhesive compositions and composite structures.
  6. Rowe William (Westfield NJ), Radiation curable pressure sensitive adhesive.
  7. Pastor Stephen D. (Edison NJ) Skoultchi Martin M. (Somerset NJ), Radiation polymerized hot melt pressure sensitive adhesives.

이 특허를 인용한 특허 (32)

  1. Deeb Gerald S. ; Krueger Dennis L. ; Menzies Robert H. ; Morris Herbert W. ; Hyde Patrick D. ; Lau Felix P. ; Pyum Eumi ; Tucker Pamela S. ; Wong Roy, Adhesive tape and method of making.
  2. Deeb Gerald S. ; Krueger Dennis L. ; Menzies Robert H. ; Morris Herbert W. ; Hyde Patrick D. ; Lau Felix P. ; Pyun Eumi ; Tucker Pamela S. ; Wong Roy, Adhesive tape and method of making.
  3. Deeb Gerald S. ; Krueger Dennis L. ; Menzies Robert H. ; Morris Herbert W. ; Hyde Patrick D. ; Lau Felix P. ; Pyun Eumi ; Tucker Pamela S. ; Wong Roy, Adhesive tape and method of making.
  4. Saiki, Yuuji; Satake, Masayuki; Takahashi, Yasushi; Shouda, Takashi, Adhesive used for polarizing plate and optical member.
  5. Webster Iain,GBX, Adhesives.
  6. Husemann, Marc; Zollner, Stephan, Bimodal acrylate pressure-sensitive adhesive compounds.
  7. Hyde, Patrick D.; Krueger, Dennis L.; Lau, Felix P.; Pyun, Eumi; Shipman, Robert W.; Tucker, Pamela S.; Wong, Roy; Yarusso, David J., Blended pressure-sensitive adhesives.
  8. Hyde, Patrick Darby; Wong, Roy; Krueger, Dennis Louis; Shipman, Robert W. G.; Yarusso, David James; Lau, Felix P.; Pyun, Eumi; Tucker, Pamela S., Blended pressure-sensitive adhesives.
  9. Patnode Gregg A. ; Hyde Patrick D., Blended pressure-sensitive adhesives.
  10. Tynan, Jr., John K.; Lewandowski, Mark A.; St. Coeur, Richard W., Continuous bulk polymerization of vinyl monomers.
  11. Kinigakis, Panagiotis; Pokusa, Kenneth C., Flexible package with internal, resealable closure feature.
  12. Douglas E. Weiss ; Thu-Van T. Tran ; Karen J. Leisinger, Gamma radiation polymerized emulsion-based (meth)acrylate pressure sensitive adhesives and methods of making and using same.
  13. Sherman, Audrey A.; Hamer, Craig E.; Lucast, Donald H.; Augustine, Thomas E.; Winkler, Wendi J., Hot melt processable polyurea copolymers and methods of their preparation and use.
  14. Weiss Douglas E. ; Tran Thu-Van T. ; Sventek Bruce A., Low temperature electron beam polymerization.
  15. Boyce, Jeffrey James; Clingerman, Michael; Henry, Colleen Marie; Masterson, David Chris; McGinniss, Vincent Daniel, Low-tack, UV-cured pressure sensitive adhesive suitable for reclosable packages.
  16. Boyce, Jeffrey James; Clingerman, Michael; Henry, Colleen Marie; Masterson, David Chris; McGinniss, Vincent Daniel, Low-tack, UV-cured pressure sensitive adhesive suitable for reclosable packages.
  17. McGuire, Jr., James E.; Strange, Andrew C.; Lamone, Daniel E., Method and apparatus for continuous production of partially polymerized compositions and polymers therefrom.
  18. McGuire, Jr., James E.; Strange, Andrew C.; Lamone, Daniel E., Method for continuous production of (meth)acrylate syrup and adhesives therefrom.
  19. Tran Thu-Van T. ; Weiss Douglas E., Method of making electron beam polymerized emulsion-based acrylate pressure sensitive adhesives.
  20. O'Neal, Daniel J.; Myers, Sasha B.; Richter, Karl; Tran, Thu-Van T.; Hamer, Craig E., Method of making package viscoelastic compositions by polymerizing ethylenically-unsaturated materials using ionizing radiation.
  21. Myers, Sasha B.; O'Neal, Daniel J.; Richter, Karl B.; Tran, Thu-Van T.; Hamer, Craig E., Method of polymerizing ethylenically-unsaturated materials using ionizing radiation.
  22. Hamer Craig E. ; Moon John D. ; Kotnour Thomas A., Methods of making packaged viscoelastic compositions.
  23. Moon John D., Methods of making packaged viscoelastic compositions.
  24. Mikura Chiemi,JPX ; Yamaoka Takashi,JPX ; Wakabayashi Akira,JPX, Optical film and liquid crystal display.
  25. Clark, Kerri Kim; Kinigakis, Panagiotis; Pokusa, Kenneth C.; Zerfas, Paul Anthony; Boyce, Jeffrey James; Clingerman, Michael; Henry, Colleen Marie; Masterson, David Chris; McGinniss, Vincent Daniel, Package having an adhesive-based reclosable fastener and methods therefor.
  26. Hamer Craig E. ; Moon John D. ; Kotnour Thomas A., Packaged pre-adhesive composition.
  27. Saiki, Yuuji; Satake, Masayuki; Takahashi, Yasushi; Kusumoto, Seiichi; Sugino, Youichirou; Matsunaga, Takuya; Kondou, Senri; Shouda, Takashi, Polarizing plate with optical compensation film and liquid crystal display.
  28. Davidson Robert S. ; Duerr Brook F. ; Siedle Allen R. ; Brown Katherine A. ; Hamer Craig E., Process for the packaged polymerization of olefinic monomers.
  29. Smith, Gary Francis; Rivera, Edwin, Processed cheese without emulsifying salts.
  30. Barbieri, Mark D.; St. Coeur, Richard W.; Tynan, Jr., John K.; Lewandowski, Mark A., Recirculation loop reactor bulk polymerization process.
  31. Zerfas, Paul Anthony; Clark, Kerri Kim; Halka, John Dill; Kinigakis, Panagiotis; Pokusa, Kenneth C.; Boyce, Jeffrey James; Clingerman, Michael; Henry, Colleen Marie; Masterson, David Chris; McGinniss, Vincent Daniel, Reclosable fasteners, packages having reclosable fasteners, and methods for creating reclosable fasteners.
  32. Storbeck, Reinhard; Bargmann, Renke; Husemann, Marc, Use of self-adhesive materials having anisotropic properties for producing stamping products.
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