$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Connector assembly for a circuit board testing machine, a circuit board testing machine, and a method of testing a circu 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01R-031/28
  • H05K-001/02
출원번호 US-0116547 (1987-11-04)
우선권정보 DK-0002911 (1984-06-13)
발명자 / 주소
  • Boegh-Petersen Allan (Flongvaenget 14 Hedehusene
  • DK-2640 DKX)
인용정보 피인용 횟수 : 51  인용 특허 : 2

초록

A machine for testing a circuit board of an electrically insulating material includes circuit tracks of an electrically conductive material arranged on one or opposite side surfaces. At least one test surface is provided. The test surface or each of them defines a number of test points electrically

대표청구항

A method of testing a circuit board by means of a circuit board testing machine having a test surface including a number of test points electrically insulated relative to one another and arranged in a matrix configuration and for testing a circuit board of an electrically insulating material having

이 특허에 인용된 특허 (2)

  1. Walkup William B. (Amherst NH) Chow William (San Jose CA) Gillette Garry C. (Calabasas CA), Backplane-daughter board connector.
  2. Crepeau Philip C. (San Diego CA), Multilayer printed circuit board.

이 특허를 인용한 특허 (51)

  1. Ott Rainer,DEX, Adapter system for component assembly circuit boards, for use in a test device.
  2. Reinholz Robby (Berlin DEX), Adaptor device for an arrangement for testing printed-circuit boards.
  3. Tsui,Ching Man; Chow,Lap Kei; Ho,Hui Fai; Ngo,Cam Nguyen Ronald, Apparatus for supporting semiconductor devices during testing.
  4. DeHaven, Robert Keith; Wenzel, James F., Apparatus, method, and wafer used for testing integrated circuits formed on a product wafer.
  5. Frederick J. Holmes, Circuit board particularly adapted for use with high density test point in-circuit testers.
  6. Song, Yong-Jun; Huang, Yong-Zhao, Computer system on and off test apparatus.
  7. Cram, Daniel P., Conductive polymer contact system and test method for semiconductor components.
  8. Daniel P. Cram, Conductive polymer contact system and test method for semiconductor components.
  9. Perotti, Jose M.; Lucena, Angel; Ihlefeld, Curtis; Burns, Bradley; Bassignani, Karin E., Current signature sensor.
  10. Mohsen Amr M., Double-sided programmable interconnect structure.
  11. Prokopp Manfred,DEX ; Geier Rudi,DEX ; Goldschmitt Volker,DEX, Electric circuit board tester.
  12. Shimoda Sugiro,JPX ; Kimura Kiyoshi,JPX, Electric resistance measuring apparatus and method for circuit board.
  13. Dickson, Mark A.; Collins, Edward J.; Jukna, Robert Gregory, Flexible test fixture.
  14. Oster Melvin G. ; Fuchs Brian K. ; Reid Kenneth, Generic interface test adapter.
  15. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yaun, High density cantilevered probe for electronic devices.
  16. Mohsen Amr M., Interconnect substrate with circuits for field-programmability and testing of multichip modules and hybrid circuits.
  17. Gokan, Manabu; Nakahashi, Akihisa; Hirose, Takayuki; Kasai, Yoko; Tanda, Kohichi, Layered electronic circuit device.
  18. Cases, Moises; Mutnury, Bhyrav M.; Rodrigues, Terence, Locating short circuits in printed circuit boards.
  19. Tuttle, Mark E.; Lake, Rickie C.; Schicht, Steven F.; Tuttle, John R., Method and apparatus for communicating with RFID devices coupled to a roll of flexible material.
  20. Konrath, Willibald; Schmelcher, Haiko, Method for manufacturing a high-frequency assembly.
  21. DeHaven Robert Keith (Austin TX) Wenzel James F. (Austin TX), Method for manufacturing a stimulus wafer for use in a wafer-to-wafer testing system to test integrated circuits located.
  22. Fredrickson Toby Alan, Method for preventing condensation on handler board during semiconductor device testing.
  23. Robert Keith DeHaven ; James F. Wenzel, Method for testing a product integrated circuit wafer using a stimulus integrated circuit wafer.
  24. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out.
  25. Frisch Arnold M., Multi-chip module development substrate.
  26. Lee, Hung Kwang; Lee, Sai Mun; Leong, Yat Kheng, Optical finger navigation device with integrated tactile switch.
  27. Tomio Suzuki JP; Tadashi Otagiri JP; Satoru Kawai JP; Shuhei Ishikawa JP, Printed circuit board material and method of manufacturing board material and intermediate block body for board material.
  28. Bogatin,Eric L.; Henry,David W.; Marx,Donald A., Probe array wafer.
  29. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Probe card assembly and kit, and methods of making same.
  30. Mathieu, Gaetan L.; Eldridge, Benjamin N.; Grube, Gary W., Probe card assembly having an actuator for bending the probe substrate.
  31. Moore, Scott E., RFID material tracking method and apparatus.
  32. Moore, Scott E., RFID material tracking method and apparatus.
  33. Fredrickson Toby Alan, Semiconductor device tester-to-handler Interface board with large test area.
  34. Hubner Holger,DEX ; Weber Werner,DEX ; Koppe Siegmar,DEX ; Klose Helmut,DEX, Semiconductor testing apparatus.
  35. Nakata Yoshirou,JPX ; Yamada Toshio,JPX ; Fujiwara Atsushi,JPX ; Miyanaga Isao,JPX ; Hashimoto Shin,JPX ; Uraoka Yukiharu,JPX ; Okuda Yasushi,JPX ; Hatada Kenzou,JPX, Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe t.
  36. Frake, Robert K.; Culbertson, David P.; Harvey, Daniel D., Sensor adaptor circuit housing incapsulating connection of an input connector with a wire.
  37. Culbertson, David P.; Harvey, Daniel D.; Frake, Robert K., Temperature sensor assembly and method of manufacturing thereof.
  38. Cram,Daniel P., Test method for semiconductor components using anisotropic conductive polymer contact system.
  39. Cram,Daniel P., Test method for semiconductor components using conductive polymer contact system.
  40. Barabi Nasser, Test socket for an IC device.
  41. Mark E. Tuttle, Testing and burn-in of IC chips using radio frequency transmission.
  42. Tuttle Mark E., Testing and burn-in of IC chips using radio frequency transmission.
  43. Akram Salman, Testing system for evaluating integrated circuits, a burn-in testing system, and a method for testing an integrated circuit.
  44. Akram Salman, Testing system for evaluating integrated circuits, a burn-in testing system, and a method for testing an integrated circuit.
  45. Salman Akram, Testing system for evaluating integrated circuits, a burn-in testing system, and a method for testing an integrated circuit.
  46. Akram, Salman, Testing system for evaluating integrated circuits, a testing system, and a method for testing an integrated circuit.
  47. Salman Akram, Testing system for evaluating integrated circuits, a testing system, and a method for testing an integrated circuit.
  48. Van Loan David R. (Diamond Bar CA) Swart Mark A. (Upland CA), Translator fixture with module for expanding test points.
  49. James M. Forbis ; Dennis J. Cahalan, Vertical probe card for attachment within a central corridor of a magnetic field generator.
  50. Swart, Mark A.; Snyder, Kenneth R., Wiring board for testing loaded printed circuit board.
  51. Swart, Mark A.; Snyder, Kenneth R.; Koolis, Stephen J.; Tackett, Douglas W., Wiring board for testing loaded printed circuit board.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로