초록 ▼

The present invention relates to a thermal conduction device well suited to cool electronic components such as semiconductor devices, in which a porous layer is provided at the surface part of the contact interface of a heat generating element or a heat sink element, and a liquid such as oil is cont

The present invention relates to a thermal conduction device well suited to cool electronic components such as semiconductor devices, in which a porous layer is provided at the surface part of the contact interface of a heat generating element or a heat sink element, and a liquid such as oil is contained in cavities formed in the porous layer, the heat generating element and the heat sink element being held in close contact by the surface tension of the liquid, whereby heat generated by the heat generating element is transferred to the heat sink element.

대표청구항 ▼

A thermal conduction device comprising a heat generating element, a heat sink element which carries heat generated by said heat generating element, out of said device, notches which are formed in a surface of said heat sink element, a porous layer which is formed by sintering ultrafine grains and ha

A thermal conduction device comprising a heat generating element, a heat sink element which carries heat generated by said heat generating element, out of said device, notches which are formed in a surface of said heat sink element, a porous layer which is formed by sintering ultrafine grains and has microscopic cavities and which is provided on said notches of said surface of said heat sink element, and a liquid which is contained in said cavities, said heat generating element being held in close contact with said porous layer by a surface tension of said liquid.