초록 ▼

A composite structural material particularly intended for frictional and slide elements, consisting of a substrate such as a steel layer with a copper- or tin-containing intermediate layer, a tin- or copper-containing functional layer and, between these last two layers, a diffusion barrier layer pro

A composite structural material particularly intended for frictional and slide elements, consisting of a substrate such as a steel layer with a copper- or tin-containing intermediate layer, a tin- or copper-containing functional layer and, between these last two layers, a diffusion barrier layer protecting against diffusion of tin from the functional layer into the intermediate layer or back to the diffusion barrier layer. The diffusion barrier layer consists of a metallic material having a hexagonal crystal lattice, which material is applied by cathodic sputtering, forming a material structure that is densely packed in vacuo with a space filling by metal ions of above 70%. For the cathodic sputtering, conditions of plasma pressure and substrate temperature can be chosen so that recrystallization occurs simultaneously with the formation of the diffusion barrier layer; this makes it possible to achieve the densest hexagonal packing, with a space filling of up to 74%. Pure titanium is the preferred material for the diffusion barrier layer.

대표청구항 ▼

Composite structural material, especially for slide and friction members, comprising in combination a substrate layer; an intermediate layer on said substrate layer; a diffusion barrier layer of 0.5 to 5 um thickness on the intermediate layer; characterized in that a functional tin-based friction or

Composite structural material, especially for slide and friction members, comprising in combination a substrate layer; an intermediate layer on said substrate layer; a diffusion barrier layer of 0.5 to 5 um thickness on the intermediate layer; characterized in that a functional tin-based friction or slide layer constituted of material selected from the group consisting of tin-containing alloys is applied to the diffusion barrier layer, and further characterized in that the diffusion barrier layer (3) is a material having a hexagonal crystal lattice and is formed in vacuo by cathode sputtering and has a structure characterized by close packing of the voids of the lattice by metal ions, said attice having a space packing above 70% by said metal ions.