초록 ▼

A composition and method for providing temporary masking of electrical and electronic components compatible with a high speed production operation. The composition is a radiation curable viscous liquid composition which provides minimal adhesion properties and substantial cohesive properties so that

A composition and method for providing temporary masking of electrical and electronic components compatible with a high speed production operation. The composition is a radiation curable viscous liquid composition which provides minimal adhesion properties and substantial cohesive properties so that when cured, it can be readily removed in the manner of an adhesive tape. In particular, the radiation curable composition is characterized by cured properties a) of positive adhesion to the substrate to which the composition is applied, but insufficient adhesion to resist peeling forces applied by hand; and b) of sufficient cohesive strength to allow substantially all of the cured composition to be stripped mechanically or by hand in a single piece. Suitably the adhesion of the cured composition (22) to the substrate (16) as measured in the tensile shear mode, is between about 5 and 55 psi. This level of adhesion is sufficient to prevent ingress of solvent solder, plating or coating materials but low enough to allow easy dry stripping mechanically or by hand.

대표청구항 ▼

A temporary mask composition for use in operations for manufacturing electrical or electronic parts, the composition comprising: (a) a radiation curable monomer formulation including a predominant amount of acrylic end capped prepolymer, (b) a radical photoinitiator, and (c) an adhesion reducing com

A temporary mask composition for use in operations for manufacturing electrical or electronic parts, the composition comprising: (a) a radiation curable monomer formulation including a predominant amount of acrylic end capped prepolymer, (b) a radical photoinitiator, and (c) an adhesion reducing component selected from the group consisting of polymeric plasticizers and acrylic esters of saturated fatty alcohols, vinyl esters of saturated fatty acids, monoacrylic esters of polyalkylene oxides, and mixtures thereof, in an amount sufficient to reduce the tensile shear adhesion of said composition when cured to the said electronic or electrical part to about 55 psi or less, said composition further characterized by sufficient cohesive strength to permit the cured composition to be peeled from said substrate mechanically or by hand in substantially one piece. A method of conformally coating circuit board having uncoated contact members thereon comprising applying a temporary mask composition as in claim 2 to said contact members; coating the entire board, with a radiation curable conformal coating formulation; irradiating the board to cure both the temporary mask and conformal coating formulations; and, removing the cured mask and the conformal coating overlying said mask by mechanically or hand peeling said mask without use of solvents or developer solutions.